Search Results - "Chun, Junhyun"
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A 16Gb/s/pin 8Gb GDDR6 DRAM with bandwidth extension techniques for high-speed applications
Published in 2018 IEEE International Solid - State Circuits Conference - (ISSCC) (01-02-2018)“…Recently the demand for high-bandwidth graphic DRAM, for game consoles and graphic cards, has dramatically increased due to the development of virtual reality,…”
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A 16Gb 1.2V 3.2Gb/s/pin DDR4 SDRAM with improved power distribution and repair strategy
Published in 2018 IEEE International Solid - State Circuits Conference - (ISSCC) (01-02-2018)“…Advances in silicon technology bring high-performance mobile devices and networks that connect people all over the world. In the meantime, data centers with…”
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Conference Proceeding -
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A Compact Resistor-Based CMOS Temperature Sensor With an Inaccuracy of 0.12 °C (3[Formula Omitted]) and a Resolution FoM of 0.43 pJ[Formula Omitted]K[Formula Omitted] in 65-nm CMOS
Published in IEEE journal of solid-state circuits (01-12-2018)“…This paper presents a compact resistor-based CMOS temperature sensor intended for dense thermal monitoring. It is based on an [Formula Omitted] poly-phase…”
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Journal Article -
4
A 1.3-4-GHz Quadrature-Phase Digital DLL Using Sequential Delay Control and Reconfigurable Delay Line
Published in IEEE journal of solid-state circuits (01-06-2021)“…A 1.3-4-GHz quadrature-phase digital delay-locked loop (DDLL) with sequential delay control and a reconfigurable delay line is designed using a 28 nm CMOS…”
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Journal Article -
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A 1ynm 1.25V 8Gb, 16Gb/s/pin GDDR6-based Accelerator-in-Memory supporting 1TFLOPS MAC Operation and Various Activation Functions for Deep-Learning Applications
Published in 2022 IEEE International Solid- State Circuits Conference (ISSCC) (20-02-2022)“…With advances in deep-neural-network applications the increasingly large data movement through memory channels is becoming inevitable: specifically, RNN and…”
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A 1ynm 1.25V 8Gb 16Gb/s/Pin GDDR6-Based Accelerator-in-Memory Supporting 1TFLOPS MAC Operation and Various Activation Functions for Deep Learning Application
Published in IEEE journal of solid-state circuits (01-01-2023)“…In this article, a 1.25-V 8-Gb, 16-Gb/s/pin GDDR6-based accelerator-in-memory (AiM) is presented. A dedicated command (CMD) set for deep learning (DL) is…”
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Journal Article -
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A Compact Resistor-Based CMOS Temperature Sensor With an Inaccuracy of 0.12 °C (3 \sigma ) and a Resolution FoM of 0.43 pJ \cdot K ^ in 65-nm CMOS
Published in IEEE journal of solid-state circuits (01-12-2018)“…This paper presents a compact resistor-based CMOS temperature sensor intended for dense thermal monitoring. It is based on an <inline-formula> <tex-math…”
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Journal Article -
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A 1.1-V 10-nm Class 6.4-Gb/s/Pin 16-Gb DDR5 SDRAM With a Phase Rotator-ILO DLL, High-Speed SerDes, and DFE/FFE Equalization Scheme for Rx/Tx
Published in IEEE journal of solid-state circuits (01-01-2020)“…A 1.1-V 6.4-Gb/s/pin 16-Gbit DDR5 is presented in 10-nm class CMOS technology. Various functions and circuits' techniques are newly adopted to improve…”
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9
A 24-Gb/s/Pin 8-Gb GDDR6 With a Half-Rate Daisy-Chain-Based Clocking Architecture and I/O Circuitry for Low-Noise Operation
Published in IEEE journal of solid-state circuits (01-01-2022)“…The demand for high-performance graphics systems used for artificial intelligence, cloud game, and virtual reality continues to grow; this trend requires…”
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Journal Article -
10
Process-Portable and Programmable Layout Generation of Digital Circuits in Advanced DRAM Technologies
Published in 2021 Design, Automation & Test in Europe Conference & Exhibition (DATE) (01-02-2021)“…This paper introduces a physical layout design methodology that produces DRC-clean, area-efficient, and programmable layouts of digital circuits in advanced…”
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Conference Proceeding -
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A 192-Gb 12-High 896-GB/s HBM3 DRAM with a TSV Auto-Calibration Scheme and Machine-Learning-Based Layout Optimization
Published in 2022 IEEE International Solid- State Circuits Conference (ISSCC) (20-02-2022)“…Ever since the introduction of high bandwidth memory (HBM DRAM) and its succeeding line-ups, HBM DRAM has been heralded as a prominent solution to tackle the…”
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Conference Proceeding -
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A 0.53pJK2 7000μm2 resistor-based temperature sensor with an inaccuracy of ±0.35°C (3σ) in 65nm CMOS
Published in 2018 IEEE International Solid - State Circuits Conference - (ISSCC) (01-02-2018)“…In microprocessors and DRAMs, on-chip temperature sensors are essential components, ensuring reliability by monitoring thermal gradients and hot spots. Such…”
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13
25.1 A 24Gb/s/pin 8Gb GDDR6 with a Half-Rate Daisy-Chain-Based Clocking Architecture and IO Circuitry for Low-Noise Operation
Published in 2021 IEEE International Solid- State Circuits Conference (ISSCC) (13-02-2021)“…The demand for high-performance graphics systems used for artificial intelligence continues to grow; this trend requires graphics systems to achieve ever…”
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Conference Proceeding -
14
23.4 A 512GB 1.1V Managed DRAM Solution with 16GB ODP and Media Controller
Published in 2019 IEEE International Solid- State Circuits Conference - (ISSCC) (01-02-2019)“…While the fast-growing big-data and cloud-computing markets are driving demand for server-oriented high-capacity memory, the high costs and high-power…”
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Conference Proceeding -
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23.2 A 1.1V 1ynm 6.4Gb/s/pin 16Gb DDR5 SDRAM with a Phase-Rotator-Based DLL, High-Speed SerDes and RX/TX Equalization Scheme
Published in 2019 IEEE International Solid- State Circuits Conference - (ISSCC) (01-02-2019)“…Required system performance for the computing and server, cost and power forces DRAM to improve its bandwidth, capacity and power. DDR5 SDRAM has been proposed…”
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Conference Proceeding -
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22.3 A 128Gb 8-High 512GB/s HBM2E DRAM with a Pseudo Quarter Bank Structure, Power Dispersion and an Instruction-Based At-Speed PMBIST
Published in 2020 IEEE International Solid- State Circuits Conference - (ISSCC) (01-02-2020)“…There is enormous demand for high-bandwidth DRAM: in application such as HPC, graphics, high-end server and artificial intelligence. HBM DRAM was developed [1]…”
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17
Memory-Centric Computing with SK Hynix's Domain-Specific Memory
Published in 2023 IEEE Hot Chips 35 Symposium (HCS) (27-08-2023)Get full text
Conference Proceeding -
18
System Architecture and Software Stack for GDDR6-AiM
Published in 2022 IEEE Hot Chips 34 Symposium (HCS) (21-08-2022)“…This poster presents system architecture, software stack, and performance analysis for SK hynix's very first GDDR6-based processing-in-memory (PIM) product…”
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Conference Proceeding