Search Results - "CAUBET, Pierre"

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    Interface and plasma damage analysis of PEALD TaCN deposited on HfO2 for advanced CMOS studied by angle resolved XPS and C-V by PIALLAT, Fabien, BEUGIN, Virginie, GASSILLOUD, Remy, DUSSAULT, Laurent, PELISSIER, Bernard, LEROUX, Charles, CAUBET, Pierre, VALLEE, Christophe

    Published in Applied surface science (01-06-2014)
    “…Plasma enhanced atomic layer deposition (PEALD) TaCN deposited on HfO2 was studied by X-ray photoelectron spectroscopy (XPS) to understand the reactions taking…”
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    Journal Article
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    Investigation of TiN thin film oxidation depending on the substrate temperature at vacuum break by Piallat, Fabien, Gassilloud, Remy, Caubet, Pierre, Vallée, Christophe

    “…Due to the reduction of the thickness of the layers used in the advanced technology nodes, there is a growing importance of the surface phenomena in the…”
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    Journal Article
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    Matrix semigroups and differential equations: Ergodism and asymptotic behaviour of solutions with or without impulses, a survey by Caubet, Jean-Pierre

    Published in Nonlinear analysis (01-12-1997)
    “…General structure of a matrix nonstationary semigroup dominated by a nonnegative matrix semigroup and with cardinality of state spaces uniformly bounded…”
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    Journal Article
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    Characterization and impact of reduced copper plating overburden on 45 nm interconnect performances by Dubreuil, O., Caubet-Hilloutou, V., Guillan, J., Haxaire, K., Mellier, M., Caubet, P., Vannier, P., Petitprez, E., Bellet, D., Normandon, Ph

    Published in Microelectronic engineering (01-03-2010)
    “…During first metal level interconnects fabrication, a controlled modification of the electro-deposited copper over-deposition (overburden) is performed using a…”
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    Journal Article Conference Proceeding Web Resource
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