Search Results - "Cha, Seonyong"
-
1
Data Retention Characteristics for Gate Oxide Schemes in Sub-50 nm Saddle-Fin Transistor Dynamic-Random-Access-Memory Technology
Published in Japanese Journal of Applied Physics (01-04-2011)“…A data retention time has been investigated for various gate oxide schemes of saddle-fin (S-Fin) transistor dynamic random access memory (DRAM). The interface…”
Get full text
Journal Article -
2
Data Retention Characteristics for Gate Oxide Schemes in Sub-50 nm Saddle-Fin Transistor Dynamic-Random-Access-Memory Technology
Published in Japanese Journal of Applied Physics (01-04-2011)Get full text
Journal Article -
3
Improved electrical characteristics and reliability of p-MOSFET with fluorine implant
Published in Solid-state electronics (01-05-2020)“…•The method of fluorine implant improves both electrical characteristics and reliabilities.•The fluorine implant induced flat band voltage shift ~−40 mV and…”
Get full text
Journal Article -
4
A 24-Gb/s/Pin 8-Gb GDDR6 With a Half-Rate Daisy-Chain-Based Clocking Architecture and I/O Circuitry for Low-Noise Operation
Published in IEEE journal of solid-state circuits (01-01-2022)“…The demand for high-performance graphics systems used for artificial intelligence, cloud game, and virtual reality continues to grow; this trend requires…”
Get full text
Journal Article -
5
Holistic approaches to memory solutions for the Autonomous Driving Era
Published in 2022 IEEE International Symposium on Circuits and Systems (ISCAS) (28-05-2022)“…As DNNs improving state-of-the-art accuracy on many artificial intelligence (AI) applications such as computer vision processing for autonomous driving, the…”
Get full text
Conference Proceeding -
6
The chalcogenide-based memory technology continues: beyond 20nm 4-deck 256Gb cross-point memory
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11-06-2023)“…We demonstrate a high performance and cost effective cross point memory (CPM) technology for storage class memory(SCM) which consists of 20nm 1S1M (one…”
Get full text
Conference Proceeding -
7
Demonstration of crystalline IGZO transistor with high thermal stability for memory applications
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11-06-2023)“…Highly ordered crystalline InGaZnO (c-IGZO) TFTs have been demonstrated in subsequent processes above 550 °C compatible with memory applications. Notably,…”
Get full text
Conference Proceeding -
8
QLC Programmable 3D Ferroelectric NAND Flash Memory by Memory Window Expansion using Cell Stack Engineering
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11-06-2023)“…3D ferroelectric NAND (Fe-NAND) Quad-level cell (QLC) operation has been demonstrated for the first time to our knowledge, using the 3D CTN NAND test vehicle…”
Get full text
Conference Proceeding -
9
First Demonstration of Fully Integrated 16 nm Half-Pitch Selector Only Memory (SOM) for Emerging CXL Memory
Published in 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (16-06-2024)“…In this study, understanding the switching mechanisms of selector only memory (SOM) led to implementation of TCAD, and advanced materials and processes were…”
Get full text
Conference Proceeding -
10
28.2 A High-Performance 1Tb 3b/Cell 3D-NAND Flash with a 194MB/s Write Throughput on over 300 Layers \mathsf
Published in 2023 IEEE International Solid- State Circuits Conference (ISSCC) (19-02-2023)“…As data produced by multimedia explodes and demand for data storage increases, the most important topics for the NAND-Flash memory field are continuous…”
Get full text
Conference Proceeding -
11
25.1 A 24Gb/s/pin 8Gb GDDR6 with a Half-Rate Daisy-Chain-Based Clocking Architecture and IO Circuitry for Low-Noise Operation
Published in 2021 IEEE International Solid- State Circuits Conference (ISSCC) (13-02-2021)“…The demand for high-performance graphics systems used for artificial intelligence continues to grow; this trend requires graphics systems to achieve ever…”
Get full text
Conference Proceeding -
12
Extremely high performance, high density 20nm self-selecting cross-point memory for Compute Express Link
Published in 2022 International Electron Devices Meeting (IEDM) (03-12-2022)“…We demonstrate an array operation of 20 nm self-selecting memory (SSM) for the first time. SSM shows extremely high cell performance, great reliability, and…”
Get full text
Conference Proceeding -
13
Industry's First Recessed Gate Transistor Technology for Sense Amplifer Circuit in DRAM: Phenomena of Randomly Threshold Voltage High Flying and Subthreshold Swing Degradation
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12-12-2020)“…We have fabricated a recessed gate (RG) transistor for sense amplifier (SA) in high density DRAM and have compared it with a conventional planar gate (PG)…”
Get full text
Conference Proceeding -
14
Realistic Noise-aware Training as a Component of the Holistic ACiM Development Platform
Published in 2024 IEEE International Memory Workshop (IMW) (12-05-2024)“…Analog Computing-in-Memory is promising and energy-efficient AI acceleration hardware due to the elimination of von-Neumann bottleneck and adoption of…”
Get full text
Conference Proceeding -
15
A Workfunction Engineered Middle-Silicon-TiN Gate (MSTG) Cell Transistor in 16Gbit DRAM for High Scalability and Long Data Retention
Published in 2023 International Electron Devices Meeting (IEDM) (09-12-2023)“…To mitigate the constraint of the increased gate resistance for dual-workfunction-gate (DWG) cell transistors as a standard platform in the DRAM industry, a…”
Get full text
Conference Proceeding -
16
Recognition Accuracy Enhancement using Interface Control with Weight Variation-Lowering in Analog Computation-in-Memory
Published in 2022 IEEE International Memory Workshop (IMW) (01-05-2022)“…As AI technology develops, it is necessary to verify the technical feasibility of Memory-Centric convergence technology. Previously investigated resistive…”
Get full text
Conference Proceeding