Search Results - "Cabruja, E."

3D double sided detector fabrication at IMB-CNM by Pellegrini, G., Balbuena, J.P., Bassignana, D., Cabruja, E., Fleta, C., Guardiola, C., Lozano, M., Quirion, D., Ullán, M.

“…The Large Hadron Collider (LHC) recorded its first collisions during the last months of 2009. By 2020 a two-stage upgrade of the accelerator complex, the High…”
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High density of electrodeposited Sn/Ag bumps for flip chip connection by Bigas, M., Cabruja, E.

“…As peripheral pads in commercial chips have a pitch in the neighbourhood of 40–50 μm, a technique that could deposit solder paste directly in such pitch would…”
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Review of CMOS image sensors by Bigas, M., Cabruja, E., Forest, J., Salvi, J.

“…The role of CMOS Image Sensors since their birth around the 1960s, has been changing a lot. Unlike the past, current CMOS Image Sensors are becoming…”
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Laser stripe peak detector for 3D scanners. A FIR filter approach by Forest, J., Salvi, J., Cabruja, E., Pous, C.

“…The accuracy of a 3D reconstruction using laser scanners is significantly determined by the detection of the laser stripe. Since the energy pattern of such a…”
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Rapid diagnosis of tuberculosis and multidrug resistance with the microscopic observation drug susceptibility assay in Ecuador [Notes from the field] by Giacomazzi, Cespedes-Alvarado, Losada-Cabruja, McDermott, Rojas-Andrade, Varnier

“…A collaborative project was established between the Alli Causai Foundation in Ambato, Ecuador, and the University of Genoa, Italy, to introduce the microscopic…”
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Piezoresistive accelerometers for MCM package by Plaza, J.A., Collado, A., Cabruja, E., Esteve, J.

“…Describes the first steps carried out for the integration of piezoresistive accelerometers in an MCM-D (D-type multichip modules with flip-chip…”
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Thin-Film Bulk Acoustic Wave Resonator Floating Above CMOS Substrate by Campanella, H., Cabruja, E., Montserrat, J., Uranga, A., Barniol, N., Esteve, J.

“…A thin-film bulk acoustic wave resonator (FBAR) having a floating, 3-D structure above a CMOS substrate is presented. The integration of the FBAR to the CMOS…”
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Characterization of thermal conductivity in thin film multilayered membranes by Sabaté, N., Santander, J., Gràcia, I., Fonseca, L., Figueras, E., Cabruja, E., Cané, C.

“…In this paper we propose a novel approach for the thermal conductivity determination in thermal membrane-based devices. In the presented methodology, the…”
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Piezoresistive accelerometers for MCM-package - Part II:The packaging by Cabruja, E., Collado, A., Plaza, J.A., Esteve, J.

“…This paper is the second part of a twofold work related to the full integration of piezoresistive accelerometers in a multichip modules-deposited (MCM-D) type…”
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Bump bonding of pixel systems by Lozano, M., Cabruja, E., Collado, A., Santander, J., Ullán, M.

“…A pixel detector consists of an array of radiation sensing elements which is connected to an electronic read-out unit. Many different ways of making this…”
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Feasibility of a flip-chip approach to integrate an IR filter and an IR detector in a future gas detection cell by FONSECA, L, CABRUJA, E, CALAZA, C, RUBIO, R, SANTANDER, J, FIGUERAS, E, GRACIA, I, CANE, C, MORENO, M, MARCO, S

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Test structure assembly for bump bond yield measurement on high density flip chip technologies by Ullán, M., Lozano, M., Chmeissani, M., Blanchot, G., Cabruja, E., García, J., Maiorino, M., Martínez, R., Pellegrini, G., Puigdengoles, C.

“…Modern flip chip technologies for imaging applications have achieved a very high integration level together with the possibility of large area assemblies…”
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Cross-Section Preparation for Solder Joints and MEMS Device Using Argon Ion Beam Milling by Amirmajdi, O.M., Ashyer-Soltani, R., Clode, M.P., Mannan, S.H., Yunqi Wang, Cabruja, E., Pellegrini, G.

“…Mechanical cross-section polishing has traditionally been the method of choice for preparing samples to be examined by scanning electron microscopy (SEM)…”
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Accurate contact resistivity extraction on Kelvin structures with upper and lower resistive layers by Santander, J., Lozano, M., Collado, A., Ullan, M., Cabruja, E.

“…An accurate procedure to extract contact resistivity from contact resistance measurements made on both D-resistor and L-resistor type Kelvin cross test…”
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Use of accelerometer technology for individual tracking of activity patterns, metabolic rates and welfare in farmed gilthead sea bream (Sparus aurata) facing a wide range of stressors by Rosell-Moll, E., Piazzon, M.C., Sosa, J., Ferrer, M.Á., Cabruja, E., Vega, A., Calduch-Giner, J.A., Sitjà-Bobadilla, A., Lozano, M., Montiel-Nelson, J.A., Afonso, J.M., Pérez-Sánchez, J.

“…The biosensor technology has the potential to revolutionize the aquaculture industry, but the selection of tagging method, operational mode (stand-alone vs…”
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Characterisation of electroplated Sn/Ag solder bumps by Bigas, M., Cabruja, E.

“…Environmental concerns as well as legal constraints have been pushing research on flip chip technology towards the development of lead-free solders and also to…”
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New technology for easy and fully IC-compatible fabrication of backside-contacted ISFETs by Merlos, A., Cabruja, E., Esteve, J.

“…A simple and fully IC-compatible microelectronic technology has been developed for the fabrication of backside-contacted (BSC) ISFETs based on commercially…”
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Reliability evaluation of a silicon-on-silicon MCM-D package by Barton, J, McCarthy, G, Doyle, R, Delaney, K, Cabruja, E, Lozano, M, Collado, A, Santander, J

“…This paper presents the results of reliability testing on a multichip module technology with active silicon substrates. The modules use flip-chip technology to…”
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Bonding techniques for hybrid active pixel sensors (HAPS) by Bigas, M., Cabruja, E., Lozano, M.

“…A hybrid active pixel sensor (HAPS) consists of an array of sensing elements which is connected to an electronic read-out unit. The most used way to connect…”
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Test chip for bump bond yield evaluation in high density flip chip technologies by Ullan, M., Lozano, M., Chmeissani, M., Blanchot, G., Cabruja, E., Garcia, J., Maiorino, M., Martinez, R., Pellegrini, G., Puigdengoles, C.

“…Modern flip chip technologies for imaging applications have achieved a very high integration level together with the possibility of large assemblies. These…”
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