Search Results - "Clausner, Andre"

Microcracking in On-Chip Interconnect Stacks: FEM Simulation and Concept for Fatigue Test by Weitz, Stefan, Clausner, André, Zschech, Ehrenfried

“…The semiconductor industry is continuing the scaling down of both device and on-chip interconnect features, for performance and economic reasons. This trend…”
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Determination of yield stress from nano-indentation experiments by Clausner, André, Richter, Frank

“…The aim of this paper is to investigate the possibilities of getting information on the initial yield stress Y from nano-indentation experiments with sharp…”
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In-situ X-ray tomographic imaging and controlled steering of microcracks in 3D nanopatterned structures by Kutukova, Kristina, Gluch, Jürgen, Kraatz, Matthias, Clausner, André, Zschech, Ehrenfried

“…[Display omitted] •A novel technique to monitor and control the microcracking process in specially designed 3D nanopatterned structures in real time is…”
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BEoL stack robustness investigations utilizing Cu-pillar immobilization and micromechanical loading methods by Silomon, Jendrik, Chimeg, Dulguun, Gluch, Jürgen, Clausner, André, Zschech, Ehrenfried

“…Under harsh application conditions in fields such as aerospace or automotive, it is crucial that the mechanical robustness of microchip components is ensured…”
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Crack identification and evaluation in BEoL stacks of two different samples utilizing acoustic emission testing and nano X-ray computed tomography by Silomon, Jendrik, Gluch, Jürgen, Clausner, André, Paul, Jens, Zschech, Ehrenfried

“…A novel approach is presented to evaluate the mechanical stability of back end of line (BEoL) stacks. A SRAM test vehicle manufactured in 28 nm technology with…”
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Micromechanical BEoL robustness evaluation methods enabling loading condition customization and acoustic emission damage monitoring by Silomon, Jendrik, Chimeg, Dulguun, Clausner, André, Zschech, Ehrenfried

“…For micromechanical robustness evaluation methods, it is advantageous if the mechanical loading conditions applied can be controlled as precisely as possible…”
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Usage of the concept of the effectively shaped indenter for the determination of yield stress from Berkovich nano-indentation experiments by Clausner, André, Richter, Frank

“…Determining the yield stress Y in addition to the indentation modulus EIT and hardness HIT from Berkovich nano-indentation experiments would widely open up…”
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Laboratory High-Contrast X-ray Microscopy of Copper Nanostructures Enabled by a Liquid-Metal-Jet X-ray Source by Kutukova, Kristina, Lechowski, Bartlomiej, Grenzer, Joerg, Krueger, Peter, Clausner, André, Zschech, Ehrenfried

“…High-resolution imaging of Cu/low-k on-chip interconnect stacks in advanced microelectronic products is demonstrated using full-field transmission X-ray…”
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Fundamental limitations at the determination of initial yield stress using nano-indentation with spherical tips by Clausner, André, Richter, Frank

“…Nano-indentation with spherical indenters can be used to determine the local initial yield stress with an approach consisting of i) detection of the onset of…”
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Fracture Behavior of a 2D Imine‐Based Polymer by Zhang, Bowen, Liu, Xiaohui, Bodesheim, David, Li, Wei, Clausner, André, Liu, Jinxin, Jost, Birgit, Dianat, Arezoo, Dong, Renhao, Feng, Xinliang, Cuniberti, Gianaurelio, Liao, Zhongquan, Zschech, Ehrenfried

“…2D polymers have emerged as a highly promising category of nanomaterials, owing to their exceptional properties. However, the understanding of their fracture…”
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Determination of the Filler Distribution in an Epoxy Molding Compound Using High-Resolution X-Ray Computed Tomography by Topal, Emre, Gluch, Jurgen, Clausner, Andre, Cardoso, Andre, Zschech, Ehrenfried

