Search Results - "Brozek, Tomasz"

Design and Measurement Requirements for Short Flow Test Arrays to Characterize Emerging Memories by Brozek, Tomasz, Ciplickas, Dennis

“…Emerging non-volatile memories are becoming increasingly attractive for embedded and storage-class applications. Among the development challenges of Back-End…”
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Application of e-Beam Voltage Contrast Technique for Overlay Improvement and Process Window Control in Multi-Patterning Interconnect Scheme by Yang, Linrong, Li, Runling, Hsu, Ikai, Zhang, Haiqiong, Ren, Jiadong, Zhou, Wenzhan, Sun, Linlin, Xue, Yawen, Yang, Wenchao, Zhang, Ruilin, Zhu, Yefang, Zhang, Yan, Zhang, Guifeng, Fu, Yingying, Yin, Shan, Jia, Yujie, Yu, Bo, Brozek, Tomasz

“…Interconnect development for the new technology node requires coordinated efforts of multiple module teams working to co-optimize patterning and metallization…”
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Seasonal changes in force production accuracy as a measure of kinesthesia in motorcyclists by Szczepan, Stefan, Błacha, Ryszard, Brożek, Tomasz, Zatoń, Krystyna

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Advanced Silicon Technologies: Design Consequences of Scaling Solutions for Devices by Brozek, Tomasz

“…Despite multiple roadblocks and 'red-brick" walls identified on its path, the Moore's Law continues towards single Angstrom digits, promising further…”
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Modeling Stress Effects from Fin Isolation in 7nm FinFET Transistors by Rossoni, Angelo, Kovacs-Vajna, Zsolt M., Colalongo, Luigi, Khamankar, Rajesh, Saxena, Sharad, Brozek, Tomasz

“…This paper investigates the impact of stress, developed during FinFET device fabrication, on electrical characteristics in a 7nm node silicon VLSI technology,…”
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In-Product BTI Aging Sensor for Reliability Screening and Early Detection of Material at Risk by Brozek, Tomasz, Piadena, Alberto, Weiland, Larg, Quarantelli, Michele, Coccoli, Alberto, Saxena, Sharad, Hess, Christopher, Strojwas, Andrzej

“…We have developed a new reliability monitoring suite, within a proprietary IP block that we call a CV® Core, with aging sensors embedded in the product layout…”
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Short-Flow Compatible Wafer-Level Reliability Assessment and Monitoring for PCM Embedded Non-Volatile Memory by Lunenborg, Meindert, Brozek, Tomasz, Lorenzi, Laura, Dolainsky, Christoph, Liu, Violet, Feng, Xiaoyi

“…In this paper, we present newly developed, short-flow compatible, Phase-Change Memory (PCM) single bit cell monitors and their characterization, including…”
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DFI Filler Cells - New Embedded Type of Test Structures for Non-Contact Detection of Electrical Defects on Product Wafers by Lam, Stephen, Hess, Christopher, Weiland, Larg, Moe, Matthew, Shen, Xumin William, Chen, John, De, Indranil, Strojwas, Marcin, Brozek, Tomasz

“…A new type of test structures has been developed for process monitoring and defect detection on product wafers. The structures are part of PDF Solutions'…”
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Contact Chains for FinFET Technology Characterization by Brozek, Tomasz, Lam, Stephen, Yu, Shia, Pak, Mike K., Liu, Tom, Vallishayee, Rakesh, Yokoyama, Nobuharu

“…Electrical characterization remains a key element in technology development and manufacturing of integrated circuits. Contact chain is a well known part of the…”
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PII: S0026-2714(04)00208-2 by Brozek, Tomasz

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Short Flow Characterization Vehicle (Test Chip) Usage in Advanced Technology Development and Yield Improvement by Brozek, Tomasz

“…Short flow Characterization Vehicles® can be used at early development phase and offer short learning cycles. Their main usage is to support patterning scheme,…”
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Threshold voltage degradation in plasma-damaged CMOS transistors — Role of electron and hole traps related to charging damage by Brożek, Tomasz, David Chan, Y., Viswanathani, Chand R.

“…The paper presents results of study of threshold voltage (VT) degradation in CMOS transistors damaged by high-field charging. Fowler-Nordheim stress induced VT…”
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Evaluation of Truly Passive Crossbar Memory Arrays on Short Flow Characterization Vehicle Test Chips by Hess, Christopher, Brozek, Tomasz, Schneider, Hendrik, Yu, Yuan, Lunenborg, Meindert, Ng, Khim Hong, Ciplickas, Dennis, Vallishayee, Rakesh, Dolainsky, Christoph, Weiland, Larg H.

“…More and more non volatile memory bit cell candidates are emerging which can be implemented between two metal layers in the BEOL process. Thus, short flow…”
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Cross Point Test Arrays for Development and Yield Ramp of Emerging Memories by Brozek, Tomasz, Ciplickas, Dennis

“…New non-volatile memory types are becoming increasingly attractive for embedded and storage-class applications. Among the development challenges to insert…”
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Negative-Bias-Temperature Instability (NBTI) in MOS devices special sectio n by BROZEK, Tomasz, VINCENT, E

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Gated contact chains for process characterization in FinFET technologies by Brozek, Tomasz, Lam, Stephen, Shia Yu, Pak, Mike, Liu, Tom, Valishayee, Rakesh, Yokoyama, Nobuharu

“…Contact Chain is a well known element of the diagnostic set of test structures used across many generations of silicon processes. Implementation of such test…”
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New paradigm of Yield analysis in Big Data and AI Era in Semiconductor Manufacturing by David, Jeffrey, Gupta, Ashutosh, Bamb, Rishi, Akar, Said, Holt, Jonathan, Strojwas, Andrzej, Brozek, Tomasz

“…The paper describes how the semiconductor product yield analysis evolved from simple one-way correlation analysis limited by siloed data into powerful cloud…”
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Generation of hole traps in thin silicon oxide layers under high-field electron injection by Brożek, Tomasz, Viswanathan, Chand R.

“…The letter reports an observation of a new degradation mechanism in thermal silicon dioxide layers on silicon, namely generation of hole traps under high-field…”
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Monitoring of wafer thinning induced in-die mechanical stress with embedded sensors for heterogeneous integration by Piadena, Alberto, Quarantelli, Michele, Brozek, Tomasz, Saxena, Sharad, Hess, Christopher, Weiland, Larg, Vallishayee, Rakesh, Yu, Yuan, Strojwas, Andrzej

“…The paper describes a new type of in-die monitor sensors for in-situ detection of changes in the level of mechanical stress experienced by silicon product die…”
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Monitoring Product Chip Health with In-die Quality Monitors by Brozek, Tomasz, Piadena, Alberto, Quarantelli, Michele, Weiland, Larg, Hess, Christopher, Saxena, Sharad, Yu, Yuan, Vallishayee, Rakesh, Strojwas, Andrzej

“…This study presents a new type of silicon-embedded chip health monitoring sensors. They extend data collection well beyond typically assessed, to include such…”
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