Search Results - "Bermond, Cédric"

A Microwave Frequency Range Experiment for the Measurement of Snow Density and Liquid Water Content by Bermond, Cedric, Artillan, Philippe, Gay, Michel

“…This article presents a new nondestructive characterization system for the extraction of both snow density and liquid water content (LWC). The experiment…”
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20 GHz Antenna Radiation Pattern Obtained From Near-Field Mapping With Electrooptic Probe on a Single Plane by Gaborit, Gwenael, Artillan, Philippe, Bermond, Cedric, Revillod, Guillaume, Chevrier-Gros, Guillaume, Duvillaret, Lionel

“…The ability of an electrooptic (EO) sensor to perform near-field mapping of a 20 GHz pyramidal horn antenna without disturbance on the radiation behavior is…”
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Wide Band Frequency Characterization of Al-Doped and Undoped Rutile TiO 2 Thin Films for MIM Capacitors by Chaker, Ahmad, Bermond, Cedric, Artillan, Philippe, Gonon, Patrice, Vallee, Christophe, Bsiesy, Ahmad

“…In this letter, the dielectric properties of rutile TiO2 thin films are studied for metal-insulator-metal capacitor applications. The dielectric constant, the…”
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Design of a High-Speed Ethernet Connector for Harsh Environments by Boujmad, Younes, Bermond, Cedric, Artillan, Philippe, Gavard, Olivier, Prudhom, Marie, Khalili, Farsin, Husson-Charlet, Edith, Barbosa, Jean-Paul, Flechet, Bernard

“…This article focuses on the electrical performance of a new Ethernet contact with four differential pairs called "Octomax." The eight pins of the contact are…”
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Effect of water content on microwave dielectric properties of building materials by Damez, Romain, Artillan, Philippe, Hellouin de Menibus, Arthur, Bermond, Cédric, Xavier, Pascal

“…•Electromagnetic waves are reflected and attenuated by construction materials.•The electromagnetic frequency response of a wall is a function of its multilayer…”
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Modeling and Frequency Performance Analysis of Through Silicon Capacitors in Silicon Interposers by Khadim Dieng, Artillan, Philippe, Bermond, Cedric, Guiller, Olivier, Lacrevaz, Thierry, Joblot, Sylvain, Houzet, Gregory, Farcy, Alexis, Perrier, Anne-Laure, Lamy, Yann, Flechet, Bernard

“…The feasibility of cointegration of new capacitors, named "through silicon capacitors" (TSCs) with "through silicon vias" in silicon interposers has recently…”
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Frequency Effect on Voltage Linearity of ZrO2-Based RF Metal-Insulator-Metal Capacitors by BERTAUD, Thomas, BLONKOWSKI, Serge, BERMOND, Cédric, VALLEE, Christophe, GONON, Patrice, GROS-JEAN, Michaël, FLECHET, Bernard

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Electrical Broadband Characterization Method of Dielectric Molding in 3-D IC and Results by Lacrevaz, Thierry, Bermond, Cedric, Bouayadi, Ossama El, Houzet, Gregory, Artillan, Philippe, Lamy, Yann, Dieng, Khadim, Flechet, Bernard

“…This paper deals with the wideband frequency molding material characterization in three dimensions stack of integrated circuits (3-D IC). This material is…”
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Characterization in a Wide Frequency Range (40 MHz-67 GHz) of a KTa0.65Nb0.35O3 Thin Film for Tunable Applications by Houzet, Grégory, Lacrevaz, Thierry, Bermond, Cédric, Fléchet, Bernard, Le Febvrier, Arnaud, Députier, Stéphanie, Guilloux-Viry, Maryline, Queffelec, Patrick

“…A (100) oriented KTa 0.65 Nb 0.35 O 3  400 nm-thin film has been deposited by Pulsed Laser Deposition on MgO substrate. Microwave measurements, performed on…”
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Characterization in a Wide Frequency Range (40 MHz–67 GHz) of a KTa 0.65 Nb 0.35 O 3 Thin Film for Tunable Applications by Houzet, Grégory, Lacrevaz, Thierry, Bermond, Cédric, Fléchet, Bernard, Le Febvrier, Arnaud, Députier, Stéphanie, Guilloux-Viry, Maryline, Queffelec, Patrick

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RF characterization of the substrate coupling noise between TSV and active devices in 3D integrated circuits by Bermond, C., Brocard, M., Lacrevaz, T., Farcy, A., Le Maître, P., Leduc, P., Ben Jamaa, H., Chéramy, S., Sillon, N., Fléchet, B.

