Effect of Surface Coating on Bond Strength between Etched Feldspar Ceramic and Resin-Based Luting Agents

This study evaluated adhesive protocols (silane, silane and unfilled resin, and universal adhesive) of bond strength between feldspar ceramic and resin-based luting agents (RBLAs). Thirty ceramic disks were embedded into acrylic resin, polished, etched, and randomly divided into 6 groups: S-RC: sila...

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Bibliographic Details
Published in:BioMed research international Vol. 2018; no. 2018; pp. 1 - 6
Main Authors: Spazzin, Aloísio O., Sarkis-Onofre, Rafael, Pereira, Gabriel K. R., Alessandretti, Rodrigo, Canevese, Volni A., Sebben, Jader, Bacchi, Atais
Format: Journal Article
Language:English
Published: Cairo, Egypt Hindawi Publishing Corporation 01-01-2018
Hindawi
John Wiley & Sons, Inc
Hindawi Limited
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Summary:This study evaluated adhesive protocols (silane, silane and unfilled resin, and universal adhesive) of bond strength between feldspar ceramic and resin-based luting agents (RBLAs). Thirty ceramic disks were embedded into acrylic resin, polished, etched, and randomly divided into 6 groups: S-RC: silane (S) and light-cured resin cement (RC) (RelyX Veneer; 3M ESPE); SB-RC: S followed by bond (B) (Clearfil SE Bond, Kuraray) and RC; UA-RC: universal adhesive (UA) (Single Bond Universal; 3M ESPE) and RC; flowable composite resin (F) was used on groups S-F, SB-F, and UA-F, and luting agent cylinders were built. The response variables (n=20) were microshear bond strength (MPa), characteristic strength (σ0, MPa), and Weibull modulus (m). The RC groups presented similar bond strengths regardless of whether or not bond was used. The S-F group with only silane application showed the highest bond strength, while the universal adhesive showed the lowest bond strength. The reliability was only affected in the UA-RC group, which was lower than the S-F group. Silane application is fundamental since the universal adhesive only decreased the bond strength between the feldspar ceramic and the RBLAs. Overall, the use of unfilled resin did not positively influence bond strength.
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Academic Editor: Konstantinos Michalakis
ISSN:2314-6133
2314-6141
DOI:10.1155/2018/3039251