Search Results - "Biedenbender, M."

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  1. 1

    Design and Analysis of Broadband Dual-Gate Balanced Low-Noise Amplifiers by Deal, W.R., Biedenbender, M., Po-hsin Liu, Uyeda, J., Siddiqui, M., Lai, R.

    Published in IEEE journal of solid-state circuits (01-10-2007)
    “…In this paper, we present three MMIC low-noise amplifiers using dual-gate GaAs HEMT devices in a balanced amplifier configuration. The designs target three…”
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    Journal Article Conference Proceeding
  2. 2

    Physical identification of gate metal interdiffusion in GaAs PHEMTs by Chou, Y.C., Grundbacher, R., Leung, D., Lai, R., Liu, P.H., Kan, Q., Biedenbender, M., Wojtowicz, M., Eng, D., Oki, A.

    Published in IEEE electron device letters (01-02-2004)
    “…The Ti metal interdiffusion of Ti/Pt/Au gate metal stacks in 0.15-μm GaAs PHEMTs subjected to high-temperature accelerated lifetest has been physically…”
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    Journal Article
  3. 3

    The effect of gate metal interdiffusion on reliability performance in GaAs PHEMTs by Chou, Y.C., Leung, D., Grundbacher, R., Lai, R., Liu, P.H., Kan, Q., Biedenbender, M., Eng, D., Oki, A.

    Published in IEEE electron device letters (01-06-2004)
    “…While Ti metal interdiffusion of Ti-Pt-Au gate metal stacks in GaAs pseudomorphic HEMT (PHEMTs) has been explored, the effect of Ti metal interdiffusion on the…”
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    Journal Article
  4. 4

    Innovative nitride passivated pseudomorphic GaAs HEMTs by Chou, Y C, Lai, R, Li, P, Hua, J, Nam, P, Grundbacher, R, Kim, H K, Ra, Y, Biedenbender, M, Ahlers, E

    Published in IEEE electron device letters (01-01-2003)
    “…A novel low-temperature nitride passivation technique using high-density inductively coupled plasma chemical vapor deposition (HD-ICP-CVD) with SiH4/N2…”
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    Journal Article
  5. 5

    High reliability performance of 0.1-μm Pt-sunken gate InP HEMT low-noise amplifiers on 100 mm InP substrates by Chou, Y C, Leung, D L, Biedenbender, M, Eng, D C, Buttari, D, Mei, X B, Lin, C H, Tsai, R S, Lai, R, Barsky, M E, Wojtowicz, M, Oki, A K, Block, T R

    “…Accelerated temperature lifetesting at T channel of 240, 255, and 270°C was performed on 0.1-μm Pt-sunken InP HEMT low-noise amplifiers fabricated on 100 mm…”
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    Conference Proceeding
  6. 6

    Progressive Schottky junction reaction induced degradation in Pt-sunken gate InP HEMT MMICs for high reliability applications by Chou, Y C, Leung, D L, Biedenbender, M, Buttari, D, Eng, D C, Tsai, R S, Lin, C H, Lee, L S, Mei, X B, Wojtowicz, M, Barsky, M E, Lai, R, Oki, A K, Block, T R

    “…Reliability performance of 0.1-μm Pt-sunken gate InP HEMT MMICs on 4-inch InP substrates was evaluated under elevated temperature life testing. The primary…”
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    Conference Proceeding
  7. 7

    A 94-GHz 0.35-W power amplifier module by Pin-Pin Huang, Tian-Wei Huang, Wang, Huei, Lin, E.W., Yonghui Shu, Dow, G.S., Lai, R., Biedenbender, M., Elliott, J.H.

    “…This paper presents a 94-GHz power amplifier (PA) module. This module contains three identical monolithic microwave integrated circuit (MMIC) PA chips and…”
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    Journal Article
  8. 8

    Innovative nitride passivated pseudomorphicGaAs HEMTs by Chou, Y.C., Lai, R., Li, G.P., Jun Hua, Nam, P., Grundbacher, R., Kim, H.K., Ra, Y., Biedenbender, M., Ahlers, E., Barsky, M., Oki, A., Streit, D.

    Published in IEEE electron device letters (01-01-2003)
    “…A novel low-temperature nitride passivation technique using high-density inductively coupled plasma chemical vapor deposition (HD-ICP-CVD) with SiH 4 /N 2…”
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    Journal Article
  9. 9

    A 6-W Ka-band power module using MMIC power amplifiers by Ingram, D.L., Stones, D.I., Elliott, J.H., Wang, Huei, Lai, R., Biedenbender, M.

