Search Results - "Bravman, J C"

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  1. 1

    High spatial resolution grain orientation and strain mapping in thin films using polychromatic submicron x-ray diffraction by Tamura, N., MacDowell, A. A., Celestre, R. S., Padmore, H. A., Valek, B., Bravman, J. C., Spolenak, R., Brown, W. L., Marieb, T., Fujimoto, H., Batterman, B. W., Patel, J. R.

    Published in Applied physics letters (20-05-2002)
    “…The availability of high brilliance synchrotron sources, coupled with recent progress in achromatic focusing optics and large area two-dimensional detector…”
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    Journal Article
  2. 2

    Subcritical debonding of polymer/silica interfaces under monotonic and cyclic loading by Snodgrass, J.M., Pantelidis, D., Jenkins, M.L., Bravman, J.C., Dauskardt, R.H.

    Published in Acta materialia (24-05-2002)
    “…The effects of interface chemistry and alternating mechanical loads on subcritical debonding of thin polymer layers from inorganic dielectrics are of…”
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    Journal Article
  3. 3

    Thermal strain and stress in copper thin films by Vinci, R.P., Zielinski, E.M., Bravman, J.C.

    Published in Thin solid films (15-06-1995)
    “…Desired improvements in the performance and reliability of integrated circuit interconnects may necessitate a move from aluminum alloys to copper. Before…”
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    Journal Article
  4. 4

    Local plasticity of Al thin films as revealed by x-ray microdiffraction by Spolenak, R, Brown, W L, Tamura, N, MacDowell, A A, Celestre, R S, Padmore, H A, Valek, B, Bravman, J C, Marieb, T, Fujimoto, H, Batterman, B W, Patel, J R

    Published in Physical review letters (07-03-2003)
    “…Grain-to-grain interactions dominate the plasticity of Al thin films and establish effective length scales smaller than the grain size. We have measured large…”
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    Journal Article
  5. 5

    Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect by Barabash, R.I, Ice, G.E, Tamura, N, Valek, B.C, Bravman, J.C, Spolenak, R, Patel, J.R

    Published in Microelectronic engineering (01-07-2004)
    “…Electromigration-induced failure in metal interconnect constitutes a major reliability problem in the semiconductor industry. Recently, experimental techniques…”
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    Journal Article Conference Proceeding
  6. 6

    Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films by Weihs, T. P., Hong, S., Bravman, J. C., Nix, W. D.

    Published in Journal of materials research (01-10-1988)
    “…The mechanical deflection of cantilever microbeams is presented as a new technique for testing the mechanical properties of thin films. Single-layer microbeams…”
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    Journal Article
  7. 7

    Important factors for silane adhesion promoter efficacy: surface coverage, functionality and chain length by Jenkins, M. L., Dauskardt, R. H., Bravman, J. C.

    Published in Journal of adhesion science and technology (01-01-2004)
    “…The effects of an ammonia-based catalyst, surface coverage, organofunctional group and chain length on silane adhesion promoter efficacy were examined at a…”
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    Journal Article
  8. 8

    The influence of strain energy on abnormal grain growth in copper thin films by Zielinski, E. M., Vinci, R. P., Bravman, J. C.

    Published in Applied physics letters (21-08-1995)
    “…Biaxial stress and strain in (100) and (111) oriented grains have been measured as a function of annealing temperature for a Cu film on an oxidized Si…”
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    Journal Article
  9. 9

    Formation of titanium silicide on narrow gates using laser thermal processing by Verma, G., Gelatos, C., Talwar, S., Bravman, J.C.

    Published in IEEE transactions on electron devices (01-01-2002)
    “…One of the crucial issues that must be faced when using titanium silicide in advanced IC structures is the difficulty encountered in transforming the silicide…”
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    Journal Article
  10. 10

    Differential thermal budget in laser processing: application to formation of titanium silicide by Verma, G., Talwar, S., Bravman, J.C.

    Published in IEEE electron device letters (01-10-2000)
    “…One of the crucial issues that must be faced when using titanium silicide in advanced IC structures is the difficulty encountered in phase transforming the…”
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    Journal Article
  11. 11
  12. 12

    Electromigration-induced plastic deformation in passivated metal lines by Valek, B. C., Bravman, J. C., Tamura, N., MacDowell, A. A., Celestre, R. S., Padmore, H. A., Spolenak, R., Brown, W. L., Batterman, B. W., Patel, J. R.

