Search Results - "Budiman, A.S."

Thermomechanical residual stress evaluation in multi-crystalline silicon solar cells of photovoltaic modules with different encapsulation polymers using synchrotron X-ray microdiffraction by Tippabhotla, Sasi Kumar, Diesta, Noel G., Zhang, Xingui, Sridhara, Shankar, Stan, C.V., Tamura, N., Tay, Andrew A.O., Budiman, A.S.

“…Photovoltaic (PV) module reliability issues, due to silicon cell cracking, are gaining more and more attention due to increasing demand for solar power and…”
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Plasticity evolution in nanoscale Cu/Nb single-crystal multilayers as revealed by synchrotron X-ray microdiffraction by Budiman, A.S., Narayanan, Karthic R., Li, N., Wang, J., Tamura, N., Kunz, M., Misra, A.

“…In this study, the evolution of dislocation densities during compressive deformation of nanoscale Cu/Nb single crystal multilayers with individual layer…”
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Enabling thin silicon technologies for next generation c-Si solar PV renewable energy systems using synchrotron X-ray microdiffraction as stress and crack mechanism probe by Budiman, A.S., Illya, G., Handara, V., Caldwell, W.A., Bonelli, C., Kunz, M., Tamura, N., Verstraeten, D.

“…Recently, there has been a strong commercial push toward thinner silicon in the solar photovoltaic (PV) technologies due to the significant cost reduction…”
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Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits by Budiman, A.S., Shin, H.-A.-S., Kim, B.-J., Hwang, S.-H., Son, H.-Y., Suh, M.-S., Chung, Q.-H., Byun, K.-Y., Tamura, N., Kunz, M., Joo, Y.-C.

“…[Display omitted] Through-silicon via (TSV) has been used for 3-dimentional integrated circuits. Mechanical stresses in Cu and Si around the TSV were measured…”
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A search for evidence of strain gradient hardening in Au submicron pillars under uniaxial compression using synchrotron X-ray microdiffraction by Budiman, A.S., Han, S.M., Greer, J.R., Tamura, N., Patel, J.R., Nix, W.D.

“…When crystalline materials are mechanically deformed in small volumes, higher stresses are needed for plastic flow. This has been called the “smaller is…”
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Effects of interface shear strength during failure of semicoherent Metal–Metal nanolaminates: An example of accumulative roll-bonded Cu/Nb by Radchenko, I., Anwarali, H.P., Tippabhotla, S.K., Budiman, A.S.

“…Plastic deformation mechanisms in metal–metal nanolayer composites (nanolaminates) have been studied extensively during the last decade. It has been observed…”
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Effect of interconnect geometry on the evolution of stresses in a solar photovoltaic laminate during and after lamination by Song, W.J.R., Tippabhotla, S.K., Tay, A.A.O., Budiman, A.S.

“…Fracture in silicon crystalline solar cells has been a long-standing challenge encountered in the photovoltaic (PV) industry. This occurs as result of stresses…”
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Effect of encapsulants on the thermomechanical residual stress in the back-contact silicon solar cells of photovoltaic modules – A constrained local curvature model by Tippabhotla, Sasi Kumar, Song, W.J.R., Tay, Andrew A.O., Budiman, A.S.

“…•The effect of the encapsulants on the IBC silicon cell stresses in a PV module were studied using finite element analysis.•The encapsulant modulus and…”
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Enabling lightweight polycarbonate-polycarbonate (PC-PC) photovoltaics module technology – Enhancing integration of silicon solar cells into aesthetic design for greener building and urban structures by Budiman, A.S., Illya, G., Anbazhagan, S., Tippabhotla, S.K., Song, W.J., Sahay, R., Tay, A.A.O.

“…•Unique and aesthetic Polycarbonate-sandwiched PV module design.•PC-EVA interface adherence is fully investigated using WTCB method.•New proposed method for…”
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Probing stress and fracture mechanism in encapsulated thin silicon solar cells by synchrotron X-ray microdiffraction by Handara, V.A., Radchenko, I., Tippabhotla, S.K., R.Narayanan, Karthic, Illya, G., Kunz, M., Tamura, N., Budiman, A.S.

“…Thin (<150 µm) silicon solar cell technology is attractive due to the significant cost reduction associated with it. Consequently, fracture mechanisms in the…”
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Enabling curvable silicon photovoltaics technology using polycarbonate-sandwiched laminate design by Budiman, A.S., Anbazhagan, S., Illya, G., Song, W.J.R., Sahay, R., Tippabhotla, S.K., Tay, A.A.O.

“…•Curving of fragile, brittle silicon solar cell is allowed with the Polycarbonate-sandwiched laminate design.•Highly compressive stress state in silicon solar…”
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Growth and structural characterization of epitaxial Cu/Nb multilayers by Budiman, A.S., Li, N., Wei, Q., Baldwin, J.K., Xiong, J., Luo, H., Trugman, D., Jia, Q.X., Tamura, N., Kunz, M., Chen, K., Misra, A.

“…Electron beam evaporation with optimized deposition parameters has been used to grow good quality epitaxial Cu/Nb nanoscale multilayered films on sapphire…”
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Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment by Budiman, A.S., Hau-Riege, C.S., Baek, W.C., Lor, C., Huang, A., Kim, H.S., Neubauer, G., Pak, J., Besser, P.R., Nix, W.D.

“…While Black’s equation for electromigration (EM) in interconnects with n  = 1 is rigorously based on the principles of electrotransport, n  > 1 is more…”
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Electromigration-Induced Plasticity: Texture Correlation and Implications for Reliability Assessment by Budiman, A.S., Besser, P.R., Hau-Riege, C.S., Marathe, A., Joo, Y.-C., Tamura, N., Patel, J.R., Nix, W.D.

“…Plastic behavior has previously been observed in metallic interconnects undergoing high-current-density electromigration (EM) loading. In this study of Cu…”
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Crystal Plasticity in Cu Damascene Interconnect Lines UndergoingElectromigration As Revealed by Synchrotron X-Ray Microdiffraction by Budiman, A.S., Nix, W.D., Tamura, N., Valek, B.C., Gadre, K., Maiz, J., Spolenak, R., Patel, J.R.

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Electromigration-induced Plasticity: Texture Correlation and Implications for Reliability Assessment by Budiman, A.S., Besser, P.R., Hau-Riege, C.S., Marathe, A., Joo, Y.-C., Tamura, N., Patel, J.R., Nix, W.D.

“…Plastic behavior has previously been observed in metallic interconnects undergoing high current density electromigration (EM) loading. In this study of Cu…”
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Critical temperature shift for Stress Induced Voiding in advanced Cu interconnects for 32 nm and beyond by Morusupalli, Rao, Rao, Richard, Tae-Kyu Lee, Yu-Lin Shen, Kunz, M., Tamura, N., Budiman, A. S.

“…In this paper we present work showing evidence of a shift in the Stress Migration (SM) peak profile temperature for smaller interconnect linewidths typically…”
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Plasticity-Amplified Diffusivity: Dislocation Cores as Fast Diffusion Paths in CU Interconnects by Budiman, A.S., Hau-Riege, C.S., Besser, P.R., Marathe, A., Joo, Y.-C., Tamura, N., Patel, J.R., Nix, W.D.

“…The mass transport of Cu during electromigration (EM) testing is typically dominated by interface diffusion. If a mechanism other than interface diffusion…”
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