Multilayer multicomponent semiconductor structures for microelectronics formed using laser and thin film technology

The authors present technological doping processes which enable one to obtain the smallest thicknesses of doped layers (300-500 nm). The use of a laser as a technological tool makes it possible to reduce the thickness of modified layers to 10 nm and to build a fully-automatic low-temperature technol...

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Bibliographic Details
Published in:Digest IEEE/Leos 1996 Summer Topical Meeting. Advanced Applications of Lasers in Materials and Processing pp. 36 - 37
Main Authors: Kiyak, S.G., Bonchik, O.Y., Pokhmurska, A.V., Savitsky, G.V.
Format: Conference Proceeding
Language:English
Published: IEEE 1996
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Summary:The authors present technological doping processes which enable one to obtain the smallest thicknesses of doped layers (300-500 nm). The use of a laser as a technological tool makes it possible to reduce the thickness of modified layers to 10 nm and to build a fully-automatic low-temperature technology for shallow p-n junctions and devices needed in the future.
ISBN:0780331753
9780780331754
DOI:10.1109/LEOSST.1996.540668