Search Results - "Chippalkatti, Vinod"

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    Efficient Test and Characterization of Space Transmit-Receive Modules Using Scalable and Multipurpose Automated Test System by Chippalkatti, Vinod S, Biradar, Rajashekhar C, Shenoy, Venkatesh, Udayakumar, P

    Published in Journal of electronic testing (01-08-2023)
    “…Transmit-Receive (TR) modules are essential requirements of a space borne Synthetic Aperture Radar (SAR) used in the earth observation satellites with…”
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    Journal Article
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    Modeling, verification and optimization of LTCC based TR module: Dynamic behavioral performance in satellite radar payload by Chippalkatti, Vinod S., Biradar, Rajashekhar C., Chandrashekar, B.K., Joteppa, Santosh

    “…Transmit Receive (TR) modules are the hardcore of the radar payload, which has day-night and all weather imaging capability in earth observation satellites…”
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    Journal Article
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    Enhanced reliability considerations for manufacturability of space TR modules of Radar Imaging Payload by Chippalkatti, Vinod S, Biradar, Rajashekhar C

    “…The key element of Radar Imaging payload of a satellite is the Synthetic Aperture Radar. Transmit Receive module forms the major module of such an active…”
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    Conference Proceeding
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    Technology Trends in Transmit Receive Modules for Synthetic Aperture Radar Satellites by Chippalkatti, Vinod S, Biradar, Rajashekhar C, Rana, S S

    “…This survey paper provides an overview of the current activities and progress towards Transmit Receive Module technology developments for the Synthetic…”
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    Conference Proceeding
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    Thermo-Mechanical load Influence on Electronics Packages by Chippalkatti, Vinod S, Biradar, Rajashekhar C, Chandrashekar, Bk, Joteppa, Santosh

    “…This paper proposes the simulation-based behavioral study of electronic components of a DC-DC converter for thermo-mechanical loads to build more reliable…”
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    Conference Proceeding
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    Quality and Reliability Considerations of Earth Observation Payload Electronics for LEO satellite by Chippalkatti, Vinod S, Biradar, Rajashekhar C, Kolli, Poojitha, Supriya, G R

    “…Space environment is one of the hardest to replicate apart from being the harshest one for electronics to operate. Several electronics subsystems co-exist in a…”
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    Conference Proceeding
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    Evaluation of Contact Conductance and its Importance in Electronic Packaging by Chippalkatti, Vinod S, Biradar, Rajashekhar C, Suresha, K R, Joteppa, Santosh

    “…This paper epitomize the experimental analysis carried out to define the values of thermal contact conductance at the interface of the electronic components…”
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    Conference Proceeding
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    High density packaging techniques for miniaturization of satellite RF and microwave subsystems: Attachments, Interconnections and Hermetic sealing by Chippalkatti, Vinod S, Biradar, R C, Shivarudraswami, Y, Mathan, N

    “…Electronics packaging is identified as the most critical step for the development of modules and subsystems operating at higher frequencies. The RF and…”
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    Conference Proceeding
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    Recent Technology Trends in Satellite Communication Subsystems by Chippalkatti, Vinod S, Biradar, Rajashekhar C, Rana, S S

    “…A satellite is a complex arrangement of payloads, sensors, solar panels, antennae, and several electronics packages, all of which must coexist in a confined…”
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    Conference Proceeding
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    Power factor correction using Boost converter operating in CCM for front-end AC to DC conversion by Babu, Kotari Sri Harsha, Holde, Ramesh, Singh, Bhoopendra Kumar, Chippalkatti, Vinod S

    “…Most of the Industrial applications require an AC-DC conversion followed by SMPS converters for regulated outputs. Power factor plays a major role in AC-DC…”
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    Conference Proceeding
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    Two Switching Pulse Based Hysteresis Control Circuit for Active Clamp Reset Forward Converter by Gagan, MN, Singh, Bhoopendra kumar, Chippalkatti, Vinod S

    “…Forward topology is used to build a converter which supplies higher power. The Hysteresis control technique is an evolving method to control the output ripple…”
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    Conference Proceeding
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    Design and implementation of quad-output flyback converter for space applications by Chaitanya Reddy, T. S. L. K., Usha, A., Jagadeesh, S., Singh, Bhoopendra Kumar, Chippalkatti, Vinod S.

    “…This work is focused on design, analysis and implementation of current mode controlled, quad-output flyback converter. The design of proposed converter…”
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    Conference Proceeding
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    Test automation techniques to characterize multiband transmit receive modules in satellite payload subsystems by Chippalkatti, Vinod S, Biradar, Rajashekhar C, Shenoy, Venkatesh

    “…Transmit Receive Modules (TRM) are the essential elements of synthetic Aperture Radar (SAR) payload of Radar Imaging Satellites (RISATs). Every radar imaging…”
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    Conference Proceeding
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    Improved Cache Replacement Policy based on Recency Time Re-Reference Interval Prediction by Athni, Chetan R, Vinod Chippalkatti, Vaishnavi, Nandakumar, Ankita, Nandana, A V, Pavitra, Y J

    “…The cache memory, having one of the fastest response times in the memory hierarchy (superseded only by processor registers), while also residing closest to the…”
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    Conference Proceeding
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    Design and Implementation of Triple Output Flyback Converter for Space Applications by Patil, Swati, Srivani, S G, Sarathi Panigrahy, Parth, Nagaraju, T K, Singh, Bhoopendra Kumar, Chippalkatti, Vinod

    “…This paper describes the Hardware Design and Implementation of multiple output Flyback converter for space applications. Flyback topology is well suited for…”
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    Conference Proceeding
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    Hardware Implementation of Forward Converter with Active Clamp Reset Technique by Savanur, Srijana. R., Patil, Sukumar, Singh, Bhoopendrakumar, chippalkatti, Vinod

    “…In Defense and Aerospace applications, particularly at the lower input voltage the required duty cycle to regulate the output voltage is greater than 50%. In…”
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    Conference Proceeding