Search Results - "Boettinger, W.J"

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  1. 1

    Thermodynamics of grain boundary premelting in alloys. I. Phase-field modeling by Mishin, Y., Boettinger, W.J., Warren, J.A., McFadden, G.B.

    Published in Acta materialia (01-08-2009)
    “…The rich nature of the premelting transition of grain boundaries in solid solutions is analyzed. Part I of this paper uses a multi-phase field model, whereas…”
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  2. 2

    Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits by Boettinger, W.J., Johnson, C.E., Bendersky, L.A., Moon, K.-W., Williams, M.E., Stafford, G.R.

    Published in Acta materialia (01-11-2005)
    “…High purity bright Sn, Sn–Cu and Sn–Pb layers, 3, 7 and 16 μm thick were electrodeposited on phosphor bronze cantilever beams in a rotating disk apparatus…”
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  3. 3

    Solidification microstructures: recent developments, future directions by Boettinger, W.J., Coriell, S.R., Greer, A.L., Karma, A., Kurz, W., Rappaz, M., Trivedi, R.

    Published in Acta materialia (01-01-2000)
    “…The status of solidification science is critically evaluated and future directions of research in this technologically important area are proposed. The most…”
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  4. 4

    Computation of the Kirkendall velocity and displacement fields in a one-dimensional binary diffusion couple with a moving interface by Boettinger, W.J, Guyer, J.E, Campbell, C.E, McFadden, G.B

    “…The moving interface problem in a one-dimensional binary α/β diffusion couple is studied using sharp and diffuse interface (Cahn–Hilliard) approaches. With…”
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  5. 5

    Effect of vacancy creation and annihilation on grain boundary motion by McFadden, G.B., Boettinger, W.J., Mishin, Y.

    Published in Acta materialia (15-02-2020)
    “…[Display omitted] Interaction of vacancies with grain boundaries (GBs) is involved in many processes occurring in materials, including radiation damage…”
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  6. 6

    Prediction of dendritic growth and microsegregation patterns in a binary alloy using the phase-field method by Warren, J.A., Boettinger, W.J.

    Published in Acta metallurgica et materialia (01-02-1995)
    “…A comprehensive model is developed for solving the heat and solute diffusion equations during solidification that avoids tracking the liquid—solid interface…”
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  7. 7

    Development of a diffusion mobility database for Ni-base superalloys by Campbell, C.E, Boettinger, W.J, Kattner, U.R

    Published in Acta materialia (25-02-2002)
    “…For the fcc phase of the Ni–Al–Co–Cr–Hf–Mo–Re–Ta–Ti–W system, diffusion data in various constituent binary systems were assessed to establish a multicomponent…”
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  8. 8

    A diffuse-interface model of reactive wetting with intermetallic formation by Villanueva, W., Boettinger, W.J., McFadden, G.B., Warren, J.A.

    Published in Acta materialia (01-05-2012)
    “…A diffuse-interface model of reactive wetting with intermetallic formation is developed that incorporates fluid flow, phase change and solute diffusion. The…”
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  9. 9

    Atomistic simulation of hillock growth by Frolov, T., Boettinger, W.J., Mishin, Y.

    Published in Acta materialia (01-09-2010)
    “…This paper explores the mechanisms of hillock and whisker growth in stressed polycrystalline films by molecular dynamics simulations. The initial geometry…”
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  10. 10

    Thermodynamic model of hydride formation and dissolution in spherical particles by Mishin, Y., Boettinger, W.J.

    Published in Acta materialia (01-09-2010)
    “…A model of hydride formation and dissolution has been proposed for a single spherical particle and for a collection of such particles with a given size…”
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  11. 11

    Solidification of Ni-Re Peritectic Alloys by Boettinger, W. J., Newbury, D. E., Ritchie, N. W. M., Williams, M. E., Kattner, U. R., Lass, E. A., Moon, K.-W., Katz, M. B., Perepezko, J. H.

    “…Differential thermal analysis (DTA) and microstructural and microprobe measurements of DTA and as-cast Ni-Re alloys with compositions between 0.20 and 0.44…”
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  12. 12

    Surface morphologies due to grooves at moving grain boundaries having stress-driven fluxes by Sekerka, R.F., Boettinger, W.J., McFadden, G.B.

    Published in Acta materialia (01-11-2013)
    “…We modify a previous steady-state description developed by Gènin [J. Appl. Phys. 77, 5130–5137 (1995)] for a grain boundary groove moving with a prescribed…”
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  13. 13

    Microstructural characterization of Al-7075-T651 chips and work pieces produced by high-speed machining by Campbell, C.E., Bendersky, L.A., Boettinger, W.J., Ivester, R.

    “…High-speed orthogonal machining produced a series of Al-7075-T651 chips and work pieces for microstructural charcterization. The orthogonal machining…”
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  14. 14

    On dendritic solidification of multicomponent alloys with unequal liquid diffusion coefficients by Rappaz, M., Boettinger, W.J.

    Published in Acta materialia (08-09-1999)
    “…A model has been developed previously by Rappaz and Thévoz ( Acta metall., 1987, 35, 1478; 1987, 35, 2929) for the solidification of binary alloys having an…”
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  15. 15

    Effect of phase change and solute diffusion on spreading on a dissolving substrate by Villanueva, W., Boettinger, W.J., Warren, J.A., Amberg, G.

    Published in Acta materialia (01-12-2009)
    “…Dissolutive wetting is investigated numerically using a diffuse-interface model that incorporates fluid flow, solute diffusion and phase change. A range of…”
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  16. 16

    Examination of Multiphase (Zr,Ti)(V,Cr,Mn,Ni)2 Ni-MH Electrode Alloys: Part I. Dendritic Solidification Structure by Boettinger, W.J., Newbury, D.E., Wang, K., Bendersky, L.A., Chiu, C., Kattner, U.R., Young, K., Chao, B.

    “…The solidification microstructures of three nine-element Zr-Ni–based AB 2 type C14/C15 Laves hydrogen storage alloys are determined. The selected compositions…”
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  17. 17

    Hillock and whisker growth on Sn and SnCu electrodeposits on a substrate not forming interfacial intermetallic compounds by WILLIAMS, M. E, MOON, K.-W, BOETTINGER, W. J, JOSELL, D, DEAL, A. D

    Published in Journal of electronic materials (01-03-2007)
    “…Intermetallic compound (IMC) formation at the interface between the tin (Sn) plating and the copper (Cu) substrate of electronic components has been thought to…”
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  18. 18

    Modeling reactive wetting by Warren, J.A., Boettinger, W.J., Roosen, A.R.

    Published in Acta materialia (22-05-1998)
    “…When a liquid alloy spreads on a metal substrate, interdiffusion may result in partial dissolution of the substrate and/or formation of intermetallic phases…”
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  19. 19

    Modeling of micro- and macrosegregation and freckle formation in single-crystal nickel-base superalloy directional solidification by SCHNEIDER, M. C, GU, J. P, BECKERMANN, C, BOETTINGER, W. J, KATTNER, U. R

    “…The formation of macrosegregation and freckles by multicomponent thermosolutal convection during the directional solidification of single-crystal Ni-base…”
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  20. 20

    Lateral deformation of diffusion couples by Boettinger, W.J., McFadden, G.B., Coriell, S.R., Sekerka, R.F., Warren, J.A.

    Published in Acta materialia (01-04-2005)
    “…A model is used to describe the shape change of a binary diffusion couple when the diffusivities of the two species differ. The classical uniaxial Kirkendall…”
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