Search Results - "Choe, Chanyang"

Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature by Chen, Chuantong, Choe, Chanyang, Kim, Dongjin, Suganuma, Katsuaki

“…Ag sinter joining technology has gained increasing attention for its excellent thermal and mechanical properties, especially for high-temperature applications…”
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Bonding technology based on solid porous Ag for large area chips by Chen, Chuantong, Noh, Seungjun, Zhang, Hao, Choe, Chanyang, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

“…A bonding technology is introduced by using surface polished porous Ag in die-attachment structure. Bonding strength did not change much as the chip size…”
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Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni⁻P Layers for High-Temperature Applications of Power Device Modules by Choe, Chanyang, Chen, Chuantong, Noh, Seungjun, Suganuma, Katsuaki

“…The thermal cycling life of direct bonded aluminum (DBA) and active metal brazing (AMB) substrates with two types of plating-Ni electroplating and Ni⁻P…”
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Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro by Chen, Chuantong, Choe, Chanyang, Kim, Dongjin, Zhang, Zheng, Long, Xu, Zhou, Zheng, Wu, Fengshun, Suganuma, Katsuaki

“…This study systematically investigates the effect of oxygen on the microstructural evolution as well as the macro/micromechanical characterization of Ag sinter…”
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Low-stress design of bonding structure and its thermal shock performance (− 50 to 250 °C) in SiC/DBC power die-attached modules by Chen, Chuantong, Choe, Chanyang, Zhang, Zheng, Kim, Dongjin, Suganuma, Katsuaki

“…Low-stress design of bonding technology with a sandwich structure of sintered Ag and tungsten (W) thin film was developed for SiC power die-attached modules…”
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Ag particles for sinter bonding: Flakes or spheres? by Yeom, Jeyun, Nagao, Shijo, Chen, Chuantong, Sugahara, Tohru, Zhang, Hao, Choe, Chanyang, Li, Cai-Fu, Suganuma, Katsuaki

“…This paper examines a unique mechanism in Ag micrometer flake sintering which reveals that self-produced Ag nanoparticles, created by the heating of the…”
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The Ʃ3 twin dependence of thermo-mechanical fatigue of a polycrystalline high-purity Cu film by Kim, Dongjin, Choe, Chanyang, Chen, Chuantong, Lee, Sangmin, Lee, Seung-Joon, Park, Semin, Noh, Seungjun, Suganuma, Katsuaki

“…[Display omitted] •Fatigue characteristics of high-purity Cu films from RT to 200 °C were investigated.•TMF characteristics of high-purity Cu were…”
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Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver by Choe, Chanyang, Noh, Seungjun, Chen, Chuantong, Kim, Dongjin, Suganuma, Katsuaki

“…Silver sinter paste has been considered as promising joint materials for SiC and GaN power modules due to its excellent thermo-stability and high…”
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Low temperature low pressure solid-state porous Ag bonding for large area and its high-reliability design in die-attached power modules by Chen, Chuantong, Kim, Dongjin, Wang, Zhenghong, Zhang, Zheng, Gao, Yue, Choe, Chanyang, Suganuma, Katsuaki

“…Solid-state porous Ag was utilized to achieve interface bonding under low temperature and low-pressure for large area, high-reliability designs for high…”
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Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure by Kim, Dongjin, Chen, Chuantong, Suetake, Aiji, Choe, Chanyang, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki

“…GaN die-attach/DBC substrate joint structure bonded by Ag sinter paste/W thin film/Ag sinter paste sandwich die-attached layer was designed and its…”
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Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors by Noh, Seungjun, Choe, Chanyang, Chen, Chuantong, Zhang, Hao, Suganuma, Katsuaki

“…This study reports a novel high-temperature and high-current wire interconnection by printing Ag sinter paste for WBG semiconductor power devices. The Ag…”
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Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests by Choe, Chanyang, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki

“…In the article, acoustic emission (AE) was applied to monitor the wear-out failure in discrete SiC Schottky barrier diodes devices with a Ag sinter die attach…”
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Improvement of the Bond Strength of Ag Sinter-Joining on Electroless Ni/Au Plated Substrate by a One-Step Preheating Treatment by Chen, Chuantong, Zhang, Zheng, Choe, Chanyang, Kim, Dongjin, Noh, Seungjun, Sugahara, Toru, Suganuma, Katsuaki

“…Ag sinter-joining technology has become one of the leading candidates to replace conventional high-Pb soldering technology for wide bandgap (WBG) power…”
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Bonding technology using cold-rolled Ag sheet in die-attachment applications by Seungjun Noh, Chanyang Choe, Chuantong Chen, Hao Zhang, Suganuma, Katsuaki

“…This work introduce a solid-state bonding technology, which uses cold-rolled Ag sheet as a bonding material for die-attachment applications. The process of…”
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Thermal effect on material properties of sintered porous silver during high temperature ageing by Chanyang Choe, Seungjun Noh, Chuantong Chen, Ishina, Toshiyuki, Nagao, Shijo, Suganuma, Katsuaki

“…Thermal ageing of micro-porous sintered silver was examined under high temperature exposure. Silver sinter paste was printed in a shape of a tensile specimen…”
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Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module by Kim, Dongjin, Lee, Byeongsoo, Lee, Tae-Ik, Noh, Seungjun, Choe, Chanyang, Park, Semin, Kim, Min-Su

“…This study investigated the power cycling performance on a transfer-molded power module with Cu clip bonding for the next-generation green automotive…”
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Necking growth and mechanical properties of sintered Ag particles with different shapes under air and N.sub.2 atmosphere by Chen, Chuantong, Yeom, Jeyun, Choe, Chanyang, Liu, Guiming, Gao, Yue, Zhang, Zheng, Zhang, Bowen

“…Ag sinter joint is gaining greater attention for use with wide-bandgap die attach modules in high-temperature applications. In this study, we have investigated…”
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Necking growth and mechanical properties of sintered Ag particles with different shapes under air and N2 atmosphere by Chen, Chuantong, Yeom, Jeyun, Choe, Chanyang, Liu, Guiming, Gao, Yue, Zhang, Zheng, Zhang, Bowen, Kim, Dongjin, Suganuma, Katsuaki

“…Ag sinter joint is gaining greater attention for use with wide-bandgap die attach modules in high-temperature applications. In this study, we have investigated…”
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Effect of oxygen on Ag sintering technology with low temperature pressureless by Chen, Chuantong, Choe, Chanyang, Zhang, Zheng, Nagao, Shijo, Suganuma, Katsuaki

“…Ag sintering technology has received more and more attention to achieve the high-temperature applications above 250°C due to its super physical properties in…”
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