Search Results - "Belharet, Djaffar"
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1
Highly coupled and low frequency vibrational energy harvester using lithium niobate on silicon
Published in Applied physics letters (05-07-2021)“…LiNbO3 has been little studied for the piezoelectric energy harvesting applications. Although it is a cheap piezoelectric material without lead and toxic…”
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Journal Article -
2
Collective fabrication of guided longitudinal SAW resonator without Bragg grating mirror
Published in Electronics letters (01-06-2023)“…This Research article document discussed about a new structure composed of a sub‐micron‐thick layer of a single‐crystal piezoelectric material on a substrate…”
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Journal Article -
3
Lead-Free LiNbO3 Thick Film MEMS Kinetic Cantilever Beam Sensor/Energy Harvester
Published in Sensors (Basel, Switzerland) (01-01-2022)“…In this paper, we present integrated lead-free energy converters based on a suitable MEMS fabrication process with an embedded layer of LiNbO3. The fabrication…”
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Journal Article -
4
Development and characterization of thinned PZT bulk technology based actuators devoted to a 6-DOF micropositioning platform
Published in Microelectronic engineering (05-10-2018)“…Piezoelectric actuators are widespread in the design of micro/nanorobotic tools and microsystems, as they have a very interesting electromechanical coupling…”
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Journal Article -
5
Lead-Free LiNbO[sub.3] Thick Film MEMS Kinetic Cantilever Beam Sensor/Energy Harvester
Published in Sensors (Basel, Switzerland) (01-01-2022)“…In this paper, we present integrated lead-free energy converters based on a suitable MEMS fabrication process with an embedded layer of LiNbO[sub.3]. The…”
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Journal Article -
6
Plasma impedance monitoring for real time endpoint detection of bulk materials etched in ICP tool
Published in Microelectronic engineering (01-11-2010)“…Plasma impedance monitoring (PIM) based on electrical measurements is successfully used as an alternative to determine real time detection endpoint during…”
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Journal Article -
7
Development and Characterization of Thinned PZT Bulk Technology Based Actuators Devoted to a 6-DOF Micropositioning Platform
Published in Microelectronic engineering (2018)“…"Piezoelectric actuators are widespread in the design of micro/nanorobotic tools and microsystems, as they have a very interesting electromechanical coupling…”
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Journal Article -
8
Screening of spherical moulds manufactured isotropically in plasma etching conditions
Published in Contributions to plasma physics (1988) (01-08-2021)“…Micro‐moulding is a critical rapid prototyping process chain used for a wide range of applications. This study demonstrates that it is possible to manufacture…”
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Journal Article -
9
Lead-Free LiNbO 3 Thick Film MEMS Kinetic Cantilever Beam Sensor/Energy Harvester
Published in Sensors (Basel, Switzerland) (12-01-2022)“…In this paper, we present integrated lead-free energy converters based on a suitable MEMS fabrication process with an embedded layer of LiNbO . The fabrication…”
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Journal Article -
10
Oxide HDP-CVD Modeling for Shallow Trench Isolation
Published in IEEE transactions on semiconductor manufacturing (01-08-2010)“…A method is proposed to model the high-density plasma chemical vapor deposition step within the shallow trench isolation module in the CMOS technology. To…”
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Journal Article -
11
Stabilized Pt Interdigitated Electrodes for High-Temperature SAW Sensors
Published in 2021 IEEE International Ultrasonics Symposium (IUS) (11-09-2021)“…The standard working temperature of Surface Acoustic Wave (SAW) device does not exceed 150°C, although high-temperature device demand is increasing. Commonly,…”
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Conference Proceeding -
12
Bloch surface waves at the telecommunication wavelength with Lithium Niobate as top layer for integrated optics
Published 28-06-2018“…Lithium niobate (LN) based devices are widely used in integrated and nonlinear optics. This material is robust and resistive to high temperatures, which makes…”
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Journal Article -
13
Temporary adhesives for wafer bonding: Deep reactive ion etching application
Published in 2009 European Microelectronics and Packaging Conference (01-06-2009)“…Deep reactive ion etching is a critical step for Micro-ElectroMechanical Systems devices fabrication (MEMS). Some applications are bulk silicon etching with…”
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Conference Proceeding