Search Results - "Chery, E."

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric by Frank, T., Moreau, S., Chappaz, C., Leduc, P., Arnaud, L., Thuaire, A., Chery, E., Lorut, F., Anghel, L., Poupon, G.

“…In this paper, reliability of Through Silicon via (TSV) interconnects is analyzed for two technologies. First part presents an exhaustive analysis of Cu…”
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Assessment of critical Co electromigration parameters by Pedreira, O. Varela, Lofrano, M., Zahedmanesh, H., Roussel, Ph. J., van der Veen, M., Simons, V., Chery, E., Ciofi, I., Croes, K.

“…We perform a detailed assessment of the electromigration performance of Co interconnects. Package level EM measurements were performed during >11 months. Our…”
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Identification of the (√E+1/E)-dependence of porous low-k time dependent dielectric breakdown using over one year long package level tests by Chery, E., Federspiel, X., Roy, D., Volpi, F., Chaix, J.-M.

“…•Over-one-year-long test results for low-k dielectric TDDB are reported.•A methodology has been set up to compare different models that predict lifetime.•The…”
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Back-end dielectrics reliability under unipolar and bipolar AC-stress by Chery, E., Federspiel, X., Beylier, G., Besset, C., Roy, D., Volpi, F., Chaix, J.-M

“…The present paper compares the effects of AC and DC electrical stress on low-κ SiOCH and high-κ ZrO 2 and Ta 2 O 5 back-end dielectrics. A wide panel of stress…”
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The development of a culturally sensitive brochure on breast health for American Indian women by Tolma, E, Thomas, C, Neely, N, Chery, E, Edwards, T, Canfield, V

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The development of a culturally sensitive brochure on breast health for American Indian women: Eleni Tolma by Tolma, E, Thomas, C, Neely, N, Chery, E, Edwards, T, Canfield, V

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The development of a culturally sensitive brochure on breast health for American Indian women by Tolma, E, Thomas, C, Neely, N, Chery, E, Edwards, T, Canfield, V

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Fas-induced apoptosis increases hepatocyte tissue factor procoagulant activity in vitro and in vivo by Lopez, Michelle, Kopec, Anna K, Joshi, Nikita, Geddings, Julia E, Cline, Holly, Towery, Keara L, Rockwell, Cheryl E, Mackman, Nigel, Luyendyk, James P

“…Hepatocyte (HPC) apoptosis occurs in association with hepatotoxic responses and chronic liver disease, and is coupled to activation of the blood coagulation…”
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Identification of the (√E + 1/E)-dependence of porous low-k time dependent dielectric breakdown using over one year long package level tests: Insulating Films on Semiconductors 2013 by CHERY, E, FEDERSPIEL, X, ROY, D, VOLPI, F, CHAIX, J.-M

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Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric : Reliability of Micro-Interconnects in 3D IC Packages by FRANK, T, MOREAU, S, CHAPPAZ, C, LEDUC, P, ARNAUD, L, THUAIRE, A, CHERY, E, LORUT, F, ANGHEL, L, POUPON, G

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Through silicon via impact on above BEoL Time Dependent Dielectric Breakdown by Frank, T., Chery, E., Chappaz, C., Arnaud, L., Anghel, L.

“…The impact of Through Silicon Via (TSV) on above BEoL dielectric reliability is studied. Time Dependent Dielectric Breakdown (TDDB) is performed on copper dual…”
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A method for low-K dielectric breakdown physical localization by Chery, E., Federspiel, X., Beylier, G., Volpi, F., Chaix, J.

“…This paper reports results obtained on a new test structure developed to easily locate low-k dielectric breakdown spots. This spot can be localized by using a…”
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Intermetallic Compound and Void Kinetics Extraction From Resistance Evolution in Copper Pillars During Electromigration Stress Tests by Hartler, C., Moreau, S., Chery, E., Charbonnier, J., Siegert, J., Plihon, A., Assous, M., Mitsche, S., Simic, S., Schrank, F., Grogger, W.

“…Die-to-wafer interconnections such as copper pillars play a vital role in order to enable 3-D integration. This interconnection type allows increasing the…”
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