Search Results - "Chok, K.L."

Stress-induced voiding in multi-level copper/low-k interconnects by Lim, Y.K., Lim, Y.H., Seet, C.S., Zhang, B.C., Chok, K.L., See, K.H., Lee, T.J., Hsia, L.C., Pey, K.L.

“…Stress-induced voiding phenomenon in vias at different metallization layers was studied in details with stress temperatures ranging from 150/spl deg/C to…”
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A technology development SRAM approach with DFM considerations by Craig, M., Deshazo, D., Prior, S., Tranchina, B., Erhart, M., Mahant-Shetti, S.S., Taylor, R., Xing, Y., Quek, E., Chok, K.L., Kamat, N., Redford, M.

“…A technology development SRAM (TDSRAM/sup TM/) has been highly effective in rapid process technology development, debug, and yield ramp on an advanced CMOS,…”
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