Search Results - "Baraton, Xavier"

Mechanical characterization of next generation eWLB (embedded wafer level BGA) packaging by Yoon, S. W., Yaojian Lin, Gaurav, S., Yonggang Jin, Ganesh, V. P., Meyer, T., Marimuthu, P. C., Baraton, X., Bahr, A.

“…Integrated Circuits fabricated on silicon are assembled in different forms of electronic packages and are used extensively in electronic products such as…”
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Interface delamination analysis of TQFP package during solder reflow by Guojun, Hu, Rossi, Roberto, Jing-En, Luan, Baraton, Xavier

“…Interface delamination during solder reflow is a critical reliability problem for the plastic IC packages. The main objective of this study is to apply…”
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Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications by Tee, Tong Yan, Ng, Hun Shen, Yap, Daniel, Baraton, Xavier, Zhong, Zhaowei

“…For thin-profile fine-pitch BGA (TFBGA) packages, board level solder joint reliability during the thermal cycling test is a critical issue. In this paper, both…”
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Packaging trends in mobile electronics - Towards wafer level packaging by Baraton, Xavier

“…Mobile electronics growth has recently been supported by the integration of more features for higher end devices. Smart phones are indeed growing at much…”
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Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill by Tee, Tong Yan, Kho, Chek Lim, Yap, Daniel, Toh, Carol, Baraton, Xavier, Zhong, Zhaowei

“…In the flip-chip ball grid array (FCBGA) assembly process, no-flow underfill has the advantage over traditional capillary-flow underfill on shorter cycle time…”
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Opinion: Going green on bonds is best way to change behaviours by Baraton, Xavier

“…[...]it neither rewards nor punishes corporate behaviour whether investors own or exclude shares and bonds in their portfolios. The reality is that getting a…”
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Next generation eWLB (embedded wafer level BGA) packaging by Yonggang Jin, Baraton, X, Yoon, S W, Yaojian Lin, Marimuthu, P C, Ganesh, V P, Meyer, T, Bahr, A

“…Demand for wafer level packaging (WLP) is being driven by the need to shrink package size and height, simplify the supply chain and provide a lower overall…”
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Effect of silver content and nickel dopant on mechanical properties of Sn-Ag-based solders by Che, F.X., Luan, J.E., Baraton, X.

“…In this work, five solder materials of Sn-3.0Ag-0.5Cu (SAC305), Sn-2.0Ag-0.5Cu (SAC205), Sn-1.0Ag-0.5Cu (SAC105), Sn-1.0Ag-0.5Cu-0.05Ni (SAC105Ni0.05) and…”
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Development of advanced fan-out wafer level package (embedded Wafer Level BGA) packaging by Yonggang Jin, Teysseyre, J., Baraton, X., Yoon, S. W., Yaojian Lin, Marimuthu, P. C.

“…With reducing of silicon techno, the pitches and pads at the chip to package interface become important factor. This drives interconnection toward to fan-out…”
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Development and characterization of next generation eWLB (embedded Wafer Level BGA) packaging by Yonggang Jin, Teysseyre, J., Baraton, X., Yoon, S. W., Yaojian Lin, Marimuthu, P. C.

“…The shrinkage of the pitches and pads at the chip to package interface is happening much faster than the shrinkage at the package to board interface. This…”
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Characterization of silicon die strength with application to die crack analysis by Hu Guojun, Luan Jing-en, Baraton, Xavier

“…After encapsulation, thermo-mechanical deformation builds up within the electronic packages due to temperature coefficient of expansion mismatch between the…”
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Advanced packaging solutions of next generation eWLB technology by Yonggang Jin, Teysseyrex, J., Baraton, X., Yoon, S. W., Yaojian Lin, Marimuthu, P. C.

“…The shrinkage of the pitches and pads at the chip to package interface is happening much faster than the shrinkage at the package to board interface. This…”
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Analysis of interfacial delamination in IC packaging: Use stress or fracture mechanics? by Hu Guojun, Luan Jing-en, Baraton, X., Tay, A.

“…After encapsulation, thermo-mechanical deformation builds up within the electronic packages due to temperature coefficient of expansion mismatch between the…”
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Thermoelastic properties of printed circuit boards: Effect of copper trace by Hu Guojun, Goh Kim Yong, Luan Jing-en, Lim Wee Chin, Baraton, X.

“…After encapsulation, thermo-mechanical deformation builds up within the electronic packages due to coefficient of thermal expansion (CTE) mismatch between the…”
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Drop impact life model development for FBGA assembly with lead-free solder joint by Faxing Che, Jing-En Luan, Kim Yong Goh, Baraton, X.

“…Drop performance for fine-pitch ball grid array (FBGA) assembly is one important issue because FBGA is widely used in handheld electronic products in which the…”
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Thermal cycling fatigue model development for FBGA assembly with Sn-Ag-based lead-free solder by Fa-Xing Che, Jing-En Luan, Yap, Daniel, Kim-Yong Goh, Baraton, Xavier

“…With the increasing requirement for lead-free solders, it is desired to know how different solder alloys affect on reliability of microelectronic assembly…”
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Challenges for extra large embedded wafer level ball grid array development by Jing-en Luan, Yonggang Jin, Kim-yong Goh, Yiyi Ma, Guojun Hu, Yaohuang Huang, Baraton, X.

“…Fan-out embedded wafer level ball grid array (eWLB) is a very promising packaging technology with many advantages in comparison to standard ball grid array…”
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A novel methodology for virtual qualification of IC packages under board level drop test by Luan Jing-en, Kim-yong Goh, Baraton, X.

“…Board level drop test has become a key qualification test for portable electronic products in recent years. However, actual drop test and sample preparation…”
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Camera Module Design, Assembly and Test Challenges by Jing-en Luan, Baraton, X., Wingshenq Wong, Kim-yong Goh, Yap, D.

“…With the fast growth of mobile phone market, image sensor and camera module production have skyrocketed in recent years. Semiconductor industry has been put a…”
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Drop impact life prediction model for lead-free BGA packages and modules by Jing-en Luan, Tong Yan Tee, Kim Yong Goh, Hun Shen Ng, Baraton, X., Bronner, R., Sorrieul, M., Hussa, E., Reinikainen, T., Kujala, A.

“…System-in-package (SiP) such as multi-chip or stacked die BGA modules with wirebond, flip-chip or hybrid interconnect are getting popular for advanced…”
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