Search Results - "Baliga, B J"

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  1. 1

    Monolithically Integrated 4H-SiC MOSFET and JBS Diode (JBSFET) Using a Single Ohmic/Schottky Process Scheme by Woongje Sung, Baliga, B. J.

    Published in IEEE electron device letters (01-12-2016)
    “…This letter reports a new 900 V 4H-SiC JBSFET containing an MOSFET with an integrated JBS diode in the center area of the chip. Both MOSFET and JBS diode…”
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    Journal Article
  2. 2

    On Developing One-Chip Integration of 1.2 kV SiC MOSFET and JBS Diode (JBSFET) by Woongje Sung, Baliga, B. J.

    “…This paper presents the design, fabrication, and characterization of the SiC JBSFET (junction barrier Schottky (JBS) diode integrated MOSFET). The fabrication…”
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    Journal Article
  3. 3

    A New Edge Termination Technique for High-Voltage Devices in 4H-SiC-Multiple-Floating-Zone Junction Termination Extension by Woongje Sung, Van Brunt, E., Baliga, B. J., Huang, A. Q.

    Published in IEEE electron device letters (01-07-2011)
    “…A new edge termination method, referred to as multiple-floating-zone junction termination extension (MFZ-JTE), is presented for high-voltage devices in 4H-SiC…”
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    Journal Article
  4. 4

    Implant Straggle Impact on 1.2 kV SiC Power MOSFET Static and Dynamic Parameters by Agarwal, Aditi, Baliga, B. J.

    “…Significant impact of the ion-implant straggle of the P + shielding region on the static and dynamic characteristics of 1.2 kV 4H-SiC power MOSFETs is…”
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    Journal Article
  5. 5

    2.3 kV 4H-SiC Planar-Gate Accumulation Channel Power JBSFETs: Analysis of Experimental Data by Agarwal, Aditi, Baliga, B. J.

    “…Experimental results obtained for 2.3 kV SiC planar-gate power JBSFETs with different cell topologies are analyzed in this article using analytical models and…”
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    Journal Article
  6. 6

    Assessment of Linear, Hexagonal, and Octagonal Cell Topologies for 650 V 4H-SiC Inversion-Channel Planar-Gate Power JBSFETs Fabricated With 27 nm Gate Oxide Thickness by Agarwal, Aditi, Han, Kijeong, Baliga, B. J.

    “…A 27 nm gate oxide thickness has been successfully used for manufacturing high performance 650V 4H-SiC planar-gate, inversion-channel power JBSFETs in a 6-inch…”
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    Journal Article
  7. 7

    A Near Ideal Edge Termination Technique for 4500V 4H-SiC Devices: The Hybrid Junction Termination Extension by Woongje Sung, Baliga, B. J.

    Published in IEEE electron device letters (01-12-2016)
    “…This letter presents a new edge termination technique named a hybrid junction termination extension (Hybrid-JTE), which combines ring-assisted JTE and multiple…”
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    Journal Article
  8. 8

    A Novel 1.2 kV 4H-SiC Buffered-Gate (BG) MOSFET: Analysis and Experimental Results by Han, Kijeong, Baliga, B. J., Sung, Woongje

    Published in IEEE electron device letters (01-02-2018)
    “…A novel 1.2-kV-rated 4H-SiC buffered-gate MOSFET (BG-MOSFET) structure is proposed and experimentally demonstrated to have superior high frequency…”
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    Journal Article
  9. 9

    Comparison of Four Cell Topologies for 1.2-kV Accumulation- and Inversion-Channel 4H-SiC MOSFETs: Analysis and Experimental Results by Han, Kijeong, Baliga, B. J.

    Published in IEEE transactions on electron devices (01-05-2019)
    “…The electrical characteristics of 1.2-kV-rated 4H-SiC accumulation (Acc) and inversion (Inv) channel MOSFETs with linear, square, hexagonal, and octagonal cell…”
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    Journal Article
  10. 10

    Comprehensive Physics of Third Quadrant Characteristics for Accumulation- and Inversion-Channel 1.2-kV 4H-SiC MOSFETs by Han, Kijeong, Baliga, B. J.

