Search Results - "Cheemalamarri, Hemanth Kumar"

Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing by Kiat Goh, Simon Chun, Hemanth Kumar, Cheemalamarri, Hu, Liangxing, Shervonne, Woon, Jaafar, Norhanani, Khoon Sherry, Yap Lee, Huang, Ding, Lau, Chit Siong, Kumar Karuppannan, Senthil, Li, Hongyu, Tan, Chuan Seng, Chui, King-Jien

“…Quantum computing relies on a blend of superposition and entanglement phenomena of qubit devices to solve problems. It promises unparalleled computational…”
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Study of Cu Pad Expansion with Surrounding Dielectrics for Hybrid Bonding by Cheemalamarri, Hemanth Kumar, Lir, Ji, Lee, Wen, Rao, Vempati Srinivasa, Singh, Navab

“…Copper/dielectric hybrid bonding technology is a key enabler for advanced chip-level (chip-to-chip, chip-to-wafer) or wafer-level (wafer-to-wafer)…”
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Diffusion Enhanced Optimized Thin Passivation Layer for Realizing Copper to Copper Wafer Bonding at Low Thermal Budget by Bonam, Satish, Cheemalamarri, Hemanth Kumar, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

“…In the last decade, the implementation of three-dimensional integration circuit (3D IC) technology has received much attention in the semiconductor industry…”
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Through Silicon Via Oxide Etch Back for Via-last Integration Scheme by Cheemalamarri, Hemanth Kumar, Senthilkumar, Darshini, Rao, B.S.S. Chandra

“…The TSV technology has become the key driver for advanced electronic packages such as 3D memory and BSI (backside illuminated image) sensor applications. Among…”
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Cu/Dielectric hybrid bonding among Glass and Si by Cheemalamarri, Hemanth Kumar, Sundaram, Arvind, Van Nhat Anh, Tran, Jae Ok, Yoo, Rao, Vempati Srinivasa, Singh, Navab

“…Chaplets and advanced packaging technologies play a pivotal role in meeting the diverse and demanding requirements of data-intensive workloads, by offering…”
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Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications by Cheemalamarri, Hemanth Kumar, Van Nhat Anh, Tran, Guan, Chen Gim, Lim, Meng Keong, Vempati, Srinivasa Rao, Singh, Navab

“…Advanced packaging featuring vertical integration has emerged as a crucial technology facilitating high performance, low power consumption, and compatibility…”
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Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding by Cheemalamarri, Hemanth Kumar, Sundaram, Arvind, Sandra, San, Van Nhat Anh, Tran, Chandra Rao, Bhesetti, Guan, Chen Gim, Haitao, Yu, Raju, Mani, Ping, Luo, Chaeeun, Lee, Rao, Vempati Srinivasa, Singh, Navab

“…Hybrid bonding, a crucial technique in heterogeneous package integration, holds immense potential for advancing pitch scaling in semiconductor technologies. As…”
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Ultrathin New Dielectric Interlayer Layer - Enhancer for TEOS-TEOS Bond Strength at Low Thermal Budget for C2W and W2W Bonding Applications by Cheemalamarri, Hemanth Kumar, Lee Hou Jang, Steven, Miao, Ji Hong, V, Nandini, S, Chandra Rao B S, King Jien, Chui, Rao, Vempati Srinivasa, Singh, Navab

“…Three-dimensional integrated circuit (3D IC) packaging is becoming promising for automation and high-performance computing applications. High-density…”
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CMOS-Compatible Fine Pitch Al-Al Bonding by Cheemalamarri, Hemanth Kumar, Varghese, Binni, Jaibir, Sharma, Hongyu, Li, S, Chandra Rao S, Singh, Navab, Rao, Vempati Srinivasa, Chui, King-Jien

“…The metal-metal bonding has become more promising for fine-line hermitic sealing and electronic packaging applications. Even though aluminum has CMOS…”
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Interface Analysis of High Reliable Hermitic Sealed Microfluidic Channels for Thermal Cooling in 3D ICs by Cheemalamarri, Hemanth Kumar, Bonam, Satish, Banik, Dhiman, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

“…Thermal management is the critical issue in all present conventional 2D electronic packages, and is more crucial in the case staked dies of advanced 3D IC…”
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Optimization of the CMP process for direct wafer-to-wafer oxide bonding by Ji, Hong-Miao, Cheemalamarri, Hemanth Kumar, Chi, Ting-Ta, Serene, Hui-ting Lim, Teo Dickson, Wei-Jie, Alfred, Siang-Kiat Neo, Li, Hong-Yu, Jon, Gim-Guan Chen, Venkataraman, Nandini, Lee, Wen

“…Direct wafer-to-wafer oxide bonding is an efficient method for the 3D integration of heterogeneous or homogeneous substrates and occupies a significant place…”
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Achieving of Intensified Conductive Interconnections for Flex-on-Flex by Using Metal Passivated Copper - Copper Thermocompression Bonding by Kumar, C. Hemanth, panigrahi, Asisa Kumar, Bonam, Satish, Paul, Nirupam, Vanjari, Siva Rama Krishna, Singh, Shiv Govind

“…There is a gradual increase in demand for flexible electronics due to the way it is going to empower the end user - to bent, roll/fold and arrange randomly in…”
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