Search Results - "Belsito, Luca"
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1
Experimental Demonstration of an Electrostatic Orbital Angular Momentum Sorter for Electron Beams
Published in Physical review letters (05-03-2021)“…The component of orbital angular momentum (OAM) in the propagation direction is one of the fundamental quantities of an electron wave function that describes…”
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Journal Article -
2
Fabrication of high-resolution strain sensors based on wafer-level vacuum packaged MEMS resonators
Published in Sensors and actuators. A. Physical. (01-03-2016)“…•Wafer level vacuum packaged flexural resonators are fabricated.•The MEMS are employed as strain sensor fort structural material by exploiting their mechanical…”
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Journal Article -
3
Phonon scattering enhancement in silicon nanolayers
Published in Journal of materials science (01-04-2013)“…Dimensional confinement in silicon nanowires (NWs) is well-known for enhancing phonon scattering, thus leading to a pronounced reduction of thermal…”
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Journal Article -
4
Nanostrain Resolution Strain Sensing by Monocrystalline 3C-SiC on SOI Electrostatic MEMS Resonators
Published in Journal of microelectromechanical systems (01-02-2020)“…The paper reports on the fabrication and characterization of flexural resonators designed for resonant strain sensing and manufactured using 2 μm thick…”
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Journal Article -
5
Design and fabrication of very small MEMS microphone with silicon diaphragm supported by Z-shape arms using SOI wafer
Published in Solid-state electronics (01-10-2018)“…•A MEMS capacitive microphone with perforated diaphragm supported by Z-shape arms.•The Z-shape arms cause to decrease diaphragm stiffness and air damping.•The…”
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Journal Article -
6
Design and fabrication of high performance condenser microphone using C-slotted diaphragm
Published in Microsystem technologies : sensors, actuators, systems integration (01-07-2018)“…In this paper, we present a new design of MEMS condenser microphone using SOI wafer. To improve the performance of the microphone, a perforated diaphragm with…”
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Journal Article -
7
Measurement of Residual Stress and Young’s Modulus on Micromachined Monocrystalline 3C-SiC Layers Grown on and Silicon
Published in Micromachines (Basel) (03-09-2021)“…3C-SiC is an emerging material for MEMS systems thanks to its outstanding mechanical properties (high Young’s modulus and low density) that allow the device to…”
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Measurement of Residual Stress and Young’s Modulus on Micromachined Monocrystalline 3C-SiC Layers Grown on 111> and 100> Silicon
Published in Micromachines (Basel) (01-09-2021)“…3C-SiC is an emerging material for MEMS systems thanks to its outstanding mechanical properties (high Young’s modulus and low density) that allow the device to…”
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Journal Article -
9
Autonomous robotic system for tunnel structural inspection and assessment
Published in International journal of intelligent robotics and applications Online (01-03-2018)“…This paper presents a robotic platform, capable of autonomous tunnel inspection, developed under ROBO-SPECT European union funded research project. The robotic…”
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10
Micro-Opto-Mechanical sensors for tactile width measurements of surface opening cracks in concrete
Published in 2017 IEEE SENSORS (01-10-2017)“…The fabrication and laboratory testing of Micro-Opto-Mechanical sensors for the measurements of width of surface opening cracks in concrete structures are…”
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Conference Proceeding -
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Ultra-Low Power CMOS Readout for Resonant MEMS Strain Sensors
Published in Proceedings (01-12-2018)“…This paper presents an ultra-low power, silicon-integrated readout for resonant MEMS strain sensors. The analogue readout implements a negative-resistance…”
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Journal Article -
12
Sensitivity Enhancement in Vacuum Packaged Resonant MEMS Strain Sensors with On-Chip Strain Amplification Mechanism
Published in 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) (20-06-2021)“…A new strain sensor design based on vacuum packaged Double-Ended Tuning Fork silicon resonators with a strain amplification mechanism is presented. The sensors…”
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Conference Proceeding -
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Development of Weighing Systems with Improved Dynamic Range Using High-Resolution Resonant MEMS Strain Sensors
Published in 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) (20-06-2021)“…The application of high-resolution MEMS strain sensors based on micromechanical resonators fabricated with wafer-level vacuum packaging to the construction of…”
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Conference Proceeding -
14
Large Strain Measurements by Vacuum-Packaged Mems Resonators Manufactured on Ultrathin Silicon Chips
Published in 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) (01-06-2019)“…Silicon resonators fabricated with wafer-level vacuum packaging on ultrathin silicon chips (overall thickness around 60 μm) are utilized for strain…”
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Conference Proceeding -
15
Acoustic Micro-Opto-Mechanical Transducers for Crack Width Measurement on Concrete Structures from Aerial Robots
Published in 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) (01-06-2019)“…A novel Micro-Opto-Mechanical acoustic sensor that can be utilized to measure the width of surface opening cracks in concrete structures from aerial robots is…”
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Conference Proceeding -
16
Design study of micromachined thermal emitters for NDIR gas sensing in the 9-12 μm wavelength range
Published in 2007 IEEE Sensors (01-10-2007)“…We present a design study aimed at fabricating micromachined thermal emitters for infrared gas sensing with high emission efficiency in the 9-12 μm wavelength…”
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Conference Proceeding