Search Results - "Ching-Fa Yeh"

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  1. 1

    Post-Cu CMP cleaning for colloidal silica abrasive removal by Chen, Po-Lin, Chen, Jyh-Herng, Tsai, Ming-Shih, Dai, Bau-Tong, Yeh, Ching-Fa

    Published in Microelectronic engineering (01-11-2004)
    “…In this study, an efficient approach for the removal of colloidal silica abrasives from the polished copper surface was proposed and demonstrated. This…”
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    Journal Article
  2. 2

    Electrical Characteristics of the HfAlON Gate Dielectric With Interfacial UV-Ozone Oxide by CHEN, Yung-Yu, FU, Wen-Yu, YEH, Ching-Fa

    Published in IEEE electron device letters (01-01-2008)
    “…In this letter, the electrical properties of a HfAlON dielectric with UV-O 3 interfacial oxide were comprehensively studied and then compared with those of a…”
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    Journal Article
  3. 3

    Nonvolatile memory characteristics of nickel-silicon-nitride nanocrystal by Chen, Wei-Ren, Chang, Ting-Chang, Liu, Po-Tsun, Yeh, Jui-Lung, Tu, Chun-Hao, Lou, Jen-Chung, Yeh, Ching-Fa, Chang, Chun-Yen

    Published in Applied physics letters (20-08-2007)
    “…The formation of nickel-silicon-nitride nanocrystals by sputtering a comixed target in the argon and nitrogen environment is proposed in this letter. High…”
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    Journal Article
  4. 4

    Novel post CMP cleaning using buffered HF solution and ozone water by Yeh, Ching-Fa, Hsiao, Chih-Wen, Lee, Wen-Shan

    Published in Applied surface science (30-06-2003)
    “…Post chemical mechanical polishing (CMP) cleaning is a key process for copper (Cu) CMP in dual damascene interconnection technology. During the post CMP…”
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    Journal Article Conference Proceeding
  5. 5

    Influence of measuring environment on the electrical characteristics of pentacene-based thin film transistors by Wang, Yu-Wu, Cheng, Horng-Long, Wang, Yi-Kai, Hu, Tang-Hsiang, Ho, Jia-Chong, Lee, Cheng-Chung, Lei, Tan-Fu, Yeh, Ching-Fa

    Published in Thin solid films (22-11-2004)
    “…This work concerns the electrical properties and carrier transport behavior of polycrystalline pentacene-based thin film transistors (TFTs) in air and…”
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    Journal Article
  6. 6

    Investigation of grain boundary control in the drain junction on laser-crystalized poly-Si thin film transistors by Chen, Tien-Fu, Yeh, Ching-Fa, Lou, Jen-Chung

    Published in IEEE electron device letters (01-07-2003)
    “…This letter investigates the influences of grain boundaries in the drain junction on the performance and reliability of laser-crystalized poly-Si thin film…”
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    Journal Article
  7. 7
  8. 8

    The removal of airborne molecular contamination in cleanroom using PTFE and chemical filters by Ching-Fa Yeh, Chih-Wen Hsiao, Shiuan-Jeng Lin, Chih-Min Hsieh, Kusumi, T., Aomi, H., Kaneko, H., Bau-Tong Dai, Ming-Shih Tsai

    “…Cleanroom contamination and its impact on the performance of devices are beginning to be investigated due to the increasing sensitivity of the semiconductor…”
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    Journal Article
  9. 9

    Impact of Air Filter Material on Metal Oxide Semiconductor (MOS) Device Characteristics in HF Vapor Environment by Hsiao, Chih-Wen, Lou, Jen-Chung, Yeh, Ching-Fa, Hsieh, Chih-Ming, Lin, Shiuan-Jeng, Kusumi, Toshio

    Published in Japanese Journal of Applied Physics (15-05-2004)
    “…Airborne molecular contamination (AMC) is becoming increasingly important as devices are scaled down to the nanometer generation. Optimum ultra low penetration…”
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    Journal Article
  10. 10

    A novel lightly doped drain polysilicon thin-film transistor with oxide sidewall spacer formed by one-step selective liquid phase deposition by Shih, Po-Sheng, Chang, Chun-Yen, Chang, Ting-Chang, Huang, Tiao-Yuan, Peng, Du-Zen, Yeh, Ching-Fa

    Published in IEEE electron device letters (01-08-1999)
    “…We have proposed and successfully demonstrated a novel process for fabricating lightly doped drain (LDD) polycrystalline silicon thin-film transistors (TFT's)…”
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    Journal Article
  11. 11