    “…This paper presents the development of a 6-W 24% power-added efficiency (PAE) Ka-band power module with an associated power gain of 21.5 dB. The power module…”
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    Journal Article
  10. 10
  11. 11

    Production InP MMICs for low cost, high performance applications by Lai, R., Grundbacher, R., Sawdai, D., Uyeda, J., Biedenbender, M., Barsky, M., Gutierrez-Aitken, A., Cavus, A., Chin, P., Liu, P.H., Bhorania, R., Streit, D., Oki, A.

    “…We report the progress of production InP MMICs for low cost, high performance applications at Northrop Grumman Space Technology (NGST). Both InP HEMT and HBT…”
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    Conference Proceeding
  12. 12

    Compact W-band solid-state MMIC high power sources by Ingram, D.L., Chen, Y.C., Stones, I., Yamauchi, D., Brunner, B., Huang, P., Biedenbender, M., Ellion, J., Lai, R., Streit, D.C., Lau, K.F., Yen, H.C.

    “…Presented is the development of two >2 W W-band solid-state monolithic microwave integrated circuit (MMIC) power amplifier modules using TRW's advanced GaAs-…”
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    Conference Proceeding Journal Article
  13. 13

    Innovative nitride passivation for pseudomorphic GaAs HEMTs and impact on device performance by Chou, Y.C., Nam, P., Li, G.P., Kim, L.K., Grundbacher, R., Ahlers, E., Ra, Y., Xu, Q., Biedenbender, M.B., Oki, A.

    “…A novel low temperature nitride deposition technique using high-density inductively coupled plasma chemical vapor deposition (HD-ICP-CVD) to passivate 0.15…”
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    Conference Proceeding
  14. 14

    Novel W-band monolithic push-pull power amplifiers by Wang, Huei, Lai, R., Biedenbender, M., Dow, G.S., Allen, B.R.

    Published in IEEE journal of solid-state circuits (01-10-1995)
    “…Monolithic W-band push-pull power amplifiers have been developed using 0.1-/spl mu/m AlGaAs/InGaAs/GaAs pseudomorphic T-gate power HEMT technology. The novel…”
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    Journal Article
  15. 15

    Reliability consideration of GaAs pHEMT Schottky diodes for mixer applications by Chou, Y.C., Leung, D., Biedenbender, M., Fordham, O., Grundbacher, R., Kan, Q., Liu, P.H., Eng, D., Lai, R., Chin, P., Block, T., Oki, A.

    “…Factors affecting reliability performance of GaAs PHEMT Schottky diodes for mixer applications were investigated: the total gate periphery, gate feed…”
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    Conference Proceeding
  16. 16

    Novel monolithic multifunctional balanced switching low-noise amplifiers by Lo, D.C.W., Wang, Huei, Allen, B.R., Dow, G.S., Kwo Wei Chang, Biedenbender, M., Lai, R., Sian Chen, Yang, D.

    “…A novel multifunctional balanced switching low-noise amplifier (BSLNA) which can be used as a low-noise amplifier, a low-noise switch, or a broad-band 180/spl…”
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    Journal Article Conference Proceeding
  17. 17

    Submicron-gate InP power MISFET's with improved output power density at 18 and 20 GHz by Biedenbender, M.D., Kapoor, V.J., Shalkhauser, K.A., Messick, L.J., Nguyen, R., Schmitz, D., Jurgensen, H.

    “…The microwave characteristics at 18 and 20 GHz of submicron-gate indium phosphide (InP) metal-insulator-semiconductor field-effect transistors (MISFETs) for…”
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    Journal Article
  18. 18

    Ion-implanted high microwave power indium phosphide transistors by Biedenbender, M.D., Kapoor, V.J., Messick, L.J., Nguyen, R.

    “…Encapsulated rapid thermal annealing (RTA) has been used in the fabrication of indium phosphide (InP) power metal-insulator-semiconductor field-effect…”
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    Journal Article
  19. 19

    Highly efficient compact Q-band MMIC power amplifier using 2-mil substrate and partially-matched output by Lester, J.A., Hwang, Y., Chi, J., Lai, R., Biedenbender, M., Chow, P.D.

    “…Presented is an 850 mW Q-band PHEMT MMIC power amplifier with a peak efficiency of 34% at 45.5 GHz, believed to be the highest reported at this power level and…”
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    Conference Proceeding
  20. 20

    Fully-matched, high-efficiency Q-band 1 watt MMIC solid state power amplifier by Hwang, Y., Chow, P.D., Lester, J., Chi, J., Garske, D., Biedenbender, M., Lai, R.

    “…A fully-matched, high-efficiency Q-band 1 watt MMIC power amplifier has developed. This chip utilized 2 mil-thick GaAs substrate to improve amplifier gain,…”
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    Conference Proceeding