Search Results - "Braunisch, H."

Wave Propagation in a Randomly Rough Parallel-Plate Waveguide by Ruihua Ding, Tsang, L., Braunisch, H.

“…We study the effects of random rough surface on electromagnetic wave propagation in a parallel-plate waveguide excited by a line source. The second-order small…”
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Effects of random rough surface on absorption by conductors at microwave frequencies by Leung Tsang, Xiaoxiong Gu, Braunisch, H.

“…The effects of a random rough surface on the absorption by a metallic surface at microwave frequencies are analyzed by using two methods: the analytic small…”
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Modeling Effects of Random Rough Interface on Power Absorption Between Dielectric and Conductive Medium in 3-D Problem by Xiaoxiong Gu, Leung Tsang, Braunisch, H.

“…We study the effects of a random rough surface on the power absorption between a dielectric and conductive medium in a 3-D configuration where the surface…”
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Estimation of Roughness-Induced Power Absorption From Measured Surface Profile Data by Xiaoxiong Gu, Leung Tsang, Braunisch, H.

“…We present a methodology for extracting the 2D power spectral density of a statistically isotropic random rough surface from height measurements by utilizing…”
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A multiplicative regularization approach for deblurring problems by Abubakar, A., van den Berg, P.M., Habashy, T.M., Braunisch, H.

“…In this work, an iterative inversion algorithm for deblurring and deconvolution is considered. The algorithm is based on the conjugate gradient scheme and uses…”
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Quasi-magnetostatic solution for a conducting and permeable spheroid with arbitrary excitation by Ao, C.O., Braunisch, H., O'Neill, K., Kong, J.A.

“…Broad-band electromagnetic induction (EMI) methods are promising in the detection and discrimination of subsurface metallic targets. In this paper, the…”
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Magnetoquasistatic response of conducting and permeable prolate spheroid under axial excitation by Braunisch, H., Ao, C.O., O'Neill, K., Kong, J.A.

“…An analytical solution is presented for the problem of magnetic diffusion into and scattering from a permeable, highly but not perfectly conducting prolate…”
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Tapered wave with dominant polarization state for all angles of incidence by Braunisch, H., Zhang, Y., Ao, C.O., Shih, S.-E., Yang, Y.E., Ding, K.-H., Kong, J.A., Tsang, L.

“…Typical applications of the method of moments (MoM) to rough surface three-dimensional (3-D) electromagnetic scattering require a truncation of the surface…”
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Time-domain simulation of large lossy interconnect systems on conducting substrates by Braunisch, H., Grabinski, H.

“…The most general class of uniform transmission-line systems is considered, assuming that samples of the frequency dependent parameter matrices R, L, G, and C…”
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A Broadband Model for Single-Mode Fibers Including Nonlinear Dispersion - Abstract by Grobe, K., Braunisch, H.

“…Coupled equations for the electric and magnetic fields describing pulse-envelope propagation in nonlinear, dispersive single-mode fibers in the frequency…”
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Wave Propagation in Parallel Plate Metallic Waveguide With Finite Conductivity and Three Dimensional Roughness by Ding, R., Leung Tsang, Braunisch, H., Wenmo Chang

“…We study the effects of random roughness on wave propagation in a parallel plate metallic waveguide with finite conductivity. The rough surface is three…”
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Electromagnetic Wave Interaction of Conducting Object With Rough Surface By Hybrid Spm/Mom Technique - Abstract by Zhang, Y., Yang, Y.E., Braunisch, H., Kong, J.A.

“…An electromagnetic wave scattering model based on a hybrid SPM/MoM technique has been developed for the study of the EM wave interaction of a conducting object…”
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High-Speed Flex-Circuit Chip-to-Chip Interconnects by Braunisch, H., Jaussi, J.E., Mix, J.A., Trobough, M.B., Horine, B.D., Prokofiev, V., Daoqiang Lu, Baskaran, R., Meier, P.C.H., Dong-Ho Han, Mallory, K.E., Leddige, M.W.

“…High-speed chip-to-chip interconnect utilizing flex-circuit technology is investigated for extending the lifetime of copper-based system-level channels. Proper…”
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Random Rough Surface Effects in Waveguides Using Mode Matching Technique and the Method of Moments by Ruihua Ding, Leung Tsang, Braunisch, H.

“…To address the rough surface effects in high speed interconnects on printed circuit boards and microelectronic packages, we study the electromagnetic wave…”
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Broadband characterization of package dielectrics by Braunisch, H., Dong-Ho Han

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On the techniques of clock extraction and oversampling by Braunisch, H., Raj Nair

“…Based on a probabilistic analysis, we compare and contrast the characteristics of two well known techniques for data recovery in communication links based on…”
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RF packaging and passives: design, fabrication, measurement, and validation of package embedded inductors by Chickamenahalli, S.A., Braunisch, H., Srinivasan, S., Jiangqi He, Shrivastava, U., Sankman, B.

“…Design, modeling, and characterization of inductors embedded in a package substrate promising higher quality factor (Q) and lower cost than on-chip inductors…”
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Electrical performance of bumpless build-up layer packaging by Braunisch, H., Towle, S.N., Emery, R.D., Chuan Hu, Vandentop, G.J.

“…The bumpless build-up layer (BBUL) microelectronic packaging technology is characterized by the absence of a conventional substrate core and a direct extension…”
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Phase unwrapping of SAR interferograms after wavelet denoising by Braunisch, H., Bae-Ian Wu, Kong, J.A.

“…Obtaining a digital elevation model (DEM) with the help of synthetic aperture radar (SAR) interferometry requires 2D phase unwrapping known to be sensitive to…”
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Compliant die-package interconnects at high frequencies by Braunisch, H., Kyu-Pyung Hwang, Emery, R.D.

“…We investigate the concern that compliant interconnects due to their generally long, thin shape will introduce extra insertion loss for high-frequency signals,…”
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