Search Results - "Cereno Daniel, Ismael"

Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding by Chong, Ser Choong, Au Keng Yuen, Jason, Sekhar, Vasarla Nagendra, Cereno Daniel, Ismael, Kumar, Mishra Dileep, Srinivasa Rao, Vempati

“…Wafer to wafer hybrid bonding has been established to form fine pitch interconnections for high density I/O applications [1], [2]. However, this approach has…”
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Yield Improvement in Chip to Wafer Hybrid Bonding by Choong Chong, Ser, Cereno Daniel, Ismael, Lim Pei Siang, Sharon, Shim Cheng Yi, Joseph, Lai Wai Song, Alvin, Leng Loh, Woon

“…Chip to Wafer Hybrid Bonding is an attractive way to achieve ultra-fine pitch interconnect down to 6μm. Conventional way such as solder interconnects has…”
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Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer by Lim, Sharon Pei-Siang, Mian Zhi Ding, Velez Sorono, Dexter, Cereno, Daniel Ismael, Jong Kai Lin, Rao, Vempati Srinivasa

“…The use of portable electronic devices like smart phones and tablets results in high demand for more function, smaller dimensions and reduced power consumption…”
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Process Development of Via Formation by Laser Drilling on Insulating Resin by Cereno, Daniel Ismael, Choong, Chong Ser, Hsiang-Yao, Hsiao

“…To realize continuous miniaturization, improved performance and efficiency while minimizing cost of emerging new and highly functional electronic devices, the…”
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Stealth Dicing Challenges for MEMS Wafer Applications by Cereno, Daniel Ismael, Wickramanayaka, Sunil

“…In our digital world, microelectromechanical system (MEMS) are here to stay and will open the doors for the next exciting wave in the advancement of technology…”
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Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow by Keng Yuen, Jason Au, Chong, Ser Choong, Daniel, Ismael Cereno

“…Chip to wafer (C2W) bonding to form interconnect is not new to the industry. However, if the bottom wafer has thick (i,e ≥ 10um) Cu RDL layers, the CTE…”
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Chip-to-Wafer Hybrid Bonding for high performance 2.5D applications by Chong, Ser Choong, Daniel, Ismael Cereno, Sekhar, Vasarla Nagendra, Lim, Sharon, Srinivas, Vempati

“…Chip to wafer hybrid bonding is the prefer choice for high performance 2.5D application as it offered very high dense I/O population down to 10¼m pitch with…”
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Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications by Sekhar, Vasarla Nagendra, Kumar, Mishra Dileep, Tippabhotla, Sasi Kumar, Rao, B. S. S. Chandra, Daniel, Ismael Cereno, Chong, Ser Choong, Rao, Vempati Srinivasa

“…The present study focuses on multi-chip stacked memory module development, and it encompasses a comprehensive overview of critical aspects, key learnings,…”
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Development of 4 die stack module using Hybrid bonding approach by Chong, Ser Choong, Keng Yuen, Jason Au, Sekhar, Vasarla Nagendra, Daniel, Ismael Cereno, Rao, Vempati Srinivasa

“…Die stacking is commonly used in memory modules. Solder micro-bumps and through silicon via (TSVs) are common interconnects, and it may not viable or suitable…”
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Dielectric Stack Optimization for Die-level Warpage Reduction for Chip-to-Wafer Hybrid Bonding by Rao, B.S.S. Chandra, Kumar, Mishra Dileep, Sekhar, Vasarla Nagendra, Daniel, Ismael Cereno, Tippabhotla, Sasi Kumar, Chong, Ser Choong, C, Hemanth Kumar, Rao, Vempati Srinivasa

“…Chip-to-wafer hybrid bonding is a promising packaging technology for bumpless and high-density interconnection. However, this approach presents numerous…”
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Process Development of micro-bump flip chip bonding with Non-Conductive Film by Chong, Ser Choong, Li, Hongyu, Cereno, Daniel Ismael, Xie, Ling

“…Non-Conductive Film (NCF) is one of the packaging technology used for micro-bump flip chip bonding beside capillary underfill. The bonding process used with…”
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Laser Drilling of Thru Mold Vias (TMVs) for FOWLP Application by Sekhar, Vasarla Nagendra, Cereno, Daniel Ismael, Ho, David, Rao, Vempati Srinivasa

“…Present study focuses on high aspect ratio Thru Mold Via (TMV) fabrication using nanosecond laser drill tool. Epoxy mold compound (EMC) with 25um filler size…”
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Active Device Performance after Fan-out Wafer-level Packaging Process by Li, Hong-Yu, Kawano, Masaya, Lim, Simon, Cereno, Daniel Ismael, Sekhar, Vasarla Nagendra

“…For the study of active device effect by fan-out wafer level packaging process, fan-out assembly processes were simulated by using actual CMOS device wafers as…”
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Development of chip on wafer bonding with non conductive film using gang bonder by Ser Choong Chong, Hongyu Li, Ling Xie, Sekhar, Vasarla Nagendra, Cereno, Daniel Ismael

“…Non-Conductive Film (NCF) is an attractive option for tacking the chip on the wafer before sending the tacked sample to gang bonder to form the solder…”
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Study of C2W Bonding Using Cu Pillar with Side-Wall Plated Solder by Ling Xie, Wickramanayaka, Sunil, Sekhar, Vasarla Nagendra, Cereno, Daniel Ismael

“…Cu-Cu is a prefer choice of interconnects as it offered lower electrical resistance, no risk of shorting between the bump and higher reliability as compared to…”
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Ultra-fine pitch Cu-Cu bonding of 6μm bump pitch for 2.5D application by Ser Choong Chong, Ling Xie, Wickramanayaka, Sunil, Sekhar, Vasarla Nagendra, Cereno, Daniel Ismael

“…Ultra-fine pitch (6μm) interconnects are essential for high-end application-products that demands high speed and high bandwidth inter-chip communication…”
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High-Throughput Thermal Compression Bonding of 20 um Pitch Cu Pillar with Gas Pressure Bonder for 3D IC Stacking by Ling Xie, Wickramanayaka, Sunil, Ser Choong Chong, Sekhar, Vasarla Nagendra, Cereno, Daniel Ismael

“…Throughput issue is limiting the adoption of 3D IC stacking process although 3D IC has many advantages in shorter communication lines, lower electrical…”
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Through mold interconnects for fan-out wafer level package by Soon Wee Ho, Leong Ching Wai, Soon Ann Sek, Cereno, Daniel Ismael, Boon Long Lau, Hsiang-Yao Hsiao, Tai Chong Chai, Rao, Vempati Srinivasa

“…Through mold interconnects (TMI) is a key enabler for fan-out wafer level packaging (FOWLP) for 3D integration. Three different types of TMI have been…”
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Intuitive and inexpensive method to evaluate flip chip bonding parameters of micro bump with wafer-level underfill material using glass substrate by Jie Li Aw, Ser Choong Chong, Cereno, Daniel Ismael, KengHwa Teo, Rao, Vempati Srinivasa

“…Flip chip bonding of chips coated with wafer-level underfill over optically transparent glass substrate allows ease of inspection of flip chip bonding quality…”
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Chip to wafer bonding for three-dimensional integration of copper low K Chip by stacking process by Ser Choong Chong, Jie Li Aw, Ching, Eva Wai Leong, Cereno, Daniel Ismael, Hong Yu Li, Vempati, Srinivasa Rao, Keng Hwa Teo

“…Industry is adopting three-dimensional integration of Cu-low k Chip with micro-solder bumps by stacking process to increase the functionality and performance…”
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