Search Results - "CURRIE, T. M"
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Carrier mobilities and process stability of strained Si n- and p-MOSFETs on SiGe virtual substrates
Published in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures (01-11-2001)“…Surface channel strained Si metal–oxide–semiconductor field-effect transistors (MOSFETs) are a leading contender for future high performance complementary…”
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Journal Article -
2
Controlling threading dislocation densities in Ge on Si using graded SiGe layers and chemical-mechanical polishing
Published in Applied physics letters (06-04-1998)“…A method of controlling threading dislocation densities in Ge on Si involving graded SiGe layers and chemical-mechanical polishing (CMP) is presented. This…”
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3
Strained Ge channel p -type metal–oxide–semiconductor field-effect transistors grown on Si1−xGex/Si virtual substrates
Published in Applied physics letters (12-11-2001)“…We have fabricated strained Ge channel p-type metal–oxide–semiconductor field-effect transistors (p-MOSFETs) on Si0.3Ge0.7 virtual substrates. The poor…”
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4
High quality Ge on Si by epitaxial necking
Published in Applied physics letters (19-06-2000)“…We show that pure Ge grown selectively on SiO2/Si substrates in 100 nm holes is highly perfect at the top surface compared to conventional Ge…”
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5
High-quality germanium photodiodes integrated on silicon substrates using optimized relaxed graded buffers
Published in Applied physics letters (12-10-1998)“…The integration of Ge photodetectors on silicon substrates is advantageous for various Si-based optoelectronics applications. We have fabricated integrated Ge…”
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6
Hole mobility enhancements in strained Si/Si1−yGey p -type metal-oxide-semiconductor field-effect transistors grown on relaxed Si1−xGex (x<y) virtual substrates
Published in Applied physics letters (17-12-2001)“…We have achieved peak hole mobility enhancement factors of 5.15 over bulk Si in metal-oxide-semiconductor field-effect transistors (MOSFETs) by combining…”
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7
SiGe-free strained Si on insulator by wafer bonding and layer transfer
Published in Applied physics letters (16-06-2003)“…SiGe-free strained Si on insulator substrates were fabricated by wafer bonding and hydrogen-induced layer transfer of strained Si grown on bulk relaxed…”
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8
SPITZER EVIDENCE FOR A LATE-HEAVY BOMBARDMENT AND THE FORMATION OF UREILITES IN η CORVI At ∼1 Gyr
Published in The Astrophysical journal (10-03-2012)Get full text
Journal Article -
9
Dislocation dynamics in relaxed graded composition semiconductors
Published in Materials science & engineering. B, Solid-state materials for advanced technology (08-12-1999)“…Lattice-mismatched relaxed graded composition layers in the SiGe/Si, InGaAs/GaAs, and InGaP/GaP systems have recently been created with unprecedented high…”
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Journal Article Conference Proceeding -
10
Analysis of carrier generation lifetime in strained-Si/SiGe heterojunction MOSFETs from capacitance transient
Published in Applied surface science (15-03-2004)“…Carrier generation lifetime ( τ g) in strained-Si/SiGe has been investigated using capacitance transient method in MOS structure. Interface properties of…”
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Journal Article Conference Proceeding -
11
High minority-carrier lifetimes in GaAs grown on low-defect-density Ge/GeSi/Si substrates
Published in Applied physics letters (23-11-1998)“…A high bulk minority-carrier lifetime in GaAs grown on Si-based substrates is demonstrated. This was achieved by utilizing a step-graded Ge/GeSi buffer…”
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12
Monolithic integration of III-V optical interconnects on Si using SiGe virtual substrates
Published in Journal of materials science. Materials in electronics (01-07-2002)“…Working optical links epitaxially grown by atmospheric MOCVD and fabricated on Si via SiGe virtual substrates are demonstrated for the first time. The SiGe…”
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13
SPITZER EVIDENCE FOR A LATE-HEAVY BOMBARDMENT AND THE FORMATION OF UREILITES IN [eta] CORVI At ~1 Gyr
Published in The Astrophysical journal (10-03-2012)“…We have analyzed Spitzer and NASA/IRTF 2-35 mu m spectra of the warm, ~350 K circumstellar dust around the nearby MS star [eta] Corvi (F2V, 1.4 + or - 0.3…”
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14
Electron mobility enhancement in strained-Si n-MOSFETs fabricated on SiGe-on-insulator (SGOI) substrates
Published in IEEE electron device letters (01-07-2001)“…We demonstrate electron mobility enhancement in strained-Si n-MOSFETs fabricated on relaxed Si/sub 1-x/Ge/sub x/-on-insulator (SGOI) substrates with a high Ge…”
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15
Investigation of misfit dislocation leakage in supercritical strained silicon MOSFETs
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)“…This paper investigates off-state current leakage in strained silicon NMOSFETs built on supercritical thickness strained silicon films. it describes a simple…”
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Conference Proceeding -
16
Strained Si on insulator technology: from materials to devices
Published in Solid-state electronics (01-08-2004)“…SiGe-free strained Si on insulator (SSOI) is a new material system that combines the carrier transport advantages of strained Si with the reduced capacitance…”
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Journal Article -
17
Scalability of strained-Si nMOSFETs down to 25 nm gate length
Published in IEEE electron device letters (01-05-2003)“…Strained-Si nMOSFETs with a standard polysilicon gate process were fabricated down to 25 nm gate length with well-behaved characteristics and small difference…”
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18
Fully depleted n-MOSFETs on supercritical thickness strained SOI
Published in IEEE electron device letters (01-02-2004)“…Strained silicon-on-insulator (SSOI) is a new material system that combines the carrier transport advantages of strained Si with the reduced parasitic…”
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19
Dislocations in Relaxed SiGe/Si Heterostructures
Published in Physica status solidi. A, Applied research (01-01-1999)“…Recent advances in the understanding and control of threading dislocations in substantially relaxed SiGe buffer layers on Si are presented. A model for…”
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20
Preparation of novel SiGe-free strained Si on insulator substrates
Published in 2002 IEEE International SOI Conference (2002)“…A novel SiGe-free SSOI substrate technology has been described. This method enables the fabrication of well controlled, epitaxially-defined, thin strained Si…”
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Conference Proceeding