Development of Wafer-Type Plasma Monitoring Sensor with Automated Robot Arm Transfer Capability for Two-Dimensional In Situ Processing Plasma Diagnosis

In this work, we propose our newly developed wafer-type plasma monitoring sensor based on a floating-type double probe method that can be useful for two-dimensional (2D) in situ plasma diagnosis within a semiconductor processing chamber. A key achievement of this work is the first realization of an...

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Bibliographic Details
Published in:	Sensors (Basel, Switzerland) Vol. 24; no. 6; p. 1786
Main Authors:	Park, Haewook, Kim, Juhyun, Cho, Sungwon, Kim, Kyunghyun, Jang, Sungho, Choi, Younsok, Lee, Hohyun
Format:	Journal Article
Language:	English
Published:	Switzerland MDPI AG 10-03-2024 MDPI
Subjects:	Automation Comparative analysis Electrons Evaluation in situ Plasma plasma density plasma diagnosis Preventive maintenance processing chamber Robots semiconductor manufacturing Sensors wafer-type sensor tool-to-tool matching (TTTM) plasma density plasma diagnosis semiconductor manufacturing wafer-type sensor in situ processing chamber
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Summary:	In this work, we propose our newly developed wafer-type plasma monitoring sensor based on a floating-type double probe method that can be useful for two-dimensional (2D) in situ plasma diagnosis within a semiconductor processing chamber. A key achievement of this work is the first realization of an ultra-thin plasma monitoring sensor with a system thickness of ~1.4 mm, which supports a fully automated robot arm transfer capability for in situ plasma diagnosis. To the best of our knowledge, it is the thinnest accomplishment among all wafer-type plasma monitoring sensors. Our proposed sensor is assembled with two Si wafers and SiO -based probes; accordingly, it makes it possible to monitor the actual dynamics of processing plasmas under electrostatic chucking (ESC) conditions. Also, it allows for the prevention of chamber contamination issues after continuously exposing the radio frequency (RF) to various processing gases. Using a test-bed chamber, we successfully demonstrated the feasibility and system performance of the proposed sensor, including robot arm transfer capability, vacuum and thermal stress durability, and data integrity and reproducibility. Consequently, compared with the conventional plasma diagnostic tools, we expect that our proposed sensor will be highly beneficial for tool-to-tool matching (TTTM) and/or for studying various plasma-related items by more accurately providing the parameters of processing plasmas, further saving both time and manpower resources required for preventive maintenance (PM) routines as well.
Bibliography:	ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 These authors contributed equally to this work.
ISSN:	1424-8220 1424-8220
DOI:	10.3390/s24061786