Search Results - "COWERN, N. E. B"
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Extended point defects in crystalline materials: Ge and Si
Published in Physical review letters (12-04-2013)“…B diffusion measurements are used to probe the basic nature of self-interstitial point defects in Ge. We find two distinct self-interstitial forms--a simple…”
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2
Doping characterization for germanium-based microelectronics and photovoltaics using the differential Hall technique
Published in Applied physics letters (23-04-2012)“…In this coming decade, complementary metal-oxide-semiconductor microelectronic devices may undergo a major change with the implementation of germanium…”
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3
Raman scattering studies of ultrashallow Sb implants in strained Si
Published in Journal of materials science. Materials in electronics (01-04-2008)“…Sheet resistance ( R s ) reductions are presented for antimony doped layers in strained Si. We use micro-Raman spectroscopy to characterise the impact of a low…”
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Journal Article Conference Proceeding -
4
Effect of amorphization and carbon co-doping on activation and diffusion of boron in silicon
Published in Applied physics letters (07-08-2006)“…We investigate the impact of amorphization and C co-implantation on B diffusion and activation properties after conventional spike rapid thermal annealing…”
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5
Local traps as nanoscale reaction-diffusion probes: B clustering in c-Si
Published in Applied physics letters (01-12-2014)“…A series of B implantation experiments into initially amorphized and not fully recrystallized Si, i.e., into an existing a/c-Si bi-layer material, have been…”
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Energetics of Self-Interstitial Clusters in Si
Published in Physical review letters (31-05-1999)Get full text
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7
Evidence on the mechanism of boron deactivation in Ge-preamorphized ultrashallow junctions
Published in Applied physics letters (22-03-2004)“…We investigate the thermal stability of boron-doped junctions formed by Ge preamorphization and solid phase epitaxial regrowth. Isochronal annealing and…”
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8
Raman study of the strain and H2 preconditioning effect on self-assembled Ge island on Si (001)
Published in Journal of materials science. Materials in electronics (01-07-2005)“…An investigation of the microscopic mechanisms of Ge self-assembling island growth is of great importance for future optoelectronic applications of quantum dot…”
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Conference Proceeding Journal Article -
9
Diffusion in a single crystal within a stressed environment
Published in Physical review letters (12-10-2007)“…The energetics of point defects and diffusion in a single crystal is analyzed with respect to stress in overlying or encapsulating layers. The resulting theory…”
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10
Mechanisms of B deactivation control by F co-implantation
Published in Applied physics letters (07-03-2005)“…Thermal annealing after preamorphization and solid-phase epitaxy of ultrashallow B implants leads to deactivation and diffusion driven by interstitials…”
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11
Boron uphill diffusion during ultrashallow junction formation
Published in Applied physics letters (26-05-2003)“…The recently observed phenomenon of boron uphill diffusion during low-temperature annealing of ultrashallow ion-implanted junctions in silicon has been…”
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12
Constraints on micro-Raman strain metrology for highly doped strained Si materials
Published in Applied physics letters (09-06-2008)“…Ultraviolet (UV), low penetration depth, micro-Raman spectroscopy, and high-resolution x-ray diffraction (HRXRD) are utilized as complementary, independent…”
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13
Enhanced boron activation in silicon by high ramp-up rate solid phase epitaxial regrowth
Published in Applied physics letters (07-03-2005)“…We investigate the influence of thermal conditions during solid phase epitaxial regrowth (SPER) on the electrical activation level of boron in preamorphized…”
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14
On the analysis of the activation mechanisms of sub-melt laser anneals
Published in Materials science & engineering. B, Solid-state materials for advanced technology (05-12-2008)“…In order to fabricate carrier profiles with a junction depth (∼15 nm) and sheet resistance value suited for sub-32 nm Si-CMOS technology, the usage of sub-melt…”
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15
Enhanced n-type dopant solubility in tensile-strained Si
Published in Thin solid films (03-11-2008)“…The creation of highly conductive ultrashallow-doped regions in strained Si is a key requirement for future Si based devices. It is shown that in the presence…”
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Journal Article Conference Proceeding -
16
Transient activation model for antimony in relaxed and strained silicon
Published in Solid-state electronics (01-11-2009)“…The transient activation model allows for a description of dopant deactivation through mechanisms such as dopant clustering. Here we propose a refined model to…”
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17
Structural and electrical characterisation of ion-implanted strained silicon
Published in Materials science & engineering. B, Solid-state materials for advanced technology (05-12-2008)“…The production of low resistance ultra-shallow junctions for e.g. source/drain extensions using low energy ion-implantation will be required for future CMOS…”
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18
Differential Hall characterisation of ultrashallow doping in advanced Si-based materials
Published in Materials science & engineering. B, Solid-state materials for advanced technology (05-12-2008)“…Strained Si channels are commonly used by manufacturers to enhance CMOS performance and research into novel channel materials (SiGe and Ge) is well underway…”
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19
Role of self- and boron-interstitial clusters in transient enhanced diffusion in silicon
Published in Applied physics letters (14-02-2000)“…We investigate the nucleation and evolution of boron-interstitial clusters (BIC), driven by high interstitial supersaturations, S(t), during Si implant damage…”
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20
Interstitial traps and diffusion in epitaxial silicon films
Published in Applied physics letters (16-05-1994)“…Oxidation-enhanced diffusion in molecular beam epitaxially grown epitaxial silicon films decreases rapidly with depth due to trapping of injected interstitials…”
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