Search Results - "Bin Azman, Noorazam"
-
1
Robust Package Study for A Power Package by Simulation
Published in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (19-04-2021)“…Delamination and solder crack are key concerns in power package, requiring significant attention by engineers during design and process development phases to…”
Get full text
Conference Proceeding -
2
Queuing theory application to analyze production capacity
Published in 2010 Second International Conference on Engineering System Management and Applications (01-03-2010)“…Queuing theory is a major topic of applied mathematics that deals with phenomenon of waiting and arises from the use of powerful mathematical analysis to…”
Get full text
Conference Proceeding -
3
Challenges in Singulation Process of Corner Lead with Wet-Able Pocket on Thin QFN Packages
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01-09-2018)“…Saw singulation is an indispensable process to singulate the Micro Carrier Device (MCD) strips into individual units in assembling Quad Flat No-lead (QFN)…”
Get full text
Conference Proceeding -
4
Queuing theory application to analyze production capacity
Published in 2010 Second International Conference on Engineering System Management and Applications (01-03-2010)“…Queuing theory is a major topic of applied mathematics that deals with phenomenon of waiting and arises from the use of powerful mathematical analysis to…”
Get full text
Conference Proceeding