Search Results - "Burghartz, J. N."

A programmable energy efficient readout chip for a multiparameter highly integrated implantable biosensor system by Nawito, M, Richter, H, Stett, A, Burghartz, J N

“…In this work an Application Specific Integrated Circuit (ASIC) for an implantable electrochemical biosensor system (SMART implant, Stett et al., 2014) is…”
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Magnetic-Multilayered Interconnects Featuring Skin Effect Suppression by Yan Zhuang, Rejaei, B., Schellevis, H., Vroubel, M., Burghartz, J.N.

“…A novel concept for a high-frequency, low-loss interconnect with significant skin effect suppression over a wide frequency band is presented. The concept is…”
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Surface-passivated high-resistivity silicon substrates for RFICs by Rong, B., Burghartz, J.N., Nanver, L.K., Rejaei, B., van der Zwan, M.

“…Surface passivation of high-resistivity silicon (HRS) by amorphous silicon thin-film deposition is demonstrated as a novel technique for establishing HRS as a…”
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Analysis of an AlGaN/AlN Super-Lattice Buffer Concept for 650-V Low-Dispersion and High-Reliability GaN HEMTs by Heuken, L., Kortemeyer, M., Ottaviani, A., Schroder, M., Alomari, M., Fahle, D., Marx, M., Heuken, M., Kalisch, H., Vescan, A., Burghartz, J. N.

“…In this article, an optimized carbon-doped AlGaN/AlN super-lattice (SL) buffer structure for GaN-based high electron mobility transistors, grown on 200-mm Si…”
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Evaluation of High-Temperature High-Frequency GaN-Based LC-Oscillator Components by Ottaviani, A., Palacios, P., Zweipfennig, T., Alomari, M., Beckmann, C., Bierbusse, D., Wieben, J., Ehrler, J., Kalisch, H., Negra, R., Vescan, A., Burghartz, J. N.

“…In this work, an evaluation of the performance of discrete elements intended for an <inline-formula> <tex-math notation="LaTeX">{L}…”
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Thermal effects in suspended RF spiral inductors by Sagkol, H., Sinaga, S., Burghartz, J.N., Rejaei, B., Akhnoukh, A.

“…Self-heating effects on integrated suspended and bulk spiral inductors are explored. A dc current is fed through the inductors during measurement to emulate dc…”
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Integrated chip-size antennas for wireless microsystems: Fabrication and design considerations by Mendes, P.M., Polyakov, A., Bartek, M., Burghartz, J.N., Correia, J.H.

“…This paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless…”
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Ultra-thin Image Sensor Chip Embeded Foil by Wang, S., Albrecht, B., Harendt, C., Schulze Spuntrup, J. D., Burghartz, J. N.

“…Hybrid Systems in Foil (HySiF) is an integration concept for high-performance and large-area flexible electronics. The technology allows for integrating…”
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Frequency-Characterization and Modeling of AlGaN/GaN HEMTs for High-Power Applications by Garcia-Luque, A., Martin-Guerrero, T. M., Pradhan, M., Moser, M., Alomari, M., Burghartz, J. N., Schoch, B., Sharma, K., Kallfass, I.

“…An accurate HEMT equivalent model extraction strategy is described and tested for the RF performance of AlGaN/GaN high-power devices. This method provides the…”
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On the design of RF spiral inductors on silicon by Burghartz, J.N., Rejaei, B.

“…This review of design principles for implementation of a spiral inductor in a silicon integrated circuit fabrication process summarizes prior art in this…”
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Large area Silicon-energy filters for ion implantation by Steinbach, T., Csato, C., Krippendorf, F., Letzkus, F., Rüb, M., Burghartz, J.N.

“…In this work we present the first time to our knowledge a large area Si-energy filter for ion implantation based on a 150 mm SOI Wafer Flow Process. The filter…”
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Review of add-on process modules for high-frequency silicon technology by Burghartz, J.N.

“…Add-on process modules as enhancements for standard high-frequency silicon integration processes are discussed. Such modules can cost-effectively be added…”
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A new approach to determine development model parameters by employing the isotropy of the development process by Kaspar, C., Butschke, J., Irmscher, M., Martens, S., Burghartz, J.N.

“…There is an increasing demand for high-resolution three-dimensional (3D) structures as for instance micro-optical lenses or blazed gratings. The fabrication of…”
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GHz bandstop microstrip filter using patterned Ni78Fe22 ferromagnetic film by Zhuang, Y, Rejaei, B, Boellaard, E, Vroubel, M, Burghartz, J N

“…A series of microstrips with patterned Ni78Fe22 ferromagnetic cores have been investigated for RF applications. The devices have been integrated onto a silicon…”
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Integrated RF inductors with micro-patterned NiFe core by Zhuang, Y., Vroubel, M., Rejaei, B., Burghartz, J.N.

“…Integrated radio-frequency solenoids with micro-patterned magnetic cores for reduced dimensions and compatibility with CMOS/BiCMOS process technology are…”
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Monocrystalline thin-film waferlevel encapsulation of microsystems using porous silicon by Prümm, A., Kraft, K.-H., Gottschling, P., Ahles, M., Armbruster, S., Metz, M., Burghartz, J.N.

“…A new technology for thin-film MEMS encapsulation based on a monocrystalline silicon membrane and interfacial bonding is presented. The thickness of the…”
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Substrate effects in monolithic RF transformers on silicon by Ng, K.T., Rejaei, B., Burghartz, J.N.

“…The effect of substrate RF losses on the characteristics of silicon-based integrated transformers is studied experimentally by using a substrate transfer…”
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Integrated tunable magnetic RF inductor by Vroubel, M., Yan Zhuang, Rejaei, B., Burghartz, J.N.

“…We demonstrate, for the first time to our knowledge, a passive, electrically tunable integrated radio frequency (RF) inductor based on a planar solenoid with a…”
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Photoresist coating methods for the integration of novel 3-D RF microstructures by Nga Phuong Pham, Boellaard, E., Burghartz, J.N., Sarro, P.M.

“…This paper presents three coating methods of photoresist on large three-dimensional (3-D) topography surfaces. Two special methods, spray and electrodeposition…”
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Substrate options and add-on process modules for monolithic RF silicon technology by Burghartz, J.N., Bartek, M., Rejaei, B., Sarro, P.M., Polyakov, A., Pham, N.P., Boullaard, E., Ng, K.T.

“…Add-on process modules as enhancements of standard high-frequency silicon integration processes are discussed. Such modules can be added without any…”
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