Search Results - "Biddick, C."

Marks for SCALPEL ® tool optics optimization by Farrow, R.C., Gallatin, G.M., Waskiewicz, W.K., Liddle, J.A., Kizilyalli, I., Kornblit, A., Biddick, C., Blakey, M., Klemens, F., Felker, J., Kraus, J., Mkrtchyan, M., Orphanos, P.A., Layadi, N., Merchant, S.

“…A method for optimizing the electron optics of the SCALPEL exposure tool is described. The method uses the SCALPEL mark detection method with a grating mark as…”
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CMOS compatible alignment marks for the SCALPEL proof of lithography tool by Farrow, R.C., Waskiewicz, W.K., Kizilyalli, I., Ocola, L., Felker, J., Biddick, C., Gallatin, G., Mkrtchyan, M., Blakey, M., Kraus, J., Novembre, A., Orphanos, P., Peabody, M., Kasica, R., Kornblit, A., Klemens, F.

“…SCALPEL alignment marks have been fabricated in a SiO 2/WSi 2 structure using SCALPEL lithography and plasma processing. The positions of the marks were…”
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Viability of pathogenic and nonpathogenic free-living amoebae in long-term storage at a range of temperatures by BIDDICK, C. J, ROGERS, L. H, BROWN, T. J

“…Classifications Services AEM Citing Articles Google Scholar PubMed Related Content Social Bookmarking CiteULike Delicious Digg Facebook Google+ Mendeley Reddit…”
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The SCALPEL proof of concept system by Harriott, L.R., Berger, S.D., Biddick, C., Blakey, M.I., Bowler, S.W., Brady, K., Camarda, R.M., Connelly, W.F., Crorken, A., Custy, J., DeMarco, R., Farrow, R.C., Felker, J.A., Fetter, L., Freeman, R., Hopkins, L., Huggins, H.A., Knurek, C.S., Kraus, J.S., Liddle, J.A., Mkrtychan, M., Novembre, A.E., Peabody, M.L., Tarascon, R.G., Wade, H.H., Waskiewicz, W.K., Watson, G.P., Werder, K.S., Windt, D.

“…We have designed and constructed a projection electron beam lithography system based on the SCALPEL (SCattering with Angular Limitation in Projection Electron…”
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Mask assisted off‐axis illumination technique for random logic by Garofalo, J., Biddick, C. J., Kostelak, R. L., Vaidya, S.

“…While off‐axis illumination has been demonstrated to improve contrast and depth of focus for low k 1, packed line–space (L/S) patterns [S. Asai, I. Hanyu, and…”
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Negative chemically amplified resist characterization for direct write and SCALPEL nanolithography by Ocola, L. E., Biddick, C. J., Tennant, D. M., Waskiewicz, W. K., Novembre, A. E.

“…Despite the common link of using high energy electrons as exposure probes in direct write and SCALPEL lithography, the imaging systems in both are different…”
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Metrology package for electron beam exposure tool evaluation: Application to EBES4 by Kung, E.H., Kostelak, R. L., Biddick, C. J., Vaidya, S.

“…Throughout the stages of electron beam (e‐beam) exposure tool development and application, the machine performance needs to be accurately characterized. A…”
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Preliminary results from a prototype projection electron‐beam stepper‐scattering with angular limitation projection electron beam lithography proof‐of‐concept system by Harriott, L. R., Berger, S. D., Biddick, C., Blakey, M. I., Bowler, S. W., Brady, K., Camarda, R. M., Connelly, W. F., Crorken, A., Custy, J., Dimarco, R., Farrow, R. C., Felker, J. A., Fetter, L., Freeman, R., Hopkins, L., Huggins, H. A., Knurek, C. S., Kraus, J. S., Liddle, J. A., Mkrtychan, M., Novembre, A. E., Peabody, M. L., Tarascon, R. G., Wade, H. H., Waskiewicz, W. K., Watson, G. P., Werder, K. S., Windt, D.

“…We have designed and constructed a proof‐of‐concept projection electron beam lithography system based on the scattering with angular limitation projection…”
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Masks for x‐ray lithography with a point source stepper by Celler, G. K., Biddick, C., Frackoviak, J., Jurgensen, C. W., Kola, R. R., Novembre, A. E., Trimble, L. E., Tennant, D. M.

“…We describe some key aspects of proximity x‐ray technology currently being developed at AT&T, from mask fabrication to wafer patterning. The masks are…”
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Formation of probe microscope tips in silicon by focused ion beams by Vasile, Michael J., Biddick, Christopher, Huggins, Harold

“…A combination of lithographic patterning, liquid phase anisotropic etching, and focused ion beam milling has been used to prototype the production of scanning…”
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SCALPEL aerial image monitoring: Principles and application to space charge by Gallatin, G. M., Farrow, R. C., Liddle, J. A., Waskiewicz, W. K., Mkrtchyan, M. M., Orphanos, P., Felker, J., Kraus, J., Biddick, C. J., Stanton, S., Novembre, A. E., Blakey, M.

