Search Results - "Chapman, G.H."

An Optical Imaging Technique Using Deep Illumination in the Angular Domain by Vasefi, F., Chan, P.K.Y., Kaminska, B., Chapman, G.H., Pfeiffer, N.

“…This paper describes a novel optical imaging method, deep illumination angular domain imaging (ADI), for detecting micron-scale objects within highly…”
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Angular domain imaging of objects within highly scattering media using silicon micromachined collimating arrays by Chapman, G.H., Trinh, M., Pfeiffer, N., Chu, G., Lee, D.

“…Optical imaging of objects within highly scattering media, such as tissue, requires the detection of ballistic/quasi-ballistic photons through these media…”
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Temporary extrusion failures in accelerated lifetime tests of copper interconnects by Zhang, Y., Choy, J.H., Chapman, G.H., Kavanagh, K.L.

“…A novel electromigration failure mode was detected in 0.13-μm technology, copper dual damascene interconnects. Extrusions formed between the test lead and…”
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Automatic Detection of In-field Defect Growth in Image Sensors by Leung, J., Chapman, G.H., Koren, I., Koren, Z.

“…Characterization of in-field defect growth with time in digital image sensors is important for measuring the quality of sensors as they age. While more defects…”
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A self-correcting active pixel sensor using hardware and software correction by Chapman, G.H., Djaja, S., Cheung, D.Y.H., Audet, Y., Koren, I., Koren, Z.

“…Active pixel sensor (APS) CMOS technology reduces the cost and power consumption of digital imaging applications. We present a highly reliable system for the…”
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Quantitative analysis of in-field defects in image sensor arrays by Leung, J., Dudas, J., Chapman, G.H., Koren, I., Koren, Z.

“…Growth of pixel density and sensor array size increases the likelihood of developing in-field pixel defects. An ongoing study on defect development in imagers…”
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Defect Tolerance for a Capacitance Based Nanoscale Biosensor by Chapman, G.H., Jain, V.K.

“…A capacitance based nanoscale biosensor and its defect tolerance are explored. The sensor consists of a microchamber that can be filled with the fluid under…”
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Characterization of Gain Enhanced In-Field Defects in Digital Imagers by Leung, J., Chapman, G.H., Koren, I., Koren, Z.

“…The quality of images produced by a digital imager is degraded by the presence of defects, mainly hot pixels, which develop continuously during the imager's…”
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Transparent conducting indium bismuth oxide by Karimi, M., Tu, R., Peng, J., Lennard, W., Chapman, G.H., Kavanagh, K.L.

“…Bismuth on indium (Bi/In) thin film bilayers (50:50 at.% Bi:In) were sputter deposited onto glass or silicon substrates nominally at room temperature. The…”
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Defect Tolerant and Energy Economized DSP Plane of a 3-D Heterogeneous SoC by Vijay Jain, Chapman, G.H.

“…This paper discusses a defect tolerant and energy economized computing array for the DSP plane of a 3D heterogeneous system on a chip. We present the…”
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Guest Editorial Foreword to the Special Section on WSI'95 by Tewksbury, S.K., Chapman, G.H.

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Inter-plane via defect detection using the sensor plane in 3D heterogeneous sensor systems by Chapman, G.H., Jain, V., Bhansali, S.

“…Defect and fault tolerance is being studied in a 3D heterogeneous sensor using a stacked chip with sensors located on the top plane, and inter-plane vias…”
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A parallel architecture for the ICA algorithm: DSP plane of a 3-D heterogeneous sensor by Jain, V.K., Bhanja, S., Chapman, G.H., Doddannagari, L., Nguyen, N.

“…A 3D heterogeneous sensor using a stacked chip has recently been proposed. While the sensors are located on one of the planes, the other planes provide for…”
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A Fault-Tolerant Active Pixel Sensor to Correct In-Field Hot-Pixel Defects by Dudas, J., La Haye, M.L., Leung, J., Chapman, G.H.

“…Solid-state image sensors develop in-field defects in all common environments. Experiments have demonstrated the growth of significant quantities of hot-pixel…”
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On-Line Mapping of In-Field Defects in Image Sensor Arrays by Dudas, J., Jung, C., Wu, L., Chapman, G.H., Koren, I., Koren, Z.

“…Continued increase in complexity of digital image sensors means that defects are more likely to develop in the field, but little concrete information is…”
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Laser processes for defect correction in large area VLSI systems by Chapman, G.H.

“…The post fabrication laser processing techniques of cutting lines and forming connections is effective in removing defects and enhancing fault tolerance in…”
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Fault Tolerant Active Pixel Sensors in 0.18 and 0.35 Micron Technologies by La Haye, M.L., Jung, C., Chen, D., Chapman, G.H., Dudas, J.

“…A fault tolerant active pixel sensor (FTAPS) has been designed and fabricated to correct for point defects that occur in CMOS image sensors both at…”
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Defect avoidance in a 3-D heterogeneous sensor [acoustic/seismic/active pixel/IR imaging sensor array] by Chapman, G.H., Jain, V., Bhansali, S.

“…A 3D heterogeneous sensor using a stacked chip is investigated. Optical active pixel sensor (APS) and IR bolometer detectors are combined to create a…”
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Design of a self-correcting active pixel sensor by Audet, Y., Chapman, G.H.

“…Digital cameras are growing ever larger in silicon area and pixel count, which increases the occurrence of defects at fabrication time, or dead pixels that…”
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On-line identification of faults in fault-tolerant imagers by Chapman, G.H., Koren, I., Koren, Z., Dudas, J., Jung, C.

“…Detection of defective pixels that develop on-line is a vital part of fault tolerant schemes for repairing imagers during operation. This paper presents a new…”
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