Search Results - "Canora, F.J."
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A 2.4-GHz silicon bipolar oscillator with integrated resonator
Published in IEEE journal of solid-state circuits (01-02-1996)“…A 2.4 GHz fully-monolithic silicon-bipolar oscillator circuit implemented in a 12 GHz BiCMOS technology is presented. The integrated resonator circuit uses…”
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Journal Article -
2
High-transconductance InGaAs/InAlAs SISFETs
Published in IEEE transactions on electron devices (01-12-1991)“…Summary form only given. SISFETs in the InGaAs/InAlAs lattice-matched-to-InP material system with record transconductance have been fabricated. These devices…”
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Journal Article -
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Reduction of backgating in GaAs SISFET's with a low-temperature buffer
Published in IEEE electron device letters (01-03-1991)“…The use of a low-temperature molecular beam epitaxy (MBE)-grown buffer layer to reduce backgating in GaAs/AlGaAs semiconductor-insulator-semiconductor FETs…”
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Journal Article -
4
High-Transconductance Ingaas/Inaias Sisfets
Published in [1991] 49th Annual Device Research Conference Digest (1991)Get full text
Conference Proceeding -
5
RF and microwave building blocks in a standard BiCMOS technology
Published in 1996 IEEE International Symposium on Circuits and Systems (ISCAS) (1996)“…This paper reviews some of the RF IC design activities being undertaken by our group at IBM T.J. Watson Research Center. Hardware results for fully monolithic…”
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Conference Proceeding -
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A cost-effective approach to a short-range, high-speed radio design in the U-NII 5.x GHz band
Published in Proceedings RAWCON 98. 1998 IEEE Radio and Wireless Conference (Cat. No.98EX194) (1998)“…High-speed radio design research activities undertaken by the Communications Technology Department at IBM's T.J. Watson Research Center are described. The…”
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Conference Proceeding -
7
Packaging of high density fiber/laser modules using passive alignment techniques
Published in IEEE transactions on components, hybrids, and manufacturing technology (01-12-1992)“…A method for packaging a laser-fiber module is explored in which the critical laser-fiber alignment is carried out, not with the laser activated, but by a…”
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Journal Article -
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Packaging of high-density fiber/laser modules using passive alignment techniques
Published in 1992 Proceedings 42nd Electronic Components & Technology Conference (1992)“…A novel method for packaging a laser-fiber module is explored in which the critical laser-fiber alignment is carried out not with the usual active means, i.e.,…”
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Conference Proceeding -
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Improvements in index alignment method for laser-fiber array packaging
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01-08-1994)“…An "index alignment" method, based on the registration of fiducial marks, was previously developed for passive alignment of a laser array to a corresponding…”
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Journal Article -
10
Improvements in index alignment method for laser-fiber array packaging
Published in Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) (1993)“…An "index alignment" method, based on the registration of fiducial marks, was previously developed for passive alignment of a laser array to a corresponding…”
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Conference Proceeding