Search Results - "Burghartz"
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1
On the design of RF spiral inductors on silicon
Published in IEEE transactions on electron devices (01-03-2003)“…This review of design principles for implementation of a spiral inductor in a silicon integrated circuit fabrication process summarizes prior art in this…”
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2
Small contact resistance and high-frequency operation of flexible low-voltage inverted coplanar organic transistors
Published in Nature communications (08-03-2019)“…The contact resistance in organic thin-film transistors (TFTs) is the limiting factor in the development of high-frequency organic TFTs. In devices fabricated…”
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3
Flexible low-voltage high-frequency organic thin-film transistors
Published in Science advances (01-05-2020)“…Optimized materials and device design lead to record static and dynamic performance of organic thin-film transistors. The primary driver for the development of…”
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4
Contact Resistance and Megahertz Operation of Aggressively Scaled Organic Transistors
Published in Small (Weinheim an der Bergstrasse, Germany) (09-01-2012)“…Bottom‐gate, top‐contact organic thin‐film transistors (TFTs) with excellent static characteristics (on/off ratio: 107; intrinsic mobility: 3 cm2 (V s)−1) and…”
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5
Flexible Low-Voltage Organic Complementary Circuits: Finding the Optimum Combination of Semiconductors and Monolayer Gate Dielectrics
Published in Advanced materials (Weinheim) (14-01-2015)“…Low‐voltage p‐channel and n‐channel organic transistors with channel lengths down to 0.5 μm using four small‐molecule semiconductors and ultra‐thin dielectrics…”
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6
Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al2O3–TiO2 Nanolaminates
Published in ACS applied materials & interfaces (29-03-2023)“…Plasma-enhanced atomic layer deposition (PEALD) is utilized to improve the barrier properties of an organic chip-film patch (CFP) when it is used as an implant…”
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7
A New Fabrication and Assembly Process for Ultrathin Chips
Published in IEEE transactions on electron devices (01-02-2009)“…A new ultrathin chip fabrication and assembly process, consisting of a preprocess module Chipfilm and a postprocess module Pick, Crack, and Place, is…”
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8
Bridging the gap between optical fibers and silicon photonic integrated circuits
Published in Optics express (27-01-2014)“…We present a rigorous approach for designing a highly efficient coupling between single mode optical fibers and silicon nanophotonic waveguides based on…”
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9
Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al 2 O 3 -TiO 2 Nanolaminates
Published in ACS applied materials & interfaces (29-03-2023)“…Plasma-enhanced atomic layer deposition (PEALD) is utilized to improve the barrier properties of an organic chip-film patch (CFP) when it is used as an implant…”
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Journal Article -
10
Roadmap to Gigahertz Organic Transistors
Published in Advanced functional materials (01-05-2020)“…Despite the large body of research conducted on organic transistors, the transit frequency of organic field‐effect transistors has seen virtually no…”
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11
High Dynamic Range CMOS Imager Technologies for Biomedical Applications
Published in IEEE journal of solid-state circuits (01-01-2009)“…Apart from the ongoing debate about using CMOS active pixel sensors (APS) or CCD imagers for today's consumer and commercial applications the emerging…”
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Journal Article Conference Proceeding -
12
Model and Simulation of GaN-Based Pressure Sensors for High Temperature Applications-Part II: Sensor Design and Simulation
Published in IEEE sensors journal (15-09-2021)“…In this part, design and optimization guidelines are presented for an Aluminium Gallium Nitride (AlGaN)/GaN-on-Silicon (Si) High Electron Mobility Transistor…”
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13
Consistent Surface-Potential-Based Modeling of Drain and Gate Currents in AlGaN/GaN HEMTs
Published in IEEE transactions on electron devices (01-02-2020)“…In this article, the gate current in AlGaN/GaN high-electron mobility transistors is modeled in a surface potential-based compact model. The thermionic…”
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14
Model and Simulation of GaN-Based Pressure Sensors for High Temperature Applications-Part I: Physics Based Compact Modeling
Published in IEEE sensors journal (15-09-2021)“…In this work, physical compact modelling of Gallium Nitride High Electron Mobility Transistor (GaN HEMT) based pressure sensor for high temperature…”
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15
Surface-passivated high-resistivity silicon substrates for RFICs
Published in IEEE electron device letters (01-04-2004)“…Surface passivation of high-resistivity silicon (HRS) by amorphous silicon thin-film deposition is demonstrated as a novel technique for establishing HRS as a…”
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16
A 3.3 V 6-Bit 100 kS/s Current-Steering Digital-to-Analog Converter Using Organic P-Type Thin-Film Transistors on Glass
Published in IEEE journal of solid-state circuits (01-01-2012)“…A 3.3 V 6-bit binary-weighted current-steering digital-to-converter converter (DAC) using low-voltage organic p-type thin-film transistors (OTFTs) is…”
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Journal Article Conference Proceeding -
17
Integrated tunable magnetic RF inductor
Published in IEEE electron device letters (01-12-2004)“…We demonstrate, for the first time to our knowledge, a passive, electrically tunable integrated radio frequency (RF) inductor based on a planar solenoid with a…”
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18
Detailed analysis and contact properties of low-voltage organic thin-film transistors based on dinaphtho[2,3-b:2′,3′-f]thieno[3,2-b]thiophene (DNTT) and its didecyl and diphenyl derivatives
Published in Organic electronics (01-08-2016)“…Low-voltage organic thin-film transistors (TFTs) based on four different small-molecule semiconductors (pentacene, DNTT…”
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19
Low‐Voltage, High‐Frequency Organic Transistors and Unipolar and Complementary Ring Oscillators on Paper
Published in Advanced electronic materials (01-02-2019)“…Paper substrates for flexible, mobile, and disposable electronic applications draw academic and commercial attention due to their many advantages, such as cost…”
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20
Photoresist coating methods for the integration of novel 3-D RF microstructures
Published in Journal of microelectromechanical systems (01-06-2004)“…This paper presents three coating methods of photoresist on large three-dimensional (3-D) topography surfaces. Two special methods, spray and electrodeposition…”
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