“…In this article, the filler distribution in an epoxy molding compound (EMC), used in IC packaging, is studied across a wafer using high-resolution X-ray…”
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Laboratory X-ray Microscopy of 3D Nanostructures in the Hard X-ray Regime Enabled by a Combination of Multilayer X-ray Optics by Lechowski, Bartlomiej, Kutukova, Kristina, Grenzer, Joerg, Panchenko, Iuliana, Krueger, Peter, Clausner, Andre, Zschech, Ehrenfried

“…High-resolution imaging of buried metal interconnect structures in advanced microelectronic products with full-field X-ray microscopy is demonstrated in the…”
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Numerical and Experimental Study of the Mechanical Response of Diatom Frustules by Topal, Emre, Rajendran, Hariskaran, Zgłobicka, Izabela, Gluch, Jürgen, Liao, Zhongquan, Clausner, André, Kurzydłowski, Krzysztof Jan, Zschech, Ehrenfried

“…Diatom frustules, with their hierarchical three-dimensional patterned silica structures at nano to micrometer dimensions, can be a paragon for the design of…”
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Anisotropy of Mechanical Properties of Pinctada margaritifera Mollusk Shell by Strąg, Martyna, Maj, Łukasz, Bieda, Magdalena, Petrzak, Paweł, Jarzębska, Anna, Gluch, Jürgen, Topal, Emre, Kutukova, Kristina, Clausner, André, Heyn, Wieland, Berent, Katarzyna, Nalepka, Kinga, Zschech, Ehrenfried, Checa, Antonio G, Sztwiertnia, Krzysztof

“…The mechanical properties such as compressive strength and nanohardness were investigated for mollusk shells. The compressive strength was evaluated through a…”
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Morphology and Mechanical Properties of Fossil Diatom Frustules from Genera of Ellerbeckia and Melosira by Li, Qiong, Gluch, Jürgen, Liao, Zhongquan, Posseckardt, Juliane, Clausner, André, Łępicka, Magdalena, Grądzka-Dahlke, Małgorzata, Zschech, Ehrenfried

“…Fossil frustules of Ellerbeckia and Melosira were studied using laboratory-based nano X-ray tomography (nano-XCT), transmission electron microscopy (TEM) and…”
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Fully Printed Zinc Oxide Electrolyte-Gated Transistors on Paper by Carvalho, José Tiago, Dubceac, Viorel, Grey, Paul, Cunha, Inês, Fortunato, Elvira, Martins, Rodrigo, Clausner, Andre, Zschech, Ehrenfried, Pereira, Luís

“…Fully printed and flexible inorganic electrolyte gated transistors (EGTs) on paper with a channel layer based on an interconnected zinc oxide (ZnO)…”
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In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices by Liao, Zhongquan, Gall, Martin, Yeap, Kong Boon, Sander, Christoph, Clausner, André, Mühle, Uwe, Gluch, Jürgen, Standke, Yvonne, Aubel, Oliver, Beyer, Armand, Hauschildt, Meike, Zschech, Ehrenfried

“…The time-dependent dielectric breakdown (TDDB) in on-chip interconnect stacks is one of the most critical failure mechanisms for microelectronic devices. The…”
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Crack Identification in BEoL Stacks Using Acoustic Emission Testing and Nano X-ray Computed Tomography by Silomon, Jendrik, Gluch, Jurgen, Clausner, Andre, Paul, Jens, Zschech, Ehrenfried

“…A novel approach is presented to evaluate the mechanical stability of back end of line (BEoL) stacks. A SRAM test vehicle manufactured in 28 nm technology with…”
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Utilizing Acoustic Emission Signals to Evaluate BEoL Stack Damages of Two Different Sample Systems Caused by Cu-Pillar Shear-Off by Silomon, Jendrik, Clausner, Andre, Zschech, Ehrenfried

“…In this work, a novel approach is introduced to identify and categorize damages occurring in the back end of line (BEoL) stack utilizing acoustic emission (AE)…”
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The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications by Hein, Verena, Weide-Zaage, Kirsten, Clausner, Andre

“…The combination of analog/mixed-signal, high-voltage and embedded non-volatile memory options with sensor and actuator integration is still common in…”
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