Search Results - "Chockalingam, Ramasamy"

Use of Machine Learning to Predict Onset of NAFLD in an All-Comers Cohort—Development and Validation in 2 Large Asian Cohorts by Lim, Daniel Yan Zheng, Chung, Goh Eun, Cher, Pei Hua, Chockalingam, Ramasamy, Kim, Won, Tan, Chee Kiat

“…Nonalcoholic fatty liver disease (NAFLD) is one of the most common liver diseases. There are no universally accepted models that accurately predict time to…”
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Sa1562 PERSONALIZED TIME TO ONSET OF NONALCOHOLIC FATTY LIVER DISEASE: DEVELOPMENT AND INDEPENDENT VALIDATION OF MACHINE LEARNING SURVIVAL MODELS IN TWO LARGE ASIAN COHORTS by Lim, Daniel Y., Chung, Goh-Eun, Cher, Pei-Hua, Jnr, Ramasamy Chockalingam, Kim, Won, Tan, Chee-Kiat

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A study on the nitridation of barrier liner contribution to galvanic corrosion of copper bondpad by Li, Xiaodong, Chockalingam, Ramasamy, Ang, Poh Chuan, Neo, Wah Peng, Tan, Juan Boon

“…Galvanic corrosion of copper bondpad is studied with various copper barrier liner compositions in a unbiased highly accelerated stress test (uhast) condition…”
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Optimizing Interconnects RC Variability for Automotive Manufacturing using Novel Advanced Process Control by Yew, Kwang Sing, Jan Khor, Ee, Lee, Choon Gay, Chockalingam, Ramasamy, Tan, Juan Boon

“…Control of variation in interconnects resistance and capacitance (RC) model due to variability in semiconductor manufacturing is extremely challenging,…”
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Interconnects Variability Control for High Voltage Applications by Yew, Kwang Sing, Jiang, Yi, Yi, Wanbing, Chockalingam, Ramasamy, Ong, Ran Xing, Li, Bo, Tan, Juan Boon

“…Limiting the minimum spacing design rule of intra-metal lines and skipping the inter-metal layer in interconnects for more oxide spacing in order to improve…”
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Analysis of Extreme Pattern Density and Interconnects Routing Impacts on Via Open by Jiang, Yi, Yew, Kwang Sing, Lin, Kemao, Cheng, Weining, Hsieh, Curtis, Ong, Jonathan, Yi, Wanbing, Chockalingam, Ramasamy, Siah, Soh Yun, Boon Tan, Juan

“…Two phenomena of dual damascene via open in extremely low local metal pattern density region, and when connected through a narrow width metal line to a big pad…”
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Interconnects Electrical Parametric Variability Control for Automotive Manufacturing by Yew, Kwang Sing, Chockalingam, Ramasamy, Lee, Choon Gay, Goh, Jasper, Chen, Baozhuo, Guan, Xiaochong, Hsu, Rex, Tan, Juan Boon

“…The control of interconnects resistance, intra- and inter-capacitance (RC) variations in order to meet the stringent automotive sigma requirements is an…”
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Application of Nano-indentation method to characterize adhesion strength of polyimide film by LI, Xiaoxuan, ZHU, Xintong, LIU, Yi, LI, Xiaodong, CHOCKALINGAM, Ramasamy, NISTALA, Ramesh Rao, Qiang MO, Zhi

“…Thick polyimide layer has been used as buffer layer to absorb stress imposed by molding compounds for many years. This paper studied the adhesion strength of…”
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A Study of Pattern Density and Process Variations Impact on the Reliability Performance of Multi-Level Capacitance Structure in Low-k Copper Interconnects by Chen, Qian, Tan, Juan Boon, Xie, Lanfei, Chockalingam, Ramasamy, Eng, Chee Wee, Katakamsetty, Ushasree, Li, Pinghui, Chen, Li Han, Guan, Xiaochong, Tan, Soon Yoeng

“…Multi-level Metal-Oxide-Metal Capacitors (MOM) is widely utilized in CMOS process. It is an inter-digitated three dimensional multi-level finger capacitor…”
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A Study on Effect of Top and Bottom Metal Plates on Stress Induced Voiding of Nose Type Single Via Structure by Kuppar, Aniketha Udupa, Zeng, Xu, Ng, Chai Wah, Lim, YH James, Yao, H. Walter, Khor, EE jan, Chockalingam, Ramasamy, Tan, Juan Boon

“…Stress Induced Voiding of a nose type Single Via is studied. Typical nose type single via stress voiding structure has top and bottom wide metal plates…”
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