    Published in IEEE transactions on electron devices (01-09-2019)
    “…Detailed physics of the third quadrant electrical characteristics of 1.2-kV rated 4H-SiC accumulation (Acc) and inversion (Inv) channel MOSFETs, based on…”
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    Journal Article
  11. 11

    The 1.2-kV 4H-SiC OCTFET: A New Cell Topology With Improved High-Frequency Figures-of-Merit by Han, Kijeong, Baliga, B. J.

    Published in IEEE electron device letters (01-02-2019)
    “…A 1.2 kV rated 4H-SiC OCTFET device with octagonal-cell topology is proposed and experimentally demonstrated for the first time. The device was first optimized…”
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    Journal Article
  12. 12

    Comparison of 2.3-kV 4H-SiC Accumulation-Channel Planar Power MOSFETs Fabricated With Linear, Square, Hexagonal, and Octagonal Cell Topologies by Agarwal, Aditi, Han, Kijeong, Baliga, B. J.

    Published in IEEE transactions on electron devices (01-09-2020)
    “…The performance of four cell topologies is compared for 2.3-kV 4H-SiC power MOSFETs fabricated in a commercial 6-in foundry. The devices were simultaneously…”
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    Journal Article
  13. 13

    650-V 4H-SiC Planar Inversion-Channel Power JBSFETs With 55-nm Gate Oxide: Relative Performance of Three Cell Types by Agarwal, Aditi, Han, Kijeong, Baliga, B. J.

    Published in IEEE transactions on electron devices (01-05-2021)
    “…Planar 650-V 4H-silicon carbide (SiC), inversion-channel, 55-nm gate oxide junction barrier Schottky field effect transistors (JBSFETs) with three types of…”
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    Journal Article
  14. 14

    Analytical Modeling of IGBTs: Challenges and Solutions by Baliga, B. J.

    Published in IEEE transactions on electron devices (01-02-2013)
    “…With the availability of advanced computing capability, it is fashionable to analyze and design insulated-gate bipolar transistors (IGBTs) using sophisticated…”
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    Journal Article
  15. 15

    Analysis and Experimental Quantification of 1.2-kV 4H-SiC Split-Gate Octagonal MOSFET by Han, Kijeong, Baliga, B. J.

    Published in IEEE electron device letters (01-07-2019)
    “…A 1.2-kV rated 4H-SiC split-gate octagonal cell MOSFET (SG-OCTFET) is proposed and successfully fabricated in a 6-in foundry for the first time. The measured…”
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    Journal Article
  16. 16

    Operation of 1.2-kV 4H-SiC Accumulation and Inversion Channel Split-Gate (SG) MOSFETs at Elevated Temperatures by Han, Kijeong, Baliga, B. J.

    Published in IEEE transactions on electron devices (01-08-2018)
    “…Numerical simulations, with experimental validation, have been used to demonstrate that the 1.2-kV-rated accumulation and inversion mode channel 4H-SiC…”
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    Journal Article
  17. 17

    1.2-kV 4H-SiC SenseFET With Monolithically Integrated Sensing Resistor by Han, Kijeong, Baliga, B. J.

    Published in IEEE electron device letters (01-03-2020)
    “…A 1.2 kV rated 4H-SiC SenseFET structure with monolithically integrated sensing resistor is proposed and experimentally demonstrated. The SenseFET was…”
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    Journal Article
  18. 18

    Comparison of 6H-SiC, 3C-SiC, and Si for power devices by Bhatnagar, M., Baliga, B.J.

    Published in IEEE transactions on electron devices (01-03-1993)
    “…The drift region properties of 6H- and 3C-SiC-based Schottky rectifiers and power MOSFETs that result in breakdown voltages from 50 to 5000 V are defined…”
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    Journal Article
  19. 19

    User-Programmable Short-Circuit Capability Enhancement for 1.2 kV Si IGBTs using a 40 V Si Enhancement-Mode MOSFET connected in Series with the Emitter by Kanale, Ajit, Baliga, B. J.

    “…Commercially available Si IGBTs are designed in two forms - i) optimized for low VCE,SAT but with poor SC ruggedness, and ii) optimized to achieve good…”
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    Conference Proceeding
  20. 20

    Design and fabrication of 1400V 4H-SiC accumulation mode MOSFETs (ACCUFETs) by Sung, Woongje, Baliga, B. J.

    “…Summary form only given. The complete presentation was not made available for publication as part of the conference proceedings. This paper presents design,…”
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    Conference Proceeding