Search Results - "Bor-Wen Chan"
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Synthesis and properties of thio-containing poly(ether ether ketone)s
Published in Polymer international (01-03-2004)“…A series of thio‐containing poly(ether ether ketone) (PEESK) polymers was synthesized by the introduction of thio groups from 4,4′ thiodiphenol (TDP) into the…”
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Journal Article -
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Plasma induced substrate damage in high dose implant resist strip process
Published in 2003 8th International Symposium Plasma- and Process-Induced Damage (2003)“…In this communication we report our work on the ashing of post high dosage implant photoresist removal. Attention is focused on plasma damage to the silicon…”
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Conference Proceeding -
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Notch elimination in polycide gate stack etching for advanced DRAM technology
Published in 2000 Semiconductor Manufacturing Technology Workshop (Cat. No.00EX406) (2000)“…The notch phenomenon in etching of complex TEOS/oxynitride/WSi/sub x//poly DRAM gate stacks is eliminated by adding N/sub 2/ gas in the poly over-etch (OE)…”
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Conference Proceeding -
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5nm-gate nanowire FinFET
Published in Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004 (2004)“…A new nanowire FinFET structure is developed for CMOS device scaling into the sub-10 nm regime. Accumulation mode P-FET and inversion mode N-FET with 5 nm and…”
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Conference Proceeding -
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Elimination of notch during gate polycide stack etching by adding nitrogen in over etch step
Published in 2000 5th International Symposium on Plasma Process-Induced Damage (IEEE Cat. No.00TH8479) (2000)“…In this paper, the notch phenomenon in sub-quarter-micron DRAM polycide gate etching process is an important issue and is improved by adding N/sub 2/ gas in…”
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Conference Proceeding -
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45nm node planar-SOI technology with 0.296 /spl mu/m/sup 2/ 6T-SRAM cell
Published in Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004 (2004)“…The first 45nm node planar-SOI technology has been developed with 6T-SRAM cell of 0.296 /spl mu/m/sup 2/. An adequate static noise margin of 120mV is obtained…”
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Conference Proceeding -
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A 65nm node strained SOI technology with slim spacer
Published in IEEE International Electron Devices Meeting 2003 (2003)“…A 65 nm node strained SOI technology with high performance is demonstrated, providing drive currents of 1015 and 500 /spl mu/A//spl mu/m for N-FET and P-FET,…”
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Conference Proceeding