Search Results - "Ching, Wai Leong"

Low-Cost, Tiny-Sized MEMS Hydrophone Sensor for Water Pipeline Leak Detection by Xu, Jinghui, Chai, Kevin Tshun-Chuan, Wu, Guoqiang, Han, Beibei, Wai, Eva Leong-Ching, Li, Wei, Yeo, Jason, Nijhof, Edwin, Gu, Yuandong

“…In this paper, we present an experimental investigation of a water pipeline leak detection system based on a low-cost, tiny-sized hydrophone sensor fabricated…”
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Modular sensor chip design for package stress evaluation and reliability characterisation by Trigg, A.D., Chai, Tai Chong, Zhang, Xiaowu, Chen, Xian Tong, Wai, Leong Ching

“…A modular test chip comprising an array of 2mm square modules has been designed and fabricated. The maximum chip size can be up to 10mm square, i.e. a 5×5…”
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Development of Six-Degree-of-Freedom Inertial Sensors With an 8-in Advanced MEMS Fabrication Platform by Wu, Guoqiang, Han, Beibei, Cheam, Daw Don, Wai, Leong Ching, Chang, Peter Hyun Kee, Singh, Navab, Gu, Yuandong

“…This paper presents the development of an 8-in six-degree-of-freedom (DOF) inertial sensor based on an advanced capacitive inertial sensor fabrication…”
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Ultra-Thin FO Package-on-Package for Mobile Application by Hsiao, Hsiang-Yao, Ho, Soon Wee, Lim, Simon Siak Boon, Wai, Leong Ching, Chong, Ser Choong, Sharon Lim, Pei Siang, Han, Yong, Chai, Tai Chong

“…Today, Package on Package is a major trend of three-dimensional fabrication for processors and high-performance memory applications in portable applications…”
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3-D Modeling and Characterization for Die Attach Process by Bu, Lin, Ching, Wai Leong, Ling, Ho Siow, Rhee, Min Woo, Fen, Yong Puay

“…A new 3-D model for the die attach (DA) process is established and validated in this paper. With this model, the fluid flow characteristics of the DA process…”
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Development and Demonstration of a Novel Immersion Two Phase Cooling High Power SiC Power Module by Tang, Gongyue, Wai, Leong Ching, Feng, Huicheng

“…In this study, we propose a lead frame based half-bridge power module equipped with SiC power devices aimed for automotive applications. This suggested power…”
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Transient Thermal Characterization and Analysis for Next Generation SiC Power Module by Tang, Gongyue, Ye, Yong Liang, Ching Wai, Leong, Han, Yong

“…Power modules play a pivotal role in modern electrical systems, enabling efficient energy conversion and delivery in various applications. Silicon carbide…”
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CPI Parametric Investigation of UBM-Al Interface for Cu Pillar Flip-Chip Application by Lianto, Prayudi, Hong Yu Li, Balamurugan, R., Junqi Wei, Binte Jaafar, Norhanani, Wai, Leong Ching Eva, Sundarrajan, Arvind

“…Under bump metallization (UBM)-Al delamination is a high-value chip-package interaction reliability problem in flip-chip Cu pillar packaging. We devised a test…”
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Development of Flip-Chip Packaging for Monolithic Microwave Integrated Circuit by Wai, Leong Ching, Guan Lim, Teck, Chong, Ser Choong, Zhou, Lin

“…In this paper, the flip chip joints formed by using gold (Au) stud on commercial-off-the shelf (COTS) monolithic microwave integrate circuit (MMIC) designed…”
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Underfill selection methodology for fine pitch Cu/low-k FCBGA packages by Ong, Xuefen, Ho, Soon Wee, Ong, Yue Ying, Wai, Leong Ching, Vaidyanathan, Kripesh, Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Tan, Juan Boon, Sohn, Dong Kyun, Hsia, Liang Choo, Chen, Zhong

“…A systematic underfill selection approach has been presented to characterize and identify suitable underfill encapsulants for large size flip chip ball grid…”
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Process Development and Reliability of Microbumps by Lim, Sharon Pei-Siang, Rao, Vempati Srinivasa, Wai Yin Hnin, Wai Leong Ching, Kripesh, Vaidyanathan, Lee, Charles, Lau, John, Milla, Juan, Fenner, Andy