    Effects of mechanical characteristics on the chemical-mechanical polishing of dielectric thin films by Tseng, Wei-Tsu, Liu, Chi-Wen, Dai, Bau-Tong, Yeh, Ching-Fa

    Published in Thin solid films (15-12-1996)
    “…The effects of as-deposited (intrinsic) stress, externally applied (extrinsic) stresses, hardness, and modulus of various dielectric films on…”
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    Journal Article
  12. 12

    The effect of temperature on I-V characteristics of a Si:H photodiode by KUAN-LUN CHANG, CHING-FA YEH

    Published in Japanese Journal of Applied Physics (01-09-1992)
    “…A 16-bit/mm, high-resolution, Schottky a-Si:H photodiode linear sensor array was fabricated, and the effect of temperature on its I-V characteristics was…”
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    Journal Article
  13. 13

    Novel contact hole fabrication using selective liquid-phase deposition instead of reactive ion etching by Yeh, Ching-Fa, Liu, Chien-Hung, Su, Jwinn-Lein

    Published in IEEE electron device letters (01-01-1999)
    “…This work forms a contact hole utilizing the selectively liquid-phase deposited (S-LPD) silicon-oxide technique instead of the conventional reactive ion…”
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    Journal Article
  14. 14

    Application of plasma immersion ion implantation doping to low-temperature processed poly-Si TFTs by Ching-Fa Yeh, Tai-Ju Chen, Chung Liu, Jiqun Shao, Cheung, N.W.

    Published in IEEE electron device letters (01-11-1998)
    “…This work applied, for the first time, plasma immersion ion implantation (PIII) for source/drain doping on low-temperature processed polysilicon thin-film…”
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    Journal Article
  15. 15

    Effects of plasma treatment on the properties of room-temperature liquid-phase deposited (LPD) oxide films by Yeh, Ching-Fa, Lin, Shyue-Shyh

    Published in Journal of non-crystalline solids (01-07-1995)
    “…Effects of plasma treatment including H 2 or O 2 on the properties of LPD oxide were investigated. After plasma treatment, the physicochemical characteristics…”
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    Journal Article Conference Proceeding
  16. 16

    Novel Sidewall Capping for Degradation-Free Damascene Trenches of Low-Permittivity Methylsilsesquioxane by Yeh, Ching-Fa, Lee, Yueh-Chuan, Su, Yuh-Ching, Wu, Kwo-Hau, Lin, Chein-Hsin

    Published in Japanese Journal of Applied Physics (01-04-2000)
    “…A low-permittivity organic dielectric, methylsilsesquioxane (MSQ), used as an interlevel dielectric is expected to reduce the parasitic capacitance in…”
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    Journal Article
  17. 17

    Improved I-V characteristics of polysilicon thin film transistors with novel dual-buffer drain structure by CHING-FA YEH, CHYI-HSIANG CHERN

    “…ON/OFF current ratio of poly-Si TFTs has been improved by using a novel structure called the dual-buffer drain (DBD). The new DBD TFT not only reduces the…”
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    Conference Proceeding Journal Article
  18. 18

    Thinner liquid phase deposited oxide for polysilicon thin-film transistors by Yeh, Ching-Fa, Lin, Shyue-Shyh, Fan, Ching-Lin

    Published in IEEE electron device letters (01-11-1995)
    “…To scale down the gate insulator thickness of polysilicon thin-film transistors (poly-Si TFT's), a thinner oxide is developed by liquid-phase deposition with a…”
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    Journal Article
  19. 19

    Chemical mechanical polishing of PSG and BPSG dielectric films: the effect of phosphorus and boron concentration by Liu, Chi-Wen, Dai, Bau-Tong, Yeh, Ching-Fa

    Published in Thin solid films (01-12-1995)
    “…Chemical-mechanical polishing of blanket and patterned oxide films doped with phosphorus and boron has been studied. FTIR was used to characterize the film…”
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    Journal Article Conference Proceeding
  20. 20

    Novel gate dielectric films formed by ion plating for low-temperature-processed polysilicon TFTs by Yeh, Ching-Fa, Chen, Tai-Ju, Fan, Ching-Lin, Kao, Jiann-Shiun

    Published in IEEE electron device letters (01-09-1996)
    “…A novel SiO/sub 2/ film formed by ion plating (IP) at room temperature was developed for low-temperature-processed (LTP) (<625/spl deg/C) polysilicon thin-film…”
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    Journal Article