Search Results - "Behner, U."

Comparison of different Si/Ge alloy buffer concepts for (SimGen)p superlattices by DETTMER, K, BEHNER, U, BESERMAN, R

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Comparison of different [formula omitted] alloy buffer concepts for (Si mGe n) p superlattices by Dettmer, K., Behner, U., Beserman, R.

“…Fully relaxed buffers of final Ge concentration x f are needed to grow strain-symmetrized superlattices. Different concepts of such a buffer of step graded,…”
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1/f noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment by Vandamme, L K J, Perichaud, M G, Noguera, E, Danto, Y, Behner, U

“…Classical lifetime predictions of conductive adhesive bonds require time consuming thermal cycling measurements. Therefore, faster lifetime test are needed…”
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1/f noise as a diagnostic tool to investigate the quality of isotropic conductive adhesive bonds by Vandamme, L.K.J., Perichaud, M.G., Noguera, E., Danto, Y., Behner, U.

“…Reliability assessment of conductive adhesive bonds by thermo-cycling up to 830 cycles is time consuming, and does not give much information about the details…”
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Characterization of anisotropically conductive adhesive interconnections by 1/f noise measurements by Behner, U., Haug, R., Schutz, R., Hartnagel, H.L.

“…There is growing interest in using anisotropically conductive adhesives (ACAs) not only for interconnections between LCDs and PCBs but also in higher current…”
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Characterization of anisotropically conductive adhesive interconnections by 1/f noise measurements by Behner, U., Haug, R., Schutz, R., Hartnagel, H.L.

“…Today there is growing interest in using anisotropically conductive adhesives (ACAs) not only for interconnections between liquid crystal displays and printed…”
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[formula omitted] Noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment by Vandamme, L.K.J., Perichaud, M.G., Noguera, E., Danto, Y., Behner, U.

“…Classical lifetime predictions of conductive adhesive bonds require time consuming thermal cycling measurements. Therefore, faster lifetime test are needed…”
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Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding by Haug, R., Behner, R., Czaya, C.-P., Hongquan Jiang, Kotthaus, S.F., Schuetz, R., Treutler, C.P.O.

“…Small modules on the basis of laminate substrates are often used as a functional subunit in electronic applications. Currently most of them are made by chip…”
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Micromachined pressure sensors with Al/sub x/Ga/sub 1-x/As/GaAs- and InAs/AlSb/GaSb-resonant tunneling diodes by Mutamba, K., Sigurdardottir, A., Vogt, A., Pfeiffer, J., Behner, U., Di Carlo, A., Hartnagel, H.L.

“…We report on the development of micromachined pressure sensors utilizing uniaxial pressure effects in resonant tunneling diodes (RTDs) made from the material…”
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Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding by Behner, U., Czaya, C.-P., Haug, R., Hauschild, F.-D., Jiang, H., Kaloudis, M., Kotthaus, S., Kuschel, S., Schuetz, R., Schultze, F., Treutler, C.P.O., Vogel, W.

“…Small modules based on laminate substrates are often used as a functional subunit in electronic applications. Currently, most are made by the chip and wire…”
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Low-cost direct chip attach: Comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding by Behner, U., Czaya, C.-P., Haug, R., Hauschild, F.-D., Jiang, H., Kaloudis, M., Kotthaus, S., Kuschel, S., Schuetz, R., Schultze, F., Treutler, C.P.O., Vogel, W.

“…Small modules based on laminate substrates are often used as a functional subunit in electronic applications. Most of them are made by chip and wire techniques…”
Get full text