Multilayer multicomponent semiconductor structures for microelectronics formed using laser and thin film technology
The authors present technological doping processes which enable one to obtain the smallest thicknesses of doped layers (300-500 nm). The use of a laser as a technological tool makes it possible to reduce the thickness of modified layers to 10 nm and to build a fully-automatic low-temperature technol...
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Published in: | Digest IEEE/Leos 1996 Summer Topical Meeting. Advanced Applications of Lasers in Materials and Processing pp. 36 - 37 |
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Main Authors: | , , , |
Format: | Conference Proceeding |
Language: | English |
Published: |
IEEE
1996
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Subjects: | |
Online Access: | Get full text |
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Summary: | The authors present technological doping processes which enable one to obtain the smallest thicknesses of doped layers (300-500 nm). The use of a laser as a technological tool makes it possible to reduce the thickness of modified layers to 10 nm and to build a fully-automatic low-temperature technology for shallow p-n junctions and devices needed in the future. |
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ISBN: | 0780331753 9780780331754 |
DOI: | 10.1109/LEOSST.1996.540668 |