Search Results - "Benkechkache, M. A."

Design and First Characterization of Active and Slim-Edge Planar Detectors for FEL Applications by Benkechkache, M. A., Latreche, S., Ronchin, S., Boscardin, M., Pancheri, L., Dalla Betta, G.-F

“…This paper reports on the development of a dedicated technology for the fabrication of pixelated edgeless sensors to be used in X-ray imaging applications at…”
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A 2D imager for X-ray FELs with a 65 nm CMOS readout based on per-pixel signal compression and 10 bit A/D conversion by Ratti, L., Comotti, D., Fabris, L., Grassi, M., Lodola, L., Malcovati, P., Manghisoni, M., Re, V., Traversi, G., Vacchi, C., Rizzo, G., Batignani, G., Bettarini, S., Casarosa, G., Forti, F., Giorgi, M., Morsani, F., Paladino, A., Paoloni, E., Pancheri, L., Dalla Betta, G.-F., Mendicino, R., Verzellesi, G., Xu, H., Benkechkache, M.A.

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PixFEL: developing a fine pitch, fast 2D X-ray imager for the next generation X-FELs by Ratti, L., Comotti, D., Fabris, L., Grassi, M., Lodola, L., Malcovati, P., Manghisoni, M., Re, V., Traversi, G., Vacchi, C., Bettarini, S., Casarosa, G., Forti, F., Morsani, F., Paladino, A., Paoloni, E., Rizzo, G., Benkechkache, M.A., Dalla Betta, G.-F., Mendicino, R., Pancheri, L., Verzellesi, G., Xu, H.

“…The PixFEL project is conceived as the first stage of a long term research program aiming at the development of advanced X-ray imaging instrumentation for…”
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Design and TCAD simulation of planar p-on-n active-edge pixel sensors for the next generation of FELs by Dalla Betta, G.-F., Batignani, G., Benkechkache, M.A., Bettarini, S., Casarosa, G., Comotti, D., Fabris, L., Forti, F., Grassi, M., Latreche, S., Lodola, L., Malcovati, P., Manghisoni, M., Mendicino, R., Morsani, F., Paladino, A., Pancheri, L., Paoloni, E., Ratti, L., Re, V., Rizzo, G., Traversi, G., Vacchi, C., Verzellesi, G., Xu, H.

“…We report on the design and TCAD simulations of planar p-on-n sensors with active edge aimed at a four-side buttable X-ray detector module for future FEL…”
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In-pixel conversion with a 10 bit SAR ADC for next generation X-ray FELs by Lodola, L., Batignani, G., Benkechkache, M.A., Bettarini, S., Casarosa, G., Comotti, D., Dalla Betta, G.F., Fabris, L., Forti, F., Grassi, M., Latreche, S., Malcovati, P., Manghisoni, M., Mendicino, R., Morsani, F., Paladino, A., Pancheri, L., Paoloni, E., Ratti, L., Re, V., Rizzo, G., Traversi, G., Vacchi, C., Verzellesi, G., Xu, H.

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The PixFEL project: Progress towards a fine pitch X-ray imaging camera for next generation FEL facilities by Rizzo, G., Batignani, G., Benkechkache, M.A., Bettarini, S., Casarosa, G., Comotti, D., Dalla Betta, G.-F., Fabris, L., Forti, F., Grassi, M., Lodola, L., Malcovati, P., Manghisoni, M., Mendicino, R., Morsani, F., Paladino, A., Pancheri, L., Paoloni, E., Ratti, L., Re, V., Traversi, G., Vacchi, C., Verzellesi, G., Xu, H.

“…The INFN PixFEL project is developing the fundamental building blocks for a large area X-ray imaging camera to be deployed at next generation free electron…”
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Micromachined silicon radiation sensors - Part 2: Fabrication technologies by Bagolini, A., Boscardin, M., Conci, P., Crivellari, M., Giacomini, G., Mattedi, F., Piemonte, C., Ronchin, S., Zorzi, N., Benkechkache, M. A., Dalla Betta, G-F, Mendicino, R., Pancheri, L., Povoli, M., Sultan, D. M. S.

“…The aim of this work is to present the main technological developments carried out at FBK for micro machined radiation sensors used in High Energy Physics…”
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The PixFEL front-end for X-ray imaging in the radiation environment of next generation FELs by Ratti, L., Comotti, D., Fabris, L., Grassi, M., Lodola, L., Malcovati, P., Manghisoni, M., Re, V., Traversi, G., Vacchi, C., Batignani, G., Bettarini, S., Casarosa, G., Forti, F., Morsani, F., Paladino, A., Paoloni, E., Rizzo, G., Benkechkache, M.A., Dalla Betta, G.-F., Mendicino, R., Pancheri, L., Verzellesi, G., Xu, H.

“…In the framework of the PixFEL project, a processing channel for pixel sensor readout has been designed and fabricated in a 65 nm CMOS technology. The detector…”
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Micromachined silicon radiation sensors - Part 1: Design and experimental characterization by Bagolini, A., Boscardin, M., Conci, P., Crivellari, M., Giacomini, G., Mattedi, F., Piemonte, C., Ronchin, S., Zorzi, N., Benkechkache, M. A., Dalla Betta, G.-F, Mendicino, R., Pancheri, L., Povoli, M., Sultan, D. M. S.

“…Silicon radiation sensors fabricated with micromachining technologies offer a number of advantages compared to their planar counterparts, making them appealing…”
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PixFEL: Enabling technologies, building blocks and architectures for advanced X-ray pixel cameras at the next generation FELs by Ratti, L., Comotti, D., Fabris, L., Grassi, M., Lodola, L., Malcovati, P., Manghisoni, M., Re, V., Traversi, G., Vacchi, C., Batignani, G., Bettarini, S., Casarosa, G., Forti, F., Morsani, F., Paladino, A., Paoloni, E., Rizzo, G., Benkechkache, M. A., Dalla Betta, G.-F, Mendicino, R., Pancheri, L., Verzellesi, G., Xu, H.

“…The PixFEL project is conceived as the first stage of a long term research program aiming at the development of advanced instrumentation for coherent X-ray…”
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Electrical modelling of Through Silicon Vias (TSVs) and their impact on a CMOS circuit: Ring oscillator by Benkechkache, M. A., Latreche, S., Labiod, S., Dalla Betta, G. F., Pancheri, L.

“…The astonishing evolution in microelectronic systems pushes the conventional 2D technology to its ultimate limits in terms of both performance and…”
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PFM2: A 32 × 32 readout chip for the PixFEL X-ray imager demonstrator by Ratti, L., Comotti, D., Fabris, L., Grassi, M., Lodola, L., Malcovati, P., Manghisoni, M., Re, V., Traversi, G., Vacchi, C., Batignani, G., Bettarini, S., Casarosa, G., Forti, F., Morsani, F., Paladino, A., Paoloni, E., Rizzo, G., Benkechkache, M.A., Dalla Betta, G.-F, Mendicino, R., Pancheri, L., Verzellesi, G., Xu, H.

“…A readout chip, consisting of 32×32 square cells, has been designed in a 65 nm CMOS technology. The circuit will be bump bonded to a slim/active edge pixel…”
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Analytical approach of the impact of through silicon via on the performance of MOS devices by Benkechkache, M. A., Latreche, S., Dalla Betta, G.-F.

“…Current innovations in electronics combine performance, size and cost criteria. Nevertheless, in the all-digital era, the 2D technology and the fabrication of…”
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