Search Results - "Chen, Wangyong"
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Gate breakdown induced stuck bits in sub-20 nm FinFET SRAM
Published in Applied physics letters (08-07-2024)“…This paper discusses the stuck bits induced by the gate breakdown of PMOS in the sub-20 nm FinFET static random access memory (SRAM) device. After the…”
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Multi-Physics Field Based Simulation on the Response and Saturation Properties of Hg1-xCdxTe Based Photovoltaic Detectors With Composition Gradients
Published in IEEE photonics journal (01-08-2024)“…In recent years, there has been a growing interest in photovoltaic detectors based on mercury cadmium telluride (Hg 1-x Cd x Te), owing to their exceptional…”
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Performance Optimization of Hg1-xCdxTe Photovoltaic Detectors Under Strong Illumination Considering Temperature and Wavelength Dependencies
Published in IEEE photonics journal (01-10-2024)“…Currently, HgCdTe detectors are advancing towards very long wavelengths and room temperature operation. However, as operating temperatures and illumination…”
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Machine Learning Assisted Device Modeling with Process Variations for Advanced Technology
Published in IEEE journal of the Electron Devices Society (01-01-2023)“…Process variations (PV), including global variation (GV) and local variation (LV), have become one of the major issues in advanced technologies, which is…”
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Investigation of degradation under arbitrary bias conditions in HfO2 based nanosheet nFETs by 3D kinetic Monte-Carlo method
Published in Japanese Journal of Applied Physics (26-03-2019)“…A 3D kinetic Monte-Carlo simulator is developed to evaluate the degradation and time-dependent variability of the device subjected to arbitrary bias…”
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Electrothermal Small-Signal Model of Nanosheet FETs With Zero-Temperature-Coefficient Based Parameters Extraction Method
Published in IEEE transactions on electron devices (01-07-2024)“…Nanosheet FET (NSFET) is a promising structure for scaling transistors to the sub-5-nm node. However, the self-heating effect (SHE) impacts device performance…”
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Layout Design Correlated With Self-Heating Effect in Stacked Nanosheet Transistors
Published in IEEE transactions on electron devices (01-06-2018)“…With technology node scaling down to 5 nm, the narrow device geometry confines the material thermal conductivity and further aggravates the self-heating effect…”
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Change point detection in temporal networks based on graph snapshot similarity measures
Published in Applied mathematics and computation (15-03-2025)“…This paper addresses the challenge of change point detection in temporal networks, a critical task across various domains, including life sciences and…”
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Insight Into Electromigration Reliability of Buried Power Rail With Alternative Metal Material
Published in IEEE transactions on electron devices (01-01-2024)“…As the technology node scales toward 1 nm, the emerging metal materials are being explored as the potential replacements for Cu interconnects. To better…”
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Determining the Zero-Temperature-Coefficient Point From Device Simulation to Circuit for Improving Temperature Variation Immunity
Published in IEEE transactions on electron devices (01-03-2023)“…Thermal issue emerges as one of the critical reliability concerns in integrated circuit design, especially for advanced technology. To improve the temperature…”
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Self-Heating and Thermal Network Model for Complementary FET
Published in IEEE transactions on electron devices (01-01-2022)“…In this article, we investigate the self-heating effect (SHE) of the Complementary FET (CFET) device and propose a cross-coupled thermal network model. For the…”
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Thermal-Aware EM Reliability for Advanced Metal Interconnects of Complementary FET
Published in IEEE transactions on electron devices (01-05-2022)“…Electromigration (EM) of metal interconnects is the continuous reliability concern for high-density integration beyond 5-nm technology, especially for the…”
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Exploring thermal effects of advanced backside power delivery network beyond 3 nm node
Published in Microelectronics (01-11-2024)“…Backside Power Delivery Networks (BSPDNs) address scaling issues by relocating power, boosting efficiency and density. However, thermal effects pose…”
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Analytical Model for Interface Traps-Dependent Back Bias Capability and Variability in Ultrathin Body and Box FDSOI MOSFETs
Published in IEEE transactions on electron devices (01-11-2020)“…Independent back bias in the ultrathin body and Box (UTBB) fully depleted silicon-on-insulator (FDSOI) serves as the critical knob for exploiting the…”
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Layout based radiation hardening techniques against single-event transient
Published in Microelectronics and reliability (01-08-2022)“…The single-event transient (SET) is regarded as one of the critical reliability issues for the soft errors in modern circuit designs, especially at the…”
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Photoelectric Characteristic Evaluation of Different Structured UTBB MOSFETs
Published in IEEE transactions on electron devices (01-05-2020)“…This article presents an evaluation of the photoelectric characteristic of different structured ultrathin body and buried oxide (UTBB) MOSFETs. The UTBB…”
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Automatic Identification of Near Stationary Traffic States Using Changepoint Detection Method
Published in Transportation research record (01-09-2022)“…Near stationary traffic states are of great significance for the calibration of the fundamental diagram and the quantification of capacity variation. In this…”
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Self-Adapting Power Density Sampling for On-Chip Thermal Prediction With Transistor-Level Granularity
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-08-2024)“…With the rapid increase in chip scale, today's high-performance integrated circuits are facing increasingly complex thermal management challenges. It is often…”
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A hybrid machine learning approach for congestion prediction and warning
Published in Transportation planning and technology (27-06-2024)Get full text
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Time-dependent statistical NBTI model for aging assessment in circuit level implemented with open model interface
Published in Microelectronics and reliability (01-12-2023)“…As technology nodes continue to shrink, the impact of aging problems on devices has become increasingly important. One significant aging problem that affects…”
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