“…We present an approach to real time direct aerial image monitoring which utilizes the information contained in an alignment signal generated by scanning the…”
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Inclusive γ -Ray Spectra from ψ ( 3095 ) and ψ ′ ( 3684 ) Decays by Biddick, C. J., Burnett, T. H., Masek, G. E., Miller, E. S., Smith, J. G., Stronski, J. P., Sullivan, M. K., Vernon, W., Badtke, D. H., Barnett, B. A., Jones, L. H., Zorn, G. T., Cavalli-Sforza, M., Goggi, G., Impellizzeri, F. S., Livan, M. M., Pastore, F. H., Rossini, B., Aschman, D. G., Coyne, D. G., Groom, D. E., O'Neill, G. K., Sadrozinski, H. F. W., Shinsky, K. A., Keller, L. P., Lyon, D. E., Ford, R. L., Hilger, E., Hofstadter, R., Hughes, E. B., Martin, T. W., O'Neill, L. H., Simpson, J. W.

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Microfabrication by ion milling: The lathe technique by Vasile, Michael J., Biddick, Christopher, Schwalm, Stephanie A.

“…Several novel and unusual microstructures were made by focused ion beam milling. These microstructures include needles, hooks, forks, and similar shapes…”
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Search for Narrow Resonant States in e + e − Collisions near 6 GeV by Aschman, D. G., Coyne, D. G., Groom, D. E., O'Neill, G. K., Sadrozinski, H. F. W., Shinsky, K. A., Cavalli-Sforza, M., Goggi, G., Impellizzeri, F. S., Livan, M. M., Pastore, F. H., Rossini, B., Badtke, D. H., Barnett, B. A., Jones, L. H., Zorn, G. T., Biddick, C. J., Burnett, T. H., Masek, G. E., Miller, E. S., Smith, J. G., Stronski, J. P., Sullivan, M. K., Vernon, W., Keller, L. P., Lyon, D. S.

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A hydraulic X–Y stage system for application in electron beam exposure systems by Nielsen, R. J., Bruning, J. H., Richman, R. M., Biddick, C. J., Giacchi, J., Kossyk, G. J. W., Bush, D. R., Barna, S. J., Alles, D. S.

“…A hydraulic X–Y stage system for application in electron beam lithography machines is described. The X–Y table is supported on hydrostatic bearings and is…”
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EBES4: A new electron‐beam exposure system by Alles, D. S., Biddick, C. J., Bruning, J. H., Clemens, J. T., Collier, R. J., Gere, E. A., Harriott, L. R., Leone, F., Liu, R., Mulrooney, T. J., Nielsen, R. J., Paras, N., Richman, R. M., Rose, C. M., Rosenfeld, D. P., Smith, D. E. A., Thomson, M. G. R.

“…EBES4 is an electron‐beam exposure machine designed for accurate submicron lithography with good throughput. It can write on optical and x‐ray mask substrates…”
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The SCattering with Angular Limitation in Projection Electron-beam Lithography (SCALPEL) system by LIDDLE, J. A, BERGER, S. D, CUSTY, J, FARROW, R. C, FELKER, J. A, FETTER, L. A, FREEMAN, B, HARRIOTT, L. R, HOPKINS, L.L, HUGGINS, H. A, KNUREK, C. S, KRAUS, J. S, BIDDICK, C. J, MIXON, D. A, MKRTCHYAN, M. M, NOVEMBRE, A. E, PEABODY, M. L, SIMPSON, W. M, TARASCON, R. G, WADE, H. H, WASKIEWICZ, W. K, WATSON, G. P, WILLIAMS, J. K, BLAKEY, M. I, WINDT, D. L, BOLAN, BOWLER, S. W, BRADY, K, CAMARDA, R. M, CONNELLY, W. F, CHORKEN, A

“…A SCALPEL \circledR (SCattering with Angular Limitation in Projection Electron-beam Lithography) proof-of-concept lithography system, comprising a tool, a…”
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Measurement of the backscatter coefficient using resist response curves for 20–100 keV electron beam lithography on Si by Watson, G. Patrick, Fu, Diana, Berger, Steven D., Tennant, Donald, Fetter, Linus, Novembre, Anthony, Biddick, Christopher

“…The effective backscatter coefficient η is a quantity that must be known with precision so that the proximity effect can be adequately compensated to minimize…”
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Inclusive gamma-ray spectra from psi/3095/ and psi-prime/3684/ decays by Biddick, C J, Burnett, T H, Masek, G E, Miller, E S, Smith, J G, Stronski, J P, Sullivan, M K, Vernon, W, BADTKE, D H, Barnett, B A

“…Inclusive gamma-ray experiments were carried out in a e(+)e(-) colliding-beam apparatus with NaI(Tl) arrays as detectors. The inclusive gamma-ray spectra,…”
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