Search Results - "Bong, Y.Y."

Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction by Choi, W.J., Lee, T.Y., Tu, K.N., Tamura, N., Celestre, R.S., MacDowell, A.A., Bong, Y.Y., Nguyen, Luu

“…A large number of Sn whiskers have been found on the Pb-free solder finish on leadframes used in consumer electronic products. Some of the whiskers on eutectic…”
Get full text

TiN whiskers studied by synchrotron radiation scanning X-ray micro-diffraction by Choi, W.J., Lee, T.Y., Tu, K.N., Tamura, N., Celestre, R.S., MacDowell, A.A., Bong, Y.Y., Nguyen, Luu

Get full text

Structure and kinetics of Sn whisker growth on Pb-free solder finish by Choi, W.J., Lee, T.Y., Tu, K.N., Tamura, N., Celestre, R.S., Macdowell, A.A., Bong, Y.Y., Nguyen, L., Sheng, G.T.T.

“…Standard leadframes used in surface mount technology are finished with a layer of eutectic SnPb for passivation and for enhancing solder wetting during reflow…”
Get full text

A structured approach to lead-free IC assembly transitioning by Nguyen, L., Walberg, R., Lin, Z., Koh, T., Bong, Y.Y., Chua, M.C., Chuah, S., Yeoh, J.J.

“…Market forces, trade restrictions, and customer perceptions rather than environmental realities have driven the lead-free movement. However, it cannot be…”
Get full text