Search Results - "Chen, Wangyong"

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  1. 1

    Gate breakdown induced stuck bits in sub-20 nm FinFET SRAM by Sun, Qian, Chi, Yaqing, Guo, Yang, Liang, Bin, Tao, Ming, Wu, Zhenyu, Guo, Hongxia, Zheng, Qiwen, Chen, Wangyong, Gao, Yulin, Zhao, Peixiong, Li, Xingji, Chen, Jianjun, Luo, Deng, Sun, Hanhan, Fang, Yahao

    Published in Applied physics letters (08-07-2024)
    “…This paper discusses the stuck bits induced by the gate breakdown of PMOS in the sub-20 nm FinFET static random access memory (SRAM) device. After the…”
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  2. 2

    Multi-Physics Field Based Simulation on the Response and Saturation Properties of Hg1-xCdxTe Based Photovoltaic Detectors With Composition Gradients by Chen, Jiahui, Chen, Wangyong, Cai, Linlin, Chen, Haifeng, Yang, Pengling, Wang, Dahui, Shen, Manling, Li, Xiangyang, Qiao, Hui

    Published in IEEE photonics journal (01-08-2024)
    “…In recent years, there has been a growing interest in photovoltaic detectors based on mercury cadmium telluride (Hg 1-x Cd x Te), owing to their exceptional…”
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  3. 3

    Performance Optimization of Hg1-xCdxTe Photovoltaic Detectors Under Strong Illumination Considering Temperature and Wavelength Dependencies by Chen, Jiahui, Chen, Wangyong, Cai, Linlin, Yang, Pengling, Wang, Dahui, Shen, Manling, Li, Xiangyang, Qiao, Hui

    Published in IEEE photonics journal (01-10-2024)
    “…Currently, HgCdTe detectors are advancing towards very long wavelengths and room temperature operation. However, as operating temperatures and illumination…”
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  4. 4

    Machine Learning Assisted Device Modeling with Process Variations for Advanced Technology by Lyu, Yaoyang, Chen, Wangyong, Zheng, Mingyue, Yin, Binyu, Li, Jinning, Cai, Linlin

    “…Process variations (PV), including global variation (GV) and local variation (LV), have become one of the major issues in advanced technologies, which is…”
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  5. 5

    Investigation of degradation under arbitrary bias conditions in HfO2 based nanosheet nFETs by 3D kinetic Monte-Carlo method by Chen, Wangyong, Cai, Linlin, Li, Yun, Wang, Kunliang, Zhang, Xing, Liu, Xiaoyan, Du, Gang

    Published in Japanese Journal of Applied Physics (26-03-2019)
    “…A 3D kinetic Monte-Carlo simulator is developed to evaluate the degradation and time-dependent variability of the device subjected to arbitrary bias…”
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  6. 6

    Electrothermal Small-Signal Model of Nanosheet FETs With Zero-Temperature-Coefficient Based Parameters Extraction Method by Lyu, Yaoyang, Chen, Wangyong, Cai, Linlin

    Published in IEEE transactions on electron devices (01-07-2024)
    “…Nanosheet FET (NSFET) is a promising structure for scaling transistors to the sub-5-nm node. However, the self-heating effect (SHE) impacts device performance…”
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  7. 7

    Layout Design Correlated With Self-Heating Effect in Stacked Nanosheet Transistors by Cai, Linlin, Chen, Wangyong, Du, Gang, Zhang, Xing, Liu, Xiaoyan

    Published in IEEE transactions on electron devices (01-06-2018)
    “…With technology node scaling down to 5 nm, the narrow device geometry confines the material thermal conductivity and further aggravates the self-heating effect…”
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  8. 8

    Change point detection in temporal networks based on graph snapshot similarity measures by Huang, Xianbin, Chen, Liming, Chen, Wangyong, Hu, Yao

    Published in Applied mathematics and computation (15-03-2025)
    “…This paper addresses the challenge of change point detection in temporal networks, a critical task across various domains, including life sciences and…”
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  9. 9

    Insight Into Electromigration Reliability of Buried Power Rail With Alternative Metal Material by Cai, Linlin, Chen, Yutao, Zhang, Haoyu, Lin, Jianwen, Chen, Wangyong

