Stencil printing process performance on various aperture size and optimization for lead-free solder paste

Stencil printing process performance on various aperture size and optimization for lead-free solder paste

The present study examines the effect of squeegee load, squeegee speed, and separation speed on the printing performance of lead-free solder paste, and solder printing was carried out to evaluate the effect of the filled volume of the solder paste during stencil printing. Application of pressure on...

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Bibliographic Details
Published in:International journal of advanced manufacturing technology Vol. 102; no. 9-12; pp. 3369 - 3379
Main Authors: Rusdi, M. S., Abdullah, M. Z., Chellvarajoo, S., Abdul Aziz, M. S., Abdullah, M. K., Rethinasamy, P., Veerasamy, Sivakumar, Santhanasamy, Damian G.
Format: Journal Article
Language:English
Published: London Springer London 01-06-2019
Springer Nature B.V
Subjects:
Apertures
CAE) and Design
Computer-Aided Engineering (CAD
Copper
Cost reduction
Engineering
Industrial and Production Engineering
Lead free
Load
Mechanical Engineering
Media Management
Optimization
Original Article
Printing
Response surface methodology
Separation
Silver
Solders
Tantalum
Tin
Tin base alloys
Transistors
Stencil printing
Lead-free solder paste
Separation speed
Squeegee speed
Response surface method
Squeegee load
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Summary:The present study examines the effect of squeegee load, squeegee speed, and separation speed on the printing performance of lead-free solder paste, and solder printing was carried out to evaluate the effect of the filled volume of the solder paste during stencil printing. Application of pressure on the squeegee affects the filled volume of the solder paste in the stencil aperture, and the incorrect pressure setting could cause incomplete filling. Herein, an experiment was conducted on a printing machine employing surface mount technology. The solder paste used in the study was Sn/Ag/Cu (SAC305), and four components, namely, 0603, small outline transistor (SOT), 1210, and tantalum-D, were tested. The filled volume and height of the solder paste under different squeegee loads, squeegee speeds, and separation speeds were determined, and the solder volume was found to vary with the squeegee load and component type. Response surface method (RSM) optimization is conducted to obtain optimum filled volume and solder paste height and area during the printing process. The method showed squeegee load, squeegee speed, and separation speed have considerable effects on filled volume, solder paste height, and solder paste area.
ISSN:0268-3768
1433-3015
DOI:10.1007/s00170-019-03423-9