Search Results - "Bao, Nanbin"
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Anomalous mechanical strengthening of nanocomposite hydrogels upon swelling
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (01-01-2023)“…[Display omitted] •The bioinspired and universal swelling-strengthening strategy was developed.•The hydrogel shows remarkable increase in mechanical properties…”
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Room-temperature self-healing elastomer-graphene composite conducting wires with superior strength for stretchable electronics
Published in Composites science and technology (01-03-2022)“…Stretchable conductive materials are essential to realize wearable electronic devices, soft robotics, and implantable electronics. However, developing…”
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Silica hollow spheres-based superhydrophobic PDMS composite membrane for enhanced acetone permselective pervaporation
Published in Separation and purification technology (01-01-2023)“…[Display omitted] •Nanosized silica hollow spheres were synthesized by a template method.•Hydrophobically modified SHSs were incorporated into PDMS to…”
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Transparent, Mechanically Robust, Adhesive, Temperature-Tolerant, and 3D Printable Nanocomposite Ionogels for Flexible Sensors
Published in ACS applied materials & interfaces (08-11-2023)“…Ionogels are emerging as soft materials for flexible strain sensors. However, the integration of multiple functionalities into a single ionogel for diverse…”
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Multi-material 3D printed eutectogel microneedle patches integrated with fast customization and tunable drug delivery
Published in Journal of controlled release (01-04-2024)“…Microneedle patches are emerging multifunctional platforms for transdermal diagnostics and drug delivery. However, it still remains challenging to develop…”
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Instant strong adhesion of ultrafast gelling tough nanocomposite hydrogels for antifogging coatings and soft electronics
Published in Colloids and surfaces. A, Physicochemical and engineering aspects (05-11-2023)“…Tough hydrogels capable of achieving instant and strong adhesion to diverse surfaces are highly desirable for various applications such as soft electronics and…”
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