Search Results - "Chenson Chen"

A wafer-scale 3-D circuit integration technology by Burns, J.A., Aull, B.F., Chen, C.K., Chang-Lee Chen, Keast, C.L., Knecht, J.M., Suntharalingam, V., Warner, K., Wyatt, P.W., Yost, D.-R.W.

“…The rationale and development of a wafer-scale three-dimensional (3-D) integrated circuit technology are described. The essential elements of the 3-D…”
Get full text

Radiation Effects in 3D Integrated SOI SRAM Circuits by Gouker, P. M., Tyrrell, B., D'Onofrio, R., Wyatt, P., Soares, T., Weilin Hu, Chenson Chen, Schwank, J. R., Shaneyfelt, M. R., Blackmore, E. W., Delikat, K., Nelson, M., McMarr, P., Hughes, H., Ahlbin, J. R., Weeden-Wright, S., Schrimpf, R.

“…Radiation effects are presented for the first time for vertically integrated 3 × 64-kb SOI SRAM circuits fabricated using the 3D process developed at MIT…”
Get full text

SET Characterization in Logic Circuits Fabricated in a 3DIC Technology by Gouker, P. M., Tyrrell, B., Renzi, M., Chenson Chen, Wyatt, P., Ahlbin, J. R., Weeden-Wright, S., Atkinson, N. M., Gaspard, N. J., Bhuva, B. L., Massengill, L. W., Enxia Zhang, Schrimpf, R., Weller, R. A., King, M. P., Gadlage, M. J.

“…Single event transients are characterized for the first time in logic gate circuits fabricated in a novel 3DIC technology where SET test circuits are…”
Get full text

SOI for MEMS and advanced packaging by Muldavin, J., Bozler, C., Yost, D., Chen, C., Wyatt, P.

“…Silicon on Insulator (SOI) Technologies offer many advantages for the fabrication and advanced packaging of MEMS and IC devices and systems. The buried oxide…”
Get full text

SOI circuits powered by embedded solar cell by Chang-Lee Chen, Chen, C. K., Vitale, S. A.

“…Solar cells embedded in the SOI substrate were successfully used as the sole energy source to power a ring oscillator fabricated using an ultra-low-power fully…”
Get full text

Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology by Suntharalingam, V., Berger, R., Burns, J.A., Chen, C.K., Keast, C.L., Knecht, J.M., Lambert, R.D., Newcomb, K.L., O'Mara, D.M., Rathman, D.D., Shaver, D.C., Soares, A.M., Stevenson, C.N., Tyrrell, B.M., Warner, K., Wheeler, B.D., Yost, D.-R.W., Young, D.J.

“…A 1024/spl times/1024 integrated image sensor with 8 /spl mu/m pixels, is developed with 3D fabrication in 150 mm wafer technology. Each pixel contains a 2…”
Get full text

Enhanced resolution for future fabrication by Fritze, M., Keast, C.L., Chen, C.K., Astolfi, D.K., Yost, D.R., Burns, J.A., Chang-Lee Chen, Gouker, P.M., Suntharalingam, V., Wyatt, P.W.

“…We have developed resolution-enhanced optical lithography processes that have enabled us to fabricate devices with deep sub-100 nm feature sizes. Isolated gate…”
Get full text