Search Results - "Cai, Ziru"

Recent progress in metasurface-enabled optical waveplates by Deng, Yadong, Cai, Ziru, Ding, Yingtao, Bozhevolnyi, Sergey I., Ding, Fei

“…The polarization of light is crucial for numerous optical applications ranging from quantum information processing to biomedical sensing due to the fundamental…”
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Dynamic Phase‐Change Metawaveplates for Advanced Wavefront Shaping by Cai, Ziru, Ding, Yingtao, Chen, Zhiming, Zheng, Ziwei, Ding, Fei

“…Metasurfaces have recently gained increasing attention and shown great potential in replacing bulk optics with ultracompact flat metadevices, owing to their…”
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Phase-change metasurface for switchable vector vortex beam generation by Cai, Ziru, Wu, Cuo, Jiang, Jing, Ding, Yingtao, Zheng, Ziwei, Ding, Fei

“…Metasurfaces have attracted increasing attention due to their unprecedented capabilities of molding optical fields with exceedingly low losses. Despite…”
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A Novel Double-Sided Etching and Electroplating Fabrication Scheme for Coaxial Through-Silicon-Vias in 3-D Integration by Chen, Zhiming, Chen, Xuyan, Wang, Han, Cai, Ziru, Xiong, Miao, Hao, Yigang, Ding, Yingtao, Zhang, Ziyue

“…Compared to conventional through-silicon-via (TSV) technology, coaxial TSVs can provide better radio frequency (RF) transmission performance in terms of…”
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Enabling Continuous Cu Seed Layer for Deep Through-Silicon-Vias With High Aspect Ratio by Sequential Sputtering and Electroless Plating by Zhang, Ziyue, Ding, Yingtao, Xiao, Lei, Cai, Ziru, Yang, Baoyan, Chen, Zhiming, Xie, Huikai

“…This letter presents a new strategy for the formation of continuous Cu seed layer in high aspect ratio (HAR) through-silicon-vias (TSVs) with large depth based…”
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Dual‐Functional Optical Waveplates Based on Gap‐Surface Plasmon Metasurfaces by Cai, Ziru, Deng, Yadong, Wu, Cuo, Meng, Chao, Ding, Yingtao, Bozhevolnyi, Sergey I., Ding, Fei

“…Gap‐surface plasmon (GSP) metasurfaces have attracted increasing attention and have become an emerging research area due to their planar configurations, high…”
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Lithography-free fabrication of scalable 3D nanopillars as ultrasensitive SERS substrates by Chirumamilla, Anisha, Moise, Ioana-Malina, Cai, Ziru, Ding, Fei, Jensen, Karina B., Wang, Deyong, Kristensen, Peter K., Jensen, Lars R., Fojan, Peter, Popok, Vladimir, Chirumamilla, Manohar, Pedersen, Kjeld

“…•Cost-effective and large-area fabrication of ag nanopillar based substrates.•Ag pillars exhibit uniform plasmonic properties and a high density of…”
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Development of Cu Seed Layers in Ultra-High Aspect Ratio Through-Silicon-Vias (TSVs) with Small Diameters by Zhang, Ziyue, Ding, Yingtao, Xiao, Lei, Cai, Ziru, Yang, Baoyan, Wu, Zhaohu, Su, Yuwen, Chen, Zhiming

“…Through-silicon-vias (TSVs) with high aspect ratio are of great demand due to their advantages in high density three-dimensional (3D) integration. This paper…”
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An All-Wet, Low Cost RDL Fabrication Process with Electroless Plated Seed/Barrier Layers by Cai, Ziru, Ding, Yingtao, Wu, Zhaohu, Zhang, Ziyue, Su, Yuwen, Chen, Zhiming

“…2.5D/3D IC packaging and fan-out wafer-level packaging (FOWLP) have attracted much attention both from the academics and industries. In these technologies, the…”
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Design and Evaluation of a Novel and Ultra-Compact Fully-TGV-based Self-Shielding Bandpass Filter for 5G Applications by Zhang, Ziyue, Ding, Yingtao, Chen, Zhiming, Zhou, Mingrui, Xiao, Lei, Cai, Ziru, Xiong, Miao, Gong, Xiao

“…Three-dimensional (3D) integration and interposer technology provide a promising solution for the continued minimization of modern electronic system. In this…”
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Elimination of Scallop-Induced Stress Fluctuation on Through-Silicon-Vias (TSVs) by Employing Polyimide Liner by Xue, Chengbo, Cheng, Zhiqiang, Chen, Zhiming, Yan, Yangyang, Cai, Ziru, Ding, Yingtao

“…3-D modeling of through-silicon-via (TSV) with sidewall scallops, combined with an element birth and death technique, is explored in finite-element analysis…”
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