Search Results - "Butler, K.M."

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    Minimizing power consumption in scan testing: pattern generation and DFT techniques by Butler, K.M., Saxena, J., Jain, A., Fryars, T., Lewis, J., Hetherington, G.

    “…It is a well-known phenomenon that test power consumption may exceed that of functional operation. ICs have been observed to fail at specified minimum…”
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    Conference Proceeding
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    Scan-based transition fault testing - implementation and low cost test challenges by Saxena, J., Butler, K.M., Gatt, J., Raghuraman, R., Kumar, S.P., Basu, S., Campbell, D.J., Berech, J.

    “…The semiconductor industry as a whole is growing increasingly concerned about the possible presence of delay-inducing defects. There exist structured test…”
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    Conference Proceeding
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    An analysis of power reduction techniques in scan testing by Saxena, J., Butler, K.M., Whetsel, L.

    “…Power consumption during scan testing is becoming a concern. Circuit switching activity during scan shifting is high and results in high average and…”
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    Conference Proceeding
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    Guest Editor's Introduction: ITC Helps Get More Out of Test by Butler, K.M.

    Published in IEEE design & test of computers (01-09-2006)
    “…This special section, along with the International Test Conference 2006, highlights the value that test adds to the electronics manufacturing business. It…”
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    Journal Article
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    Local At-Speed Scan Enable Generation for Transition Fault Testing Using Low-Cost Testers by Ahmed, Nisar, Tehranipoor, Mohammad, Ravikumar, C. P., Butler, Kenneth M.

    “…The LOS technique offers significant advantages over the LOC in terms of coverage and pattern count, but since it requires the scan enable (SEN) signal to…”
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    Journal Article
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    Multidimensional Test Escape Rate Modeling by Butler, K.M., Carulli, J.M., Saxena, J., Nahar, A., Daasch, W.R.

    Published in IEEE design & test of computers (01-09-2009)
    “…Today's SoC designs contain many types of circuitry, each with various test types. This article revisits the classic test escape models and highlights their…”
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    Journal Article
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    A case study on the implementation of the Illinois Scan Architecture by Hsu, F.F., Butler, K.M., Patel, J.H.

    “…Scan based test techniques offer a very efficient alternative to achieve high fault coverage when compared to functional pattern testing. As circuit sizes grow…”
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    Conference Proceeding
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    At-speed structural test: Getting more real every day by Butler, K.M.

    Published in 2007 IEEE International Test Conference (01-10-2007)
    “…The panel deals with the question of whether or not it is possible to rely solely on structural test techniques to fully test an integrated circuit (IC). The…”
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    Conference Proceeding
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    Quality improvement and cost reduction using statistical outlier methods by Nahar, A., Butler, K.M., Carulli, J.M., Weinberger, C.

    “…Quality improvement and cost reduction in the overall IC manufacturing and test processes are being continuously sought. Outlier screening methods can address…”
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    Conference Proceeding
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    Flame retardant mechanism of silica gel/silica by Kashiwagi, Takashi, Gilman, Jeffrey W., Butler, Kathryn M., Harris, Richard H., Shields, John R., Asano, Atsushi

    Published in Fire and materials (01-11-2000)
    “…Various types of silica, silica gel, fumed silicas and fused silica were added to polypropylene and polyethylene oxide to determine their flame retardant…”
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    Journal Article
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    Defect-oriented testing and defective-part-level prediction by Dworak, J., Wicker, J.D., Lee, S., Grimaila, M.R., Mercer, M.R., Butler, K.M., Stewart, B., Wang, L.-C.

    Published in IEEE design & test of computers (01-01-2001)
    “…After an integrated circuit (IC) design is complete, but before first silicon arrives from the manufacturing facility, the design team prepares a set of test…”
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    Journal Article
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    Guest editors' introduction: Speed test and speed binning for complex ICs by Butler, K.M., Kwang-Ting Cheng, Wang, L.-C.

    Published in IEEE design & test of computers (01-09-2003)
    “…Presents the guest editorial for this issue of the publication…”
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    Journal Article
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    Modeling Test Escape Rate as a Function of Multiple Coverages by Butler, K.M., Carulli, J.M., Saxena, J.

    Published in 2008 IEEE International Test Conference (01-10-2008)
    “…The Williams and Brown model has long been the gold standard for estimating test escape rate as a function of yield and fault coverage. However, today's test…”
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    Conference Proceeding
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    Successful Development and Implementation of Statistical Outlier Techniques on 90nm and 65nm Process Driver Devices by Butler, K.M., Subramaniam, S., Nahar, A., Carulli, J.M., Anderson, T.J., Daasch, W.R.

    “…Burn-in and the concomitant post-burn-in retest are significant cost adders to the overall IC manufacturing and test process. Methods to reduce burn-in…”
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    Conference Proceeding
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    Power Supply Noise: A Survey on Effects and Research by Tehranipoor, M., Butler, K.M.

    Published in IEEE design & test of computers (01-03-2010)
    “…As technology scales to 32 nm and functional frequency and density continue to rise, PSN effects, which can reduce a circuit's noise immunity and could lead to…”
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    Journal Article
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    Sure you can get to 100 DPPM in deep submicron, but it'll cost ya by Butler, K.M.

    “…The sub-100 DPPM numbers in deep submicron is being built, but the tolls is fairly steep. Traditional methods using simple fault models and pass/fail testing…”
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    Conference Proceeding