“…[Display omitted] •Innovative and realistic 4-port test structures for high wide frequency range characterizations.•Extraction of noise coupling between TSVs…”
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Frequency Effect on Voltage Linearity of [Formula Omitted]-Based RF Metal-Insulator-Metal Capacitors by Bertaud, Thomas, Blonkowski, Serge, Bermond, CÉdric, Vallee, Christophe, Gonon, Patrice, Gros-Jean, MichaËl, Flechet, Bernard

“…This letter deals with the electrical and wideband frequency characterizations of metal-insulator-metal capacitors integrating medium-[Formula Omitted]…”
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Characterization in a Wide Frequency Range (40 MHz-67 GHz) of a KTa^sub 0.65^Nb^sub 0.35^O^sub 3^ Thin Film for Tunable Applications by Houzet, Grégory, Lacrevaz, Thierry, Bermond, Cédric, Fléchet, Bernard, Le Febvrier, Arnaud, Députier, Stéphanie, Guilloux-Viry, Maryline, Queffelec, Patrick

“…A (100) oriented ... 400 nm-thin film has been deposited by Pulsed Laser Deposition on MgO substrate. Microwave measurements, performed on InterDigitated…”
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Fast and robust RF characterization method of insulators used in high speed interconnects networks by Lacrevaz, Thierry, Houzet, Gregory, Auchere, David, Artillan, Philippe, Bermond, Cedric, Blampey, Benjamin, Flechet, Bernard

“…A wide band (1 GHz-67 GHz) characterization method of insulator layers is presented. This method is well suitable for a fast, simple and accurate extraction of…”
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Optimization of a Miniaturized Ethernet 10 Gbits/s 8 Conductors Interconnect for Harsh Environments by BOUJMAD, Younes, ARTILLAN, Philippe, BERMOND, Cedric, GAVARD, Olivier, PRUDHOM, Marie, KHALILI, Farsin, HUSSON-CHARLET, Edith, BARBOSA, Jean-Paul, FLECHET, Bernard

“…Connectors play an essential role in the overall performance of analog and digital electronic systems. Designs, modelling and characterization results of new…”
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Wide-band simulations of differential 3D interconnect propagation performances in a photonic interposer by Morot, Kevin, Jacquinot, Helene, Lacrevaz, Thierry, Bermond, Cedric, Farcy, Alexis, Flechet, Bernard

“…The continuous requirement of higher communication bandwidths in data centers or high performance computers drives the convergence between ASICs and optical…”
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Electrical Model of Different Architectures of through Silicon Capacitors for High Frequency Power Distribution Network (PDN) Decoupling Operations by Dieng, Khadim, Bermond, Cédric, Artillan, Philippe, Lacrevaz, Thierry, Houzet, Grégory, Fléchet, Bernard, Guiller, Olivier, Joblot, Sylvain, Farcy, Alexis, Lamy, Yann

“…The "Through Silicon Vias" technology, developed for silicon interposer interconnects network, has inspired new capacitor components named "Through Silicon…”
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3D interconnect optimization for single channel 100-GBps transmission in a photonic interposer by Morot, Kevin, Farcy, Alexis, Lacrevaz, Thierry, Bermond, Cedric, Artillan, Philippe, Flechet, Bernard, Jacquinot, Helene, Scheiblin, Pascal

“…High speed 3D interconnects are a key element in 2.5D interposer technology that is widely investigated for high performance applications. A wide-band…”
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Wide Band Frequency Characterization of Al-Doped and Undoped Rutile TiO2 Thin Films for MIM Capacitors by Chaker, Ahmad, Bermond, Cedric, Artillan, Philippe, Gonon, Patrice, Vallee, Christophe, Bsiesy, Ahmad

“…In this letter, the dielectric properties of rutile TiO 2 thin films are studied for metal-insulator-metal capacitor applications. The dielectric constant, the…”
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Electrical Characterization of Advanced MIM Capacitors With Insulator for High-Density Packaging and RF Applications by Bertaud, T., Bermond, C., Blonkowski, S., Vallee, C., Lacrevaz, T., Farcy, A., Gros-Jean, M., Flechet, B.

“…This paper deals with the electrical and wideband frequency characterizations of metal-insulator-metal (MIM) capacitors integrating the medium-k material ZrO 2…”
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