    Published in Applied physics letters (25-11-2002)
    “…We have used scanning white beam x-ray microdiffraction to study microstructural evolution during an in situ electromigration experiment on a passivated Al(Cu)…”
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    Journal Article
  13. 13

    Submicron X-ray diffraction by MacDowell, A.A., Celestre, R.S., Tamura, N., Spolenak, R., Valek, B., Brown, W.L., Bravman, J.C., Padmore, H.A., Batterman, B.W., Patel, J.R.

    “…At the Advanced Light Source in Berkeley we have instrumented a beam line that is devoted exclusively to X-ray micro-diffraction problems. By micro-diffraction…”
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    Journal Article
  14. 14

    Separation of film thickness and grain boundary strengthening effects in Al thin films on Si by Venkatraman, Ramnath, Bravman, John C.

    Published in Journal of materials research (01-08-1992)
    “…We have measured stress variations with temperature as a function of film thickness and a given grain size in pure Al and Al–0.5% Cu films on Si substrates…”
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    Journal Article
  15. 15

    Thickness dependence of the twin density in YBa2Cu3O7-δ thin films sputtered onto MgO substrates by STREIFFER, S. K, ZIELINSKI, E. M, LAIRSON, B. M, BRAVMAN, J. C

    Published in Applied physics letters (13-05-1991)
    “…The lengths and spacings of twins in YBa2Cu3O7−δ thin films deposited onto MgO substrates have been measured by transmission electron microscopy as a function…”
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    Journal Article
  16. 16

    Stress relaxation in free-standing aluminum beams by Lee, Hoo-Jeong, Zhang, Ping, Bravman, John C.

    Published in Thin solid films (01-04-2005)
    “…The stress-relaxation behavior of 2-μm-thick free-standing thin-film aluminum beams was evaluated by using a piezoelectric-actuated mechanical tester, which…”
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    Journal Article
  17. 17

    Microwave properties of highly oriented YBa2Cu3O7-x thin films by INAM, A, WU, X. D, MOFFAT, D, RUBIN, D, SHU, Q. S, KALOKITIS, D, FATHY, A, PENDRICK, V, BROWN, R, BRYXKI, B, BELOHOUBEK, E, DRABECK, L, NAZAR, L, HEGDE, M. S, ROGERS, C. T, VENKATESAN, T, SIMON, R. W, DALY, K, PADAMSEE, H, KIRCHGESSNER, J

    Published in Applied physics letters (19-03-1990)
    “…We have performed intra- and extra-cavity microwave frequency (1–100 GHz) measurements on high quality Y1Ba2Cu3O7−x superconducting thin films on (100) LaAlO3…”
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    Journal Article
  18. 18

    Physics, technology, and modeling of polysilicon emitter contacts for VLSI bipolar transistors by Patton, G.L., Bravman, J.C., Plummer, J.D.

    Published in IEEE transactions on electron devices (01-11-1986)
    “…The physics of minority-carrier injection into polysilicon-contacted emitters has been studied through a series of experiments correlating the base current of…”
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    Journal Article
  19. 19

    Molecular beam epitaxy of layered Dy-Ba-Cu-O compounds by SCHLOM, D. G, ECKSTEIN, J. N, TURNER, F, HELLMAN, E. S, STREIFFER, S. K, HARRIS, J. S. JR, BEASLEY, M. R, BRAVMAN, J. C, GEBALLE, T. H, WEBB, C, VON DESSONNECK, K. E

    Published in Applied physics letters (24-10-1988)
    “…Heteroepitaxial Dy-Ba-Cu-O films have been grown in situ on SrTiO3 substrates using an oxygen plasma beam and elemental source beams in a modified molecular…”
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    Journal Article
  20. 20

    Growth of YBa2Cu3O7-δ on vicinally polished MgO substrates by STREIFFER, S. K, LAIRSON, B. M, BRAVMAN, J. C

    Published in Applied physics letters (03-12-1990)
    “…YBaCu3O7−δ thin films were grown on vicinally polished MgO [001] substrates. The orientation of the films is strongly influenced by the substrate surface…”
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    Journal Article