Search Results - "Blampey, Benjamin"
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1
Reducing the Short Channel Effect of Transistors and Reducing the Size of Analog Circuits
Published in Active and passive electronic components (01-01-2019)“…Analog integrated circuits never follow the Moore’s Law. This is particularly right for passive component. Due to the Short Channel Effect, we have to…”
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2
A D-Band Multichannel TX System-in-Package Achieving 84.48 Gb/s With 64-QAM Based on 45-nm CMOS and Low-Cost PCB Technology
Published in IEEE transactions on microwave theory and techniques (01-07-2022)“…A high-data-rate <inline-formula> <tex-math notation="LaTeX">D </tex-math></inline-formula>-band transmitter (TX) module cointegrating a dual-channel TX…”
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3
A D-band multi-channel Tx System-in-Package achieving 84.48 Gb/s with 64-QAM based on 45nm CMOS and low-Cost PCB technology
Published in IEEE transactions on microwave theory and techniques (2022)“…A high data-rate D-band transmitter module cointegrating a dual channel transmitter IC in 45 nm CMOS PDSOI technology and an antenna is presented. The proposed…”
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4
A 125.5-157 GHz 8 dB NF and 16 dB of Gain D-band Low Noise Amplifier in CMOS SOI 45 nm
Published in 2020 IEEE/MTT-S International Microwave Symposium (IMS) (01-08-2020)“…In this paper, a D-band millimeter-wave low noise amplifier circuit in CMOS SOI 45 nm technology is presented. It achieves 8 dB of noise figure and 16 dB of…”
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Conference Proceeding -
5
Comparative Study of Material Parameter Extraction Using Terahertz Time-Domain Spectroscopy in Transmission and in Reflection
Published in Journal of infrared, millimeter and terahertz waves (01-04-2018)“…As no terahertz signal is transmitted through opaque materials, reflection terahertz time-domain spectroscopy is obviously the dedicated setup. On the other…”
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6
An 84.48 Gb/s CMOS D-band Multi-Channel TX System-in-Package
Published in 2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) (07-06-2021)“…This paper presents an in-package D-band wireless module co-integrating an innovative channel bonding transmitter IC in 45 nm CMOS PDSOI technology and a patch…”
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Conference Proceeding -
7
A 108-Gb/s 64-QAM CMOS D-Band Rx With Integrated LO Generation
Published in IEEE solid-state circuits letters (2020)“…In this letter, an ultrabroadband D-band wireless front-end receiver (RX) in 45-nm CMOS SOI is proposed. It achieves a noise figure of 8 dB, a gain of 16 dB, a…”
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8
Co-integrated 1.3µm hybrid III-V/silicon tunable laser and silicon Mach-Zehnder modulator operating at 25Gb/s
Published in Optics express (26-12-2016)“…In this paper, the 200mm silicon-on-insulator (SOI) platform is used to demonstrate the monolithic co-integration of hybrid III-V/silicon distributed Bragg…”
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9
A 84.48-Gb/s 64-QAM CMOS D-Band Channel-Bonding Tx Front-End With Integrated Multi-LO Frequency Generation
Published in IEEE solid-state circuits letters (2020)“…In this letter, an ultra-broadband D-band wireless front-end transmitter (TX) in 45-nm CMOS SOI is proposed. Based on channel bonding and 64-QAM modulation, it…”
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10
Transmitter Made up of a Silicon Photonic IC and its Flip-Chipped CMOS IC Driver Targeting Implementation in FDMA-PON
Published in Journal of lightwave technology (15-05-2016)“…We report on the design, fabrication, and characterization of a reflective transmitter targeting implementation in passive optical networks (PON) with…”
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11
Low-cost, High-Gain Antenna Module Integrating a CMOS Frequency Multiplier Driver for Communications at D-band
Published in 2019 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) (01-06-2019)“…This paper presents a compact D-band antenna module for ultrafast short-range communications. The system comprises a planar lens fed by an antenna-in-package…”
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Conference Proceeding -
12
A Near-Instantaneous and Non-Invasive Erasure Design Technique to Protect Sensitive Data Stored in Secure SRAMs
Published in ESSCIRC 2021 - IEEE 47th European Solid State Circuits Conference (ESSCIRC) (13-09-2021)“…On-chip memories, and in particular SRAMs, are among the most critical components in terms of data security because they might contain sensitive data such as…”
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Conference Proceeding -
13
167-GHz and 155-GHz High Gain D-band Power Amplifiers in CMOS SOI 45-nm Technology
Published in 2020 15th European Microwave Integrated Circuits Conference (EuMIC) (10-01-2021)“…In this paper, two D-band millimeter-wave wideband and high gain power amplifiers are proposed. Designed in CMOS SOI 45 nm technology, the two amplifiers…”
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Conference Proceeding -
14
A highly rugged 39 GHz 19.3 dBm Power Amplifier for 5G Applications in 45nm SOI Technology
Published in 2021 16th European Microwave Integrated Circuits Conference (EuMIC) (03-04-2022)“…This paper describes a highly rugged power-amplifier for the fifth generation (5G) FR2 new radio (NR) application implemented in a 45nm SOI process (45RFSOI)…”
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Conference Proceeding -
15
A 45RFSOI DC to 32 GHz Bandwidth Inductorless low power amplifier
Published in 2022 IEEE 22nd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) (16-01-2022)“…In this work, an ultra-wideband inductorless amplifier implemented in a 45nm CMOS SOI technology is presented. The amplifier operates over a DC to 32 GHz…”
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Conference Proceeding -
16
CMOS FD-SOI Technologies Ruggedness for Millimeter Wave Power Amplifier Design
Published in 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS) (24-10-2022)“…This paper studies the reliability that CMOS FD-SOI can achieved for mmWave Power Amplifier (PA) applications by means of characterizations combining RF aging…”
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Conference Proceeding -
17
A D-band 4-ways power splitter/combiner implemented on a 28nm bulk CMOS process
Published in 2019 49th European Microwave Conference (EuMC) (01-10-2019)“…This paper presents a 4-ways passive power splitter/combiner based on Wilkinson dividers implemented in the BEOL of a conventional 28nm bulk CMOS process…”
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Conference Proceeding -
18
A D-band 4-ways power splitter/combiner implemented on a 28nm bulk CMOS process
Published in 2019 14th European Microwave Integrated Circuits Conference (EuMIC) (01-09-2019)“…This paper presents a 4-ways passive power splitter/combiner based on Wilkinson dividers implemented in the BEOL of a conventional 28nm bulk CMOS process…”
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Conference Proceeding -
19
Transmitarray Antenna with Integrated Frequency Multiplier for High-speed D-band Communications in Low-cost PCB Technology
Published in 2019 13th European Conference on Antennas and Propagation (EuCAP) (01-03-2019)“…This contribution presents the design and experimental validation of a high-gain D-band fixed beam transmitarray excited by a compact antenna-in-package. Both…”
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Conference Proceeding -
20
Fast and robust RF characterization method of insulators used in high speed interconnects networks
Published in 2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI) (01-05-2018)“…A wide band (1 GHz-67 GHz) characterization method of insulator layers is presented. This method is well suitable for a fast, simple and accurate extraction of…”
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Conference Proceeding