Search Results - "Cai, Jinbao"
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1
Fabrication of Normally Off AlGaN/GaN MOSFET Using a Self-Terminating Gate Recess Etching Technique
Published in IEEE electron device letters (01-07-2013)“…A self-terminating gate recess etching technique is first proposed to fabricate normally off AlGaN/GaN MOSFET. The gate recess process includes a thermal…”
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Journal Article -
2
3D Package CSP Solder Joints Morphological Parameters Sensitivity Analysis and Optimization in Temperature-vibration Coupling Environment
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01-08-2020)“…The finite element model of a 3D packaged CSP solder joint interconnect structure was established using ANSYS, and the temperature vibration coupling load is…”
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Conference Proceeding -
3
Typical failure mechanisms of plastic encapsulated devices' internal connection
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01-08-2016)“…Due to its advantages in terms of cost, size, weight, performance and availability, plastic encapsulated devices are used widely. However, the long-term…”
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Conference Proceeding -
4
Robust tracking control of 4-SPS(PS) type parallel manipulator via adaptive fuzzy logic approach
Published in 2008 10th International Conference on Control, Automation, Robotics and Vision (01-12-2008)“…The dynamic behavior of electro-hydraulic driven parallel manipulators is highly nonlinear system, the nonlinear behavior arising from load friction as well as…”
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Conference Proceeding -
5
Kinematic Analysis of 3-DoF Perpendicular Parallel Manipulator with Flexure Hinge
Published in 2010 Third International Conference on Knowledge Discovery and Data Mining (01-01-2010)“…Parallel manipulators has been extensively studied by virtues or its high force-to-weight ratio and wide spread applications such as vehicle or flight…”
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Conference Proceeding -
6
Innovatory structure design for parallel manipulators: Essential change of design methods
Published in 2009 IEEE 10th International Conference on Computer-Aided Industrial Design & Conceptual Design (01-11-2009)“…By analyzing the constraint characteristic of each limb which connected the fixed platform with the moving platform of parallel manipulators, the form of limbs…”
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Conference Proceeding -
7
A Novel Structure Design Method for Parallel Manipulators
Published in 2010 Third International Conference on Knowledge Discovery and Data Mining (01-01-2010)“…By analyzing the constraint characteristic of each limb of parallel manipulators, the Structure forms can be designed corresponding to certainty kinetic…”
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Conference Proceeding -
8
Design of Sliding Mode Controller with Low-Pass Filter for Robot Manipulators
Published in 2009 Second International Workshop on Knowledge Discovery and Data Mining (01-01-2009)“…Sliding mode control had been designed for robot manipulators at presents popularly, but the chattering is also a primary factor which infected the precise of…”
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Conference Proceeding -
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Investigating the Overdischarge Failure on Copper Dendritic Phenomenon of Lithium ion Batteries in Portable Electronics
Published in 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) (01-09-2019)“…Lithium-ion batteries (LIBs) have been widely applied in portable electronics as a power source. Nevertheless, LIBs also become the potential safety hazard for…”
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Conference Proceeding -
10
Investigation on failures of plastic package devices with unidentifiable defects related to deficient molding process
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01-08-2020)“…Chip with bonding wires and lead frame of a plastic encapsulated device is sealed with molding compound to prevent any foreign matters from getting inside…”
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Conference Proceeding -
11
Resistive Failure Localization of Electronic Components by Lock-in Thermography
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01-08-2020)“…Non-destructive failure analysis and defect characterization are necessary steps for electronics components. Infrared thermography is a non-invasive,…”
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Conference Proceeding -
12
Thermal Fitigure Life Prediction on PBGA Solder Joints of Typical Pad Finish/Solder Combination
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01-08-2019)“…The degradation characteristics and life prediction of the typical PCB Pad/solder pastes combinations including the ENIG PCB pad /lead-free BGA SAC305 ball…”
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Conference Proceeding -
13
Finite-Element Analysis of Strain Distribution in Ceramic Multilayer Capacitors during Wave Soldering and Reflow Soldering
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01-08-2019)“…The strain distributions in the MLCC during the wave soldering are analyzed with the use of the birth-death element strategy. It is confirmed that the larger…”
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Conference Proceeding -
14
VTD-XML-Based Design and Implementation of GML Parsing Project
Published in 2009 International Conference on Information Engineering and Computer Science (01-12-2009)“…GML specification provides a set of core schemas. Users can define their own GML application schemas flexibly by using GML core schemas and schema components…”
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Conference Proceeding -
15
GML Database Based on Oracle XML DB
Published in 2009 International Conference on Information Engineering and Computer Science (01-12-2009)“…Based on the study of XML documents storage in Oracle XML DB, this paper conducts a research on extending Oracle XML DB to store and manage GML documents…”
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Conference Proceeding -
16
Improving Energy-Efficiency in Public Buildings in China: Challenges and Solutions
Published in 2009 International Conference on Computational Intelligence and Software Engineering (01-12-2009)“…Buildings are important contributors to total energy consumption accounting for around 30 per cent of all energy consumed in China. Of this, around two-fifths…”
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Conference Proceeding -
17
Effects of calcium channel on 3- morpholinosydnonimine-induced rat hippocampal neuronal apoptosis
Published in Neural regeneration research (15-02-2011)“…Previous studies have demonstrated that increased chloride channel activity plays a role in nitric oxide-induced neuronal apoptosis in the rat hippocampus. The…”
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Journal Article