“…The use of flip-chip bonding technology on gold-tin (AuSn) microbumps for flip-chip packaging is becoming increasingly important in the electronics industry…”
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Investigation of Void-free Chip-to-Chip Bonding Methods for CMOS-MEMS Compatibility by Yeo, Yi Xuan, Leong Ching Wai, Eva, Chen, Daniel Ssu-Han, Choong Chong, Ser

“…A thin bonding interface that is void-free and composed of materials with low attenuation is needed to achieve GHz bulk acoustic wave signal transmission for…”
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Design, assembly and reliability of large die and fine-pitch Cu/low- k flip chip package by Ong, Yue Ying, Ho, Soon Wee, Vaidyanathan, Kripesh, Sekhar, Vasarla Nagendra, Jong, Ming Chinq, Yak Long, Samuel Lim, Wen Sheng, Vincent Lee, Wai, Leong Ching, Rao, Vempati Srinivasa, Ong, Jimmy, Ong, Xuefen, Zhang, Xiaowu, Seung, Yoon Uk, Lau, John H., Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Yanfeng, Zhang, Tan, Juan Boon, Sohn, Dong Kyun

“…This paper reports the design, assembly and reliability assessment of 21 × 21 mm 2 Cu/low- k flip chip (65 nm node) with 150 μm bump pitch and high bump…”
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Development of WLCSP for Accelerometer Packaging with Vertical CuPd Wire as Through Mold Interconnection (TMI) by Zhaohui Chen, Boon Long Lau, Zhipeng Ding, Leong Ching Wai, Eva, Beibei Han, Lin Bu, Hyun-Kee Chang, Tai Chong Chai

“…A Wafer Level Chip Scale Packaging (WLCSP) solution with CuPd wire in epoxy mold compound (EMC) as through mold interconnection (TMI) was proposed for the…”
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Development of a Cu/Low- k Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications by Xiaowu Zhang, Lau, J H, Premachandran, C S, Ser-Choong Chong, Leong Ching Wai, Lee, V, Chai, T C, Kripesh, V, Sekhar, V N, Pinjala, D, Che, F X

“…Consumers' demands have driven the industry toward devices and packages with low cost, high performance, and multiple functions. Stacking two or more chips…”
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High temperature endurable die attach material for power electronics package - Process challenges by Leong Ching Wai, Mian Zhi Ding, Gong Yue Tang

“…In this paper, silver (Ag) sintering and high temperature lead free solder, bismuth silver (BiAgX) high temperature die attach materials were evaluated and…”
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MEMS-Silicon Chip Bonding Verification using GHz Pulse-echo Simulation and Measurements by Trivedi, Shyam, Yeo, Yi Xuan, Sarafianou, Mantalena, Wai, Eva Leong Ching, Sharma, Jaibir, Chen, Daniel Ssu-Han, Lal, Amit, Chai, Kevin Tshun Chuan

“…This research presents a novel method to differentiate the bonding quality of a MEMS chip to a silicon substrate by using bulk acoustic wave (BAW) transducer…”
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Chip to wafer hermetic bonding with flux-less reflow oven by Leong Ching Wai, Nachiappan, Vivek Chidambaram, Wickramanayaka, Sunil, Oetzel, Christoph

“…In this study, it is shown that temporary tacking (without flux and temporary tack materials) is feasible to temporary tack Cu/SnAg or SnAg sealing ring onto…”
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Recent Advances and Challenges of 2D Fourier Transform Computational Accelerator Using GHz Ultrasonics by Chen, Daniel Ssu-Han, Teo, Yong Shun, Yeo, Yi Xuan, Trivedi, Shyam, Tan, Xing Haw Marvin, Yang, Zaifeng, Wai, Eva Leong Ching, Wang, Yu-Shun, Sharma, Jaibir, Bui, Viet Phuong, Png, Ching Eng, Lal, Amit, Zhu, Yao, Chai, Kevin Tshun Chuan

“…This paper reports on the latest advances and challenges of a 2D Fourier Transform Computational Accelerator using GHz Ultrasonics. Firstly, the accelerator…”
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Study on failure mode and mechanism of bond pad under Cu ball bonding process using wire pull test and finite element modeling by Che, F. X., Leong Ching Wai, Hsiang-Yao Hsiao, Chai, T. C.

“…In this work, wire pull test combined with finite element analysis (FEA) were conducted to investigate failure mode and failure criterion for bond pad…”
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