Search Results - "Burchett, Steven N."

Stresses during thermoset cure by Adolf, Douglas B., Martin, James E., Chambers, Robert S., Burchett, Steven N., Guess, Thomas R.

“…Production problems attributed to excessive stresses generated during the cure of epoxies led us to develop a formalism to predict these stresses. In our first…”
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Calculation and validation of thermomechanical stresses in flip chip BGA using the ATC4.2 test vehicle by Peterson, D.W., Burchett, S.N., Sweet, J.N., Mitchell, R.T., Luu Nguyen

“…We report the first in situ measurements of thermomechanical stresses in a 1000 I/O 250 /spl mu/m pitch piezoresistive flip chip test chip assembled to a 755…”
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Nonlinear structural analysis of complex electronic and electromechanical assemblies by Biffle, Johnny H., Burchett, Steven N.

“…The finite-element technique, which is particularly well suited to problems with complex geometries, has been extensively used in structural mechanics. For the…”
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Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method by Peterson, D.W., Sweet, J.N., Burchett, S.N., Hsia, A.

“…We report the first measurements of in-situ flip-chip assembly mechanical stresses using a CMOS piezoresistive test chip repatterned with a fine pitch full…”
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