Search Results - "Chi-Taou Tsai"
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Ground design for crosstalk mitigation in a WL-CSP transceiver for mobile communications
Published in 2016 IEEE Radio and Wireless Symposium (RWS) (01-01-2016)“…This paper presents the methodology for redistribution layer (RDL) design of a communication Coherent Receiver block. The analysis focuses on the dual-input…”
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Conference Proceeding Journal Article -
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System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip
Published in IEEE transactions on advanced packaging (01-05-2005)“…Demands for mobile phones with smaller form factor and lower cost have driven enhanced integration of electronics components. However, surface acoustic wave…”
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Inductance and SSN performance comparison of a 225 plastic BGA and a 208 plastic QFP
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)“…This paper focuses on the simultaneous switching noise (SSN) performance comparison between two compatible packages: a conventional leadframe plastic 208 QFP…”
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Conference Proceeding Journal Article
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Integration of SAW RF Rx filter stacked on a transceiver chip in a QFN package
Published in 2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers (2004)“…Enhanced integration of mobile phone components is driven by demands for reduced form factor and cost. Because SAW filters must be fabricated on piezoelectric…”
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Conference Proceeding -
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A Procedure for Calculating Fields Inside Arbitrarily Shaped, Inhomogeneous Dielectric Bodies Using Linear Basis Functions with the Moment Method
Published in IEEE transactions on microwave theory and techniques (01-11-1986)“…A moment method for calculating the internal field distributions of arbitrarily shaped, inhomogeneous dielectric bodies is presented. A free-space Green's…”
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High-Q inductors in a MAPBGA package substrate
Published in 2002 IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging (2002)“…A packaged-level inductor structure is reported to be an alternative approach to chip-level high Q inductors. Its potential performance was demonstrated by…”
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Conference Proceeding -
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Package inductance characterization at high frequencies
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01-05-1994)“…This paper describes a package inductance measurement technique based on network analysis and lumped element package model. Advantages of this technique…”
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Journal Article -
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An experimental technique for full package inductance matrix characterization
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01-05-1996)“…A new experimental technique based on a network analyzer was developed for characterizing the full inductance matrices (both self and mutual inductance) of…”
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Journal Article -
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High-frequency inductance measurements and characterization of alloy 42 and copper packages
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)“…A network analysis based high-frequency inductance technique was used to measure the package inductance of various A42 and Cu QFP packages. A continuous…”
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Conference Proceeding -
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Ground path inductance characterization of a 225PBGA
Published in Proceedings of Electrical Performance of Electronic Packaging (1995)“…This paper presents the measured L data of the ground (V/sub SS/) structure of a 225PBGA by using a two-port network analyzer technique. The ground structure…”
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Conference Proceeding -
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