    Published in IEEE transactions on electron devices (01-01-2024)
    “…As the technology node scales toward 1 nm, the emerging metal materials are being explored as the potential replacements for Cu interconnects. To better…”
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  10. 10

    Determining the Zero-Temperature-Coefficient Point From Device Simulation to Circuit for Improving Temperature Variation Immunity by Chen, Wangyong, Zheng, Mingyue, Lyu, Yaoyang, Cai, Linlin

    Published in IEEE transactions on electron devices (01-03-2023)
    “…Thermal issue emerges as one of the critical reliability concerns in integrated circuit design, especially for advanced technology. To improve the temperature…”
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  11. 11

    Self-Heating and Thermal Network Model for Complementary FET by Zhao, Songhan, Cai, Linlin, Chen, Wangyong, He, Yandong, Du, Gang

    Published in IEEE transactions on electron devices (01-01-2022)
    “…In this article, we investigate the self-heating effect (SHE) of the Complementary FET (CFET) device and propose a cross-coupled thermal network model. For the…”
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  12. 12

    Thermal-Aware EM Reliability for Advanced Metal Interconnects of Complementary FET by Cai, Linlin, Zheng, Mingyue, Lyu, Yaoyang, Chen, Wangyong

    Published in IEEE transactions on electron devices (01-05-2022)
    “…Electromigration (EM) of metal interconnects is the continuous reliability concern for high-density integration beyond 5-nm technology, especially for the…”
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  13. 13

    Exploring thermal effects of advanced backside power delivery network beyond 3 nm node by Zhang, Haoyu, Cai, Linlin, Chen, Haifeng, Yin, Binyu, Chen, Wangyong

    Published in Microelectronics (01-11-2024)
    “…Backside Power Delivery Networks (BSPDNs) address scaling issues by relocating power, boosting efficiency and density. However, thermal effects pose…”
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  14. 14

    Analytical Model for Interface Traps-Dependent Back Bias Capability and Variability in Ultrathin Body and Box FDSOI MOSFETs by Chen, Wangyong, Cai, Linlin, Liu, Xiaoyan, Du, Gang

    Published in IEEE transactions on electron devices (01-11-2020)
    “…Independent back bias in the ultrathin body and Box (UTBB) fully depleted silicon-on-insulator (FDSOI) serves as the critical knob for exploiting the…”
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  15. 15

    Layout based radiation hardening techniques against single-event transient by Liang, Bin, Luo, Deng, Sun, Qian, Chen, Wangyong

    Published in Microelectronics and reliability (01-08-2022)
    “…The single-event transient (SET) is regarded as one of the critical reliability issues for the soft errors in modern circuit designs, especially at the…”
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  16. 16

    Photoelectric Characteristic Evaluation of Different Structured UTBB MOSFETs by Liu, Liqiao, Chen, Wangyong, Liu, Xiaoyan, Du, Gang

    Published in IEEE transactions on electron devices (01-05-2020)
    “…This article presents an evaluation of the photoelectric characteristic of different structured ultrathin body and buried oxide (UTBB) MOSFETs. The UTBB…”
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  17. 17

    Automatic Identification of Near Stationary Traffic States Using Changepoint Detection Method by Chen, Wangyong, Hu, Yao, Hu, Qian, Shen, Qi

    Published in Transportation research record (01-09-2022)
    “…Near stationary traffic states are of great significance for the calibration of the fundamental diagram and the quantification of capacity variation. In this…”
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  18. 18

    Self-Adapting Power Density Sampling for On-Chip Thermal Prediction With Transistor-Level Granularity by Chen, Haifeng, Chen, Wangyong, Chen, Jiahui, Zhang, Haoyu, Cai, Linlin

    “…With the rapid increase in chip scale, today's high-performance integrated circuits are facing increasingly complex thermal management challenges. It is often…”
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  19. 19
  20. 20

    Time-dependent statistical NBTI model for aging assessment in circuit level implemented with open model interface by Zheng, Mingyue, Chen, Wangyong, Lyu, Yaoyang, Chen, Haifeng, Chen, Jiahui, Cai, Linlin

    Published in Microelectronics and reliability (01-12-2023)
    “…As technology nodes continue to shrink, the impact of aging problems on devices has become increasingly important. One significant aging problem